ECC2019-准系统-新产品彩页-双路高密度服务器-英

微软服务器系统  时间:2021-05-08  阅读:()

High Performance Architecture

Optimized Modular Design

Flexible Storage Configuration”s

Optional SAS HBASolution

Support SAS HBAor RAID features on traditional storage devices via sideadapter or PCIe slot

Intel l igent System Management

Massive Memory SupportsEuapchponrtosd1eTsBupports 16x DDR4 DIMM Slot, including RDIMM maximum capacity supports 512GB and LRDIMM maximum capacity

Versati le I/O Interface

Energy Saving for Green

Model SY202-D12RS SY202-D12RFS SY202-D24RS SY202-D24RFS

Storage Drives Upto12x3 5” SAS30/SATA30HDDs(25” compatible) Upto24x25” SAS30/SATA30HDDs

Network 2xIntel®i350-BT21GbELAN I2nxteInl®tel8®25i395901-0BTG2bE1SGFbPE+LALANN2x 2xIntel®i350-BT21GbELAN I2nxteInl®tel8®25i395901-0BTG2bE1GFbPE+LALANN2xSystemNode Support2xhot-swappablesupporthigh performancecomputingnode

CPU Maximum2xIntel®E52600V3/V4Processorpernode

Memory Upto512GBDDR4-2133/2400ECCRDIMM and1024GECC-LRDIMMvia 16xDIMMspernode

PowerSupply 1600W1+1 RedundantCRPS(80+Platinum)PSU module,optional forDC240V

System Dimension 299” *1763” *346” (D*W*H) System Dimension NetWeight:19 kgs;GrossWeight:22 kgs

MBModel G1DCN-B

CPUType Intel®Xeon®ProcessorE5-2600V3/V4series  SocketR3(LGA2011)upto145WCPU

Chipset Intel®PCHWel lsBurgC612Chipset DIMMQuantity 16x288pinDDR4DIMMslots

DIMM Type Capacity:Upto 512GB DDR4-2133/2400 ECCRDIMM and 1024G ECC-LRDIMM Type:8GB,16GB,32GBand64GBcapacityBui ld-inRAID Intel®RSTeSupportsoftwareRAID0,1,10&5 BMC AspeedAST2400

IPMI ISPuMpIp2or0twfoitrhInvteirtl luigael nmtePdlaiatfovrmerMLAaNnaagnedmKeVnMtIonvterfaLAceNv2su0pportASPEED AST2400 BMC

PCI-E Support2xPCIeSlots

USB 2xUSB30 DOM Support1xSATADOMpowerconnector

PowerModule 2x1+1 redundantPSU

PowerEfficiency CRPS 1600Wmodule 80+Gold,optional240VDCmodule

PowerInput/Output ACInput:200~240VACfor1600W)  DCOutput  +12V_SB,+12V

FanQuantity Upto4x8038, supportPWMsmartfancontrol FanSpeed Maximum9000RPM

O eratin S stem Windows Server2008 R2 64bit Windows SBS 2011 64bit Windows Server2012 2012 R2 64bitSVirtual ization System Support VMWare ESXi (Target)  Microsoft Hyper-V(Target) Citrix Xen Server (Target)  Linux Kernel Virtual Machine(Target)

Temperature Op 10℃~35℃NON-OP  -40℃~70℃ Humidity OP  35%~80%;NON-OP  20%~90%

Certifications CEROHS

High Performance Architecture

Optimized Modular Design

Flexible Storage Configuration”s

Optional SAS HBASolution

Support SAS HBAor RAID features on traditional storage devices via sideadapter or PCIe slot

Intel l igent System Management

Massive Memory SupportsEuapchponrtosd1eTsBupports 16x DDR4 DIMM Slot, including RDIMM maximum capacity supports 512GB and LRDIMM maximum capacity

