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COMPLETETEARDOWNWITH:DetailedphotosPrecisemeasurementsMaterialsanalysisManufacturingprocessflowSupplychainevaluationManufacturingcostanalysisEstimatedsalespriceAppleiPhoneX–InfraredDotProjectorTitle:iPhoneX–IRDotProjectorPages:150+Date:December2017Format:PDF&ExcelfilePrice:Fullreport:EUR3,990Bundleoffer:AppleiPhoneXSpecialofferTheworld'smostadvanceddotprojectorfor3Dsensingwithfourinnovativeparts:Itspackage;adedicatedVCSEL;afoldedoptic;andtheactiveDOEcalled"Structuredlight"andusesasetofprojected"dots"untothefaceoftheuser.
Biometricfaceauthenticationallowsthescreentobeunlockedveryfast,andeliminatestheneedforfingeruse,enteringpasswordsorpatterns.
TheIRDotProjectoristhestructuredlightemitterofthe3Dcamerasystemcalled"TrueDepth"byApple,thatrecognisesusers.
Thisreportisfocusedontheilluminationmodulewhichincludes4innovativesub-parts:ItspackagingexploitsanovelthermalmanagementapproachwithceramicsubstrateinsertedItsNIRverticalcavitysurfaceemittinglaser(VCSEL)diodewithadedicatedlightemissionprofiledrivenbyaBroadcomintegratedcircuitAfoldedopticalpathusingwaferlevelopticItsactivediffractiveopticalelement(DOE)Thereportprovidesacompleteprocessreverseengineeringofthecomplexmodulewithadetailedanalysisofthesupplychain.
Thisreportdescribesthefullsystem'stechnologyandmanufacturingprocess,includingthepackage,VCSEL,electronics,thefoldedopticandtheDOE.
ItestimatesthemanufacturingcostandpricefortheDotProjectorandcomparesitwithother3Dsensors,suchasIntel'sRealSense,andthesensorpmdprovidesLenovo.
Applehasmadeagreattechnologychoicewithits3DfacialidentificationfortheiPhoneX.
Thenewtechnologyispresentedasbeing20timesmoreaccuratethantheolderfingerprintapproachwithaone-in-amillionprobabilityofarandompersonunlockingyouriPhone.
Theunderlying3DimagingtechnologyisTABLEOFCONTENTSPerformedbyAUTHORS:MEMSCoSim+ANALYSISPERFORMEDWITHOURCOSTINGTOOLSMEMSCOSIM+ANDICPRICE+SystemPlusConsultingofferspowerfulcostingtoolstoevaluatetheproductioncostandsellingprice.
MEMS&LEDCoSim+CostsimulationtooltoevaluatethecostofanyMEMS&LEDprocessesordevicefromsinglechiptocomplexstructures.
ICPrice+ThetoolperformsthenecessarycostsimulationofanyIntegratedCircuit:ASICs,microcontrollers,DSP,memories,smartpower,andmore.
Overview/IntroductionExecutiveSummaryReverseCostingMethodologyCompanyProfileHeptagon,LumentumApple3DTri-CameraSystemAppleiPhoneXTeardownPhysicalAnalysisOverviewofthePhysicalAnalysisPhysicalAnalysisMethodologyDotProjectorDotprojectorviewsanddimensionsDotprojectordisassembly:Lenses,activeDOE,NIRVCSEL,packagePackageView,dimensionsandmarkingCross-sectionProcesscharacteristicsNIRVCSELDieview,dimensionsandmarkingWirebondingandcavityCross-sectionProcesscharacteristicsFoldedOpticView,dimensionsandmarkingDisassemblyandmainblockidentificationLenscross-sectionSylvainHallereauSylvainisinchargeofcostinganalysesforIC,powerandMEMS.
Hehasmorethan10yearsofexperienceinpowerdevicemanufacturingcostanalysisandhasstudiedawiderangeoftechnologies.
tosetupitslaboratory.
Hepreviouslyworkedfor25yearsatAtmelNantesTechnologicalAnalysisLaboratoryasfabsupportinphysicalanalysis,andforthreeyearsatHirexEngineeringinToulouse,inadestructivephysicalanalysislab.
YvonLeGoff(Lab)YvonhasjoinedSystemPlusConsultingin2011ActiveDOEDOEdimensions,disassemblyandmainblockidentification,cross-sectionComparison:AppleDotProjector,IntelRealSense,pmd/InfineonManufacturingProcessFlowGlobalOverviewoftheDotProjectorNIRVCSELFront-EndProcessNIRVCSELWaferFabricationUnitFoldedOpticWaferProcessFlowFoldedOpticWaferFabricationUnitDOEWaferProcessFlowDOEWaferFabricationUnitPackageProcess&AssemblyUnitCostanalysisOverviewoftheCostAnalysisYieldsExplanationandHypothesesIntegratedCircuitCostNIRVCSELCostFoldedOpticCostDOEActiveCostPackageAssembly&TestCostDotProjectorCostEstimatedPriceAnalysisCompanyServicesICPrice+LEDCoSim+RELATEDREPORTSANNUALSUBSCRIPTIONOFFERYoucanchoosetobuyover12monthsasetof3,4,5,7,10or15ReverseCostingreports.
Upto47%discount!
MEMS&Sensors:Accelerometer-Compass-Display/Optics-Environment-Fingerprint-Gyroscope-IMU/Combo-Light-Microphone-Oscillator-PressuresensorPower:GaN-IGBT-MOSFET-SiDiode-SiCSystems:Automotive-Consumer-Energy-Medical-TelecomEachyearSystemPlusConsultingreleasesacomprehensivecollectionofnewreverseengineering&costinganalysesinvariousdomains.
Imaging:Infrared-VisibleIntegratedCircuits&RF:IntegratedCircuit(IC)-RFICLEDs:LEDLamp-UVLED-White/blueLEDPackaging:3DPackaging-Embedded-SIP-WLPMorethan60reportsreleasedeachyearonthefollowingtopics(consideredfor2017):SamsungGalaxyS8IrisScannerSTMicroelectronicsTimeofFlightProximitySensorintheAppleiPhone7PlusTexasInstruments'TimeofFlightImageSensorforIndustrialApplicationsWithsecondgenerationirisrecognition,Samsung'sS8ispositioningitsbiometricsolutionsashigh-techsecurity.
AlookinsidetheSinglePhotonAvalancheDiode(SPAD)fromSTMicroelectronicsenteringthehigh-endApplehandset.
AlookintoTexasInstruments'system-on-chip,includingSony/Softkinetic'sT-o-Fpixeltechnology,forindustrialappli-cations.
Pages:122Date:August2017Fullreport:EUR3,490*Pages:113Date:March2017Fullreport:EUR3,490*Pages:79Date:July2017Fullreport:EUR3,990*PerformedbyORDERFORMDELIVERYonreceiptofpayment:Bycreditcard:Number:Expirationdate:CardVerificationValue:Bybanktransfer:HSBC-CAE-LeTerminal-2rueduCharron-44800StHerblainFranceBICcode:CCFRFRPPInEURBankcode:30056-Branchcode:00955-Account:09550003234IBAN:FR7630056009550955000323439InUSDBankcode:30056-Branchcode:00955-Account:09550003247IBAN:FR7630056009550955000324797Returnorderby:FAX:+33253551059MAIL:SYSTEMPLUSCONSULTING21rueLaNouBrasdeFer44200Nantes–FranceContact:EMAIL:sales@systemplus.
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