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THS3001-DIEwww.
ti.
comSLOS812–AUGUST2012420-MHzHIGH-SPEEDCURRENT-FEEDBACKAMPLIFIERCheckforSamples:THS3001-DIE1FEATURESHighSpeed:EvaluationModuleAvailable–40-nsSettlingTime(0.
1%)APPLICATIONSHighOutputDriveCommunicationExcellentVideoPerformanceImagingLowInputOffsetVoltageHigh-QualityVideoVeryLowDistortionWideRangeofPowerSuppliesDESCRIPTIONTheTHS3001isahigh-speedcurrent-feedbackoperationalamplifier,idealforcommunication,imaging,andhigh-qualityvideoapplications.
Thisdeviceoffersaveryfastslewrate,bandwidth,andsettlingtimeforlarge-signalapplicationsrequiringexcellenttransientresponse.
Inaddition,theTHS3001operateswithaverylowdistortion,makingitwellsuitedforapplicationssuchaswirelesscommunicationbasestationsorultrafastADCorDACbuffers.
ORDERINGINFORMATION(1)PACKAGEPRODUCTPACKAGEORDERABLEPARTNUMBERPACKAGEQUANTITYDESIGNATORTHS3001TDA1360THS3001TDBareDieInWafflePack(2)THS3001TDA210(1)Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTIwebsiteatwww.
ti.
com.
(2)ProcessingispertheTexasInstrumentscommercialproductionbaselineandisincompliancewiththeTexasInstrumentsQualityControlSystemineffectatthetimeofmanufacture.
ElectricalscreeningconsistsofDCparametricandfunctionaltestingatroomtemperatureonly.
UnlessotherwisespecifiedbyTexasInstrumentsACperformanceandperformanceovertemperatureisnotwarranted.
VisualInspectionisperformedinaccordancewithMIL-STD-883TestMethod2010ConditionBat75Xminimum.
1Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
PRODUCTIONDATAinformationiscurrentasofpublicationdate.
Copyright2012,TexasInstrumentsIncorporatedProductsconformtospecificationsperthetermsoftheTexasInstrumentsstandardwarranty.
Productionprocessingdoesnotnecessarilyincludetestingofallparameters.
THS3001-DIESLOS812–AUGUST2012www.
ti.
comThisintegratedcircuitcanbedamagedbyESD.
TexasInstrumentsrecommendsthatallintegratedcircuitsbehandledwithappropriateprecautions.
Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.
Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
BAREDIEINFORMATIONBACKSIDEBONDPADBONDPADDIETHICKNESSBACKSIDEFINISHPOTENTIALMETALLIZATIONCOMPOSITIONTHICKNESS10.
5mils.
SiliconwithbackgrindFloatingTiW/AlSi(1%)Cu(0.
5%)1820nmTable1.
BondPadCoordinatesinMicronsDESCRIPTIONPADNUMBERXMINYMINXMAXYMAXIN-1128.
4587230688.
6IN+2128.
4327.
4230429VCC-3209.
2594.
9310.
85196.
5OUT4956.
2385.
851057.
8487.
45VCC+51022.
7692.
51124.
3794.
12SubmitDocumentationFeedbackCopyright2012,TexasInstrumentsIncorporatedProductFolderLinks:THS3001-DIEPACKAGEOPTIONADDENDUMwww.
ti.
com21-Aug-2012Addendum-Page1PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)Samples(RequiresLogin)THS3001TDA1ACTIVE0360TBDCallTIN/AforPkgTypeTHS3001TDA2ACTIVE010TBDCallTIN/AforPkgType(1)Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.
Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.
Samplesmayormaynotbeavailable.
OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.
ti.
com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.
TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.
1%byweightinhomogeneousmaterials.
Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.
ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.
1%byweightinhomogeneousmaterial)(3)MSL,PeakTemp.
--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.
TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.
Effortsareunderwaytobetterintegrateinformationfromthirdparties.
TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.
TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
IMPORTANTNOTICETexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46CandtodiscontinueanyproductorserviceperJESD48B.
Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.
Allsemiconductorproducts(alsoreferredtohereinas"components")aresoldsubjecttoTI'stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.
TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI'stermsandconditionsofsaleofsemiconductorproducts.
TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.
Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarilyperformed.
TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers'products.
BuyersareresponsiblefortheirproductsandapplicationsusingTIcomponents.
TominimizetherisksassociatedwithBuyers'productsandapplications,Buyersshouldprovideadequatedesignandoperatingsafeguards.
TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orotherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.
InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyorendorsementthereof.
Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.
ReproductionofsignificantportionsofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalterationandisaccompaniedbyallassociatedwarranties,conditions,limitations,andnotices.
TIisnotresponsibleorliableforsuchaltereddocumentation.
Informationofthirdpartiesmaybesubjecttoadditionalrestrictions.
ResaleofTIcomponentsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatcomponentorservicevoidsallexpressandanyimpliedwarrantiesfortheassociatedTIcomponentorserviceandisanunfairanddeceptivebusinesspractice.
TIisnotresponsibleorliableforanysuchstatements.
Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirementsconcerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybeprovidedbyTI.
Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhichanticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcauseharmandtakeappropriateremedialactions.
BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofanyTIcomponentsinsafety-criticalapplications.
Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.
Withsuchcomponents,TI'sgoalistohelpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsandrequirements.
Nonetheless,suchcomponentsaresubjecttotheseterms.
NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersofthepartieshaveexecutedaspecialagreementspecificallygoverningsuchuse.
OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor"enhancedplastic"aredesignedandintendedforuseinmilitary/aerospaceapplicationsorenvironments.
BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponentswhichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.
TIhasspecificallydesignatedcertaincomponentswhichmeetISO/TS16949requirements,mainlyforautomotiveuse.
Componentswhichhavenotbeensodesignatedareneitherdesignednorintendedforautomotiveuse;andTIwillnotberesponsibleforanyfailureofsuchcomponentstomeetsuchrequirements.
ProductsApplicationsAudiowww.
ti.
com/audioAutomotiveandTransportationwww.
ti.
com/automotiveAmplifiersamplifier.
ti.
comCommunicationsandTelecomwww.
ti.
com/communicationsDataConvertersdataconverter.
ti.
comComputersandPeripheralswww.
ti.
com/computersDLPProductswww.
dlp.
comConsumerElectronicswww.
ti.
com/consumer-appsDSPdsp.
ti.
comEnergyandLightingwww.
ti.
com/energyClocksandTimerswww.
ti.
com/clocksIndustrialwww.
ti.
com/industrialInterfaceinterface.
ti.
comMedicalwww.
ti.
com/medicalLogiclogic.
ti.
comSecuritywww.
ti.
com/securityPowerMgmtpower.
ti.
comSpace,AvionicsandDefensewww.
ti.
com/space-avionics-defenseMicrocontrollersmicrocontroller.
ti.
comVideoandImagingwww.
ti.
com/videoRFIDwww.
ti-rfid.
comOMAPMobileProcessorswww.
ti.
com/omapTIE2ECommunitye2e.
ti.
comWirelessConnectivitywww.
ti.
com/wirelessconnectivityMailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265Copyright2012,TexasInstrumentsIncorporated
ti.
comSLOS812–AUGUST2012420-MHzHIGH-SPEEDCURRENT-FEEDBACKAMPLIFIERCheckforSamples:THS3001-DIE1FEATURESHighSpeed:EvaluationModuleAvailable–40-nsSettlingTime(0.
1%)APPLICATIONSHighOutputDriveCommunicationExcellentVideoPerformanceImagingLowInputOffsetVoltageHigh-QualityVideoVeryLowDistortionWideRangeofPowerSuppliesDESCRIPTIONTheTHS3001isahigh-speedcurrent-feedbackoperationalamplifier,idealforcommunication,imaging,andhigh-qualityvideoapplications.
Thisdeviceoffersaveryfastslewrate,bandwidth,andsettlingtimeforlarge-signalapplicationsrequiringexcellenttransientresponse.
Inaddition,theTHS3001operateswithaverylowdistortion,makingitwellsuitedforapplicationssuchaswirelesscommunicationbasestationsorultrafastADCorDACbuffers.
ORDERINGINFORMATION(1)PACKAGEPRODUCTPACKAGEORDERABLEPARTNUMBERPACKAGEQUANTITYDESIGNATORTHS3001TDA1360THS3001TDBareDieInWafflePack(2)THS3001TDA210(1)Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTIwebsiteatwww.
ti.
com.
(2)ProcessingispertheTexasInstrumentscommercialproductionbaselineandisincompliancewiththeTexasInstrumentsQualityControlSystemineffectatthetimeofmanufacture.
ElectricalscreeningconsistsofDCparametricandfunctionaltestingatroomtemperatureonly.
UnlessotherwisespecifiedbyTexasInstrumentsACperformanceandperformanceovertemperatureisnotwarranted.
VisualInspectionisperformedinaccordancewithMIL-STD-883TestMethod2010ConditionBat75Xminimum.
1Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
PRODUCTIONDATAinformationiscurrentasofpublicationdate.
Copyright2012,TexasInstrumentsIncorporatedProductsconformtospecificationsperthetermsoftheTexasInstrumentsstandardwarranty.
Productionprocessingdoesnotnecessarilyincludetestingofallparameters.
THS3001-DIESLOS812–AUGUST2012www.
ti.
comThisintegratedcircuitcanbedamagedbyESD.
TexasInstrumentsrecommendsthatallintegratedcircuitsbehandledwithappropriateprecautions.
Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.
Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
BAREDIEINFORMATIONBACKSIDEBONDPADBONDPADDIETHICKNESSBACKSIDEFINISHPOTENTIALMETALLIZATIONCOMPOSITIONTHICKNESS10.
5mils.
SiliconwithbackgrindFloatingTiW/AlSi(1%)Cu(0.
5%)1820nmTable1.
BondPadCoordinatesinMicronsDESCRIPTIONPADNUMBERXMINYMINXMAXYMAXIN-1128.
4587230688.
6IN+2128.
4327.
4230429VCC-3209.
2594.
9310.
85196.
5OUT4956.
2385.
851057.
8487.
45VCC+51022.
7692.
51124.
3794.
12SubmitDocumentationFeedbackCopyright2012,TexasInstrumentsIncorporatedProductFolderLinks:THS3001-DIEPACKAGEOPTIONADDENDUMwww.
ti.
com21-Aug-2012Addendum-Page1PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)Samples(RequiresLogin)THS3001TDA1ACTIVE0360TBDCallTIN/AforPkgTypeTHS3001TDA2ACTIVE010TBDCallTIN/AforPkgType(1)Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.
Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.
Samplesmayormaynotbeavailable.
OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.
ti.
com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.
TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.
1%byweightinhomogeneousmaterials.
Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.
ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.
1%byweightinhomogeneousmaterial)(3)MSL,PeakTemp.
--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.
TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.
Effortsareunderwaytobetterintegrateinformationfromthirdparties.
TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.
TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
IMPORTANTNOTICETexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46CandtodiscontinueanyproductorserviceperJESD48B.
Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.
Allsemiconductorproducts(alsoreferredtohereinas"components")aresoldsubjecttoTI'stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.
TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI'stermsandconditionsofsaleofsemiconductorproducts.
TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.
Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarilyperformed.
TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers'products.
BuyersareresponsiblefortheirproductsandapplicationsusingTIcomponents.
TominimizetherisksassociatedwithBuyers'productsandapplications,Buyersshouldprovideadequatedesignandoperatingsafeguards.
TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orotherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.
InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyorendorsementthereof.
Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.
ReproductionofsignificantportionsofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalterationandisaccompaniedbyallassociatedwarranties,conditions,limitations,andnotices.
TIisnotresponsibleorliableforsuchaltereddocumentation.
Informationofthirdpartiesmaybesubjecttoadditionalrestrictions.
ResaleofTIcomponentsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatcomponentorservicevoidsallexpressandanyimpliedwarrantiesfortheassociatedTIcomponentorserviceandisanunfairanddeceptivebusinesspractice.
TIisnotresponsibleorliableforanysuchstatements.
Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirementsconcerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybeprovidedbyTI.
Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhichanticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcauseharmandtakeappropriateremedialactions.
BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofanyTIcomponentsinsafety-criticalapplications.
Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.
Withsuchcomponents,TI'sgoalistohelpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsandrequirements.
Nonetheless,suchcomponentsaresubjecttotheseterms.
NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersofthepartieshaveexecutedaspecialagreementspecificallygoverningsuchuse.
OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor"enhancedplastic"aredesignedandintendedforuseinmilitary/aerospaceapplicationsorenvironments.
BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponentswhichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.
TIhasspecificallydesignatedcertaincomponentswhichmeetISO/TS16949requirements,mainlyforautomotiveuse.
Componentswhichhavenotbeensodesignatedareneitherdesignednorintendedforautomotiveuse;andTIwillnotberesponsibleforanyfailureofsuchcomponentstomeetsuchrequirements.
ProductsApplicationsAudiowww.
ti.
com/audioAutomotiveandTransportationwww.
ti.
com/automotiveAmplifiersamplifier.
ti.
comCommunicationsandTelecomwww.
ti.
com/communicationsDataConvertersdataconverter.
ti.
comComputersandPeripheralswww.
ti.
com/computersDLPProductswww.
dlp.
comConsumerElectronicswww.
ti.
com/consumer-appsDSPdsp.
ti.
comEnergyandLightingwww.
ti.
com/energyClocksandTimerswww.
ti.
com/clocksIndustrialwww.
ti.
com/industrialInterfaceinterface.
ti.
comMedicalwww.
ti.
com/medicalLogiclogic.
ti.
comSecuritywww.
ti.
com/securityPowerMgmtpower.
ti.
comSpace,AvionicsandDefensewww.
ti.
com/space-avionics-defenseMicrocontrollersmicrocontroller.
ti.
comVideoandImagingwww.
ti.
com/videoRFIDwww.
ti-rfid.
comOMAPMobileProcessorswww.
ti.
com/omapTIE2ECommunitye2e.
ti.
comWirelessConnectivitywww.
ti.
com/wirelessconnectivityMailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265Copyright2012,TexasInstrumentsIncorporated
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