Versati le I/O Interface

Energy Saving for Green

M d l Y2 4-D12R Y2 4-D12RF Y2 4-D24R Y2 4-D24RFo e S 0 S” S 0” S S 0 S” S 0 S

Storage Drives Upto12x3 5 SAS30/SATA30HDDs (25 compatible) Upto24x25 SAS30/SATA30HDDs

Network 2xIntel®i350-BT21GbELAN I2nxteInl®tel8®25i395901-0BTG2bE1GSFbPE+LALANN2x 2xIntel®i350-BT21GbELAN I2nxteInl®tel8®25i395901-0BTG2bE1SGFbPE+LALANN2xSystemNode Support4xhot-swappable supporthigh performance computingnode

CPU Maximum2xIntel®E52600V3/V4Processorpernode

Memory Upto512GBDDR4-2133/2400 ECCRDIMM and1024GECC-LRDIMMvia 16xDIMMspernode

PowerSupply 1600”W*1+1 R”ed*unda”ntCR*PS*(80+Platinum)PSU module,optional forDC240V

System Dimension 299 1763 346 (D W H) System Dimension NetWeight:22 kgs;GrossWeight:25 kgsMBM d l G1DCN-B G1DCN-BF G1DCN-B G1DCN-BF

CPUType Intel®Xeon®ProcessorE5-2600V3/V4series  SocketR3(LGA2011)upto145WCPU

Chipset Intel®PCHWel lsBurgC612Chipset

DIMMQuantity 16x288pinDDR4DIMMslots

DIMM Type Capacity:Upto 512GB DDR4-2133/2400 ECCRDIMM and 1024G ECC-LRDIMM Type:8GB,16GB,32GBand64GBcapacityBui ld-in RAID Intel®RSTe Supportsoftware RAID0,1,10&5

BMC AspeedAST2400

IPMI ISPuMpIp2or0twfoitrhInvteirtl luigael nmtePdlaiatfovrmerMLAaNnaagnedmKeVnMtIonvterfaLAceNv2su0pportASPEED AST2400 BMC

PCI-E Support2xPCIeSlots

USB 2xUSB30 DOM Support1xSATADOMpowerconnector

PowerModule 2x1+1 redundantPSU

PowerEfficiency CRPS 1600Wmodule 80+Gold,optional240VDCmodule

PowerInput/Output ACInput:200~240VACfor1600W)  DCOutput  +12V_SB,+12V

F tit U t 4 8038 tPWM tf t lanQuan y p o x , suppor smar ancon ro

FanSpeed Maximum9000RPM

O ti S t Wi d S 2008R2 64bit Wi d SBS2011 64bit Wi d S 2012 2012R2 64bitSuppepraortng ys em RednhaotwEsnterpverisre LinuxS(erver)(32bit/n64obwits)  Suse Ent(erpris)eLinunxSoewrsvere(r3v2ebr it/64b/it)  Ubu(ntu Se)rve

Temperature Op 10℃~35℃NON-OP  -40℃~70℃ Humidity OP  35%~80%;NON-OP  20%~90%

Certifications CEROHS

TExtremedly HdiglhdPi e2Urformf adncdek

-scale networkapplications The pe,rformance is several times grea,terthan thetraditional 2U rackse,rver

Tmhoeduplraordduecstigisn fisultlyo emaoseduthlaer mdaesinigtenn,aincelu,dminagximcoiznetrtohlelerelmiaobdi luitlyaro,fI/thOe smyesztezamn, iannedmaolsdoutlhe,e mcoodluinlagrphearfrodrmdarivnec,e pwoitwheernseurpgpylysavminogdule The

Flexible Storage Configurations

SYSD20s2+-1D2x0RSA-NTAV3/0SYH2D0D2-sD20RF-NV: Each node supports 4 NVMe U 2 SSDs+ 6x SATA30 HDDs;The system supports a total of 8x NVMe U 2

Optional SAS HBASolution

SupportSAS HBAorRAID features on traditional storage devicesvia side adapterorPCIe slot

Intel l igent System Man-a-gement

Mhassive Memory Sl uplport

Eac nodesupports16x DDR4DIMM Sot, incuding RDIMM maximumcapacitysupports 512GB and LRDIMM maximumcapacitysupports 1TBVersati le I/O Interface

1E0quGipigpaebditwbiythRaJ4w5eoarltthwof1I/0OGsigearvbiciteEsthinetrenrefatcSeF,Pe+ach single node default support 2x Gigabit network interface(which can be upgraded to two

Tphoewseyrsctoenmsumsepsti1o+n1aCnRdPtSherecdousntsdoafntopoewraetirosnupply,80+ Platinum certification,up to 96%power conversion efficiency,greatly r educing system

Model SY202-D12R-NV SY202-D12RF-NV SY202-D20R-NV SY202-D20RF-NVStorage Drives SUApTtAo38x0NHVDMDse U2+4x3 5” SATA30HDD,or12x25” Upto8xNVMe U2+12x25” SATA30HDDs

Network 2xIntel®i350-BT21GbELAN I2nxteInl®tel8®25i395901-0BTG2bE1SGFbPE+LALANN2x 2xIntel®i350-BT21GbELAN I2nxteInl®tel8®25i395901-0BTG2bE1SGFbPE+LALANN2xSystemNode Support2xhot-swappablesupporthigh performancecomputingnode

CPU Maximum2xIntel®E52600V3/V4Processorpernode

Memory Upto512GBDDR4-2133/2400ECCRDIMM and1024GECC-LRDIMMvia 16xDIMMspernode

PowerSupply 1600”W*1+1 R”ed*unda”ntCR*PS*(80+Platinum)PSU module,optional forDC240V

SystemDimension 299 1763 346 (DWH)

System Dimension NetWeight:19 kgs;GrossWeight:22 kgs

-MBModel G1DCN B

CPUType Intel®Xeon®ProcessorE5-2600V3/V4series  SocketR3(LGA2011)upto145WCPU

Chipset Intel®PCHWel lsBurgC612Chipset DIMMQuantity 16x288pinDDR4DIMMslots

DIMM Type Capacity:Upto 512GB DDR4-2133/2400 ECCRDIMM and 1024G ECC-LRDIMM Type:8GB,16GB,32GBand64GBcapacityBui ld-in RAID Intel®RSTe Supportsoftware RAID0,1,10&5

BMC AspeedAST2400

IPMI ISPuMpIp2or0twfoitrhInvteirtl luigael mntePdlaiatfovrmerMLAaNnaagnedmKeVnMtIonvterfaLAceNvs2u0pportASPEED AST2400 BMC

PCI-E Support2xPCIeSlots

USB 2xUSB30 DOM Support1xSATADOMpowerconnector

PowerModule 2x1+1 redundantPSU

PowerEfficiency CRPS 1600Wmodule 80+Gold,optional240VDCmodule

PowerInput/Output ACInput:200~240VACfor1600W)  DCOutput  +12V_SB,+12V

F tit U t 4 8038 tPWM tf t l F S d M i 9000RPManQuan y p o x , suppor smar ancon ro an pee axmum

OSuppepraotritng System WReidndhaotwEsnSterpverisre20L0in8uxR2S(e6r4vbeirt)(32Wbitin6d4obwits)SBSSu2se01E1nt(e6r4pbrits)eLiWnuinxdSoewrvseSre(3rv2ebrit2/0412b/it2)012URb2un(6u4bSiet)rve

Virtual ization System Support VMWare ESXi (Target)  Microsoft Hyper-V(Target)  Citrix Xen Server (Target)  Linux Kernel Virtual Machine(Target)T t O 10℃~35℃ NON-OP -40℃~70℃ H idit OP 35%~80% NON-OP 20%~90%emperaure p   um y  ; 

Certifications CCCFCCCEROHS

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