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ULN2003LVZHCS846B–APRIL2012–REVISEDJUNE2015ULN2003LV7通通道道中中继继和和电电感感负负载载灌灌电电流流驱驱动动器器1特特性性3说说明明17通道高灌电流驱动器ULN2003LV是一款针对TI生产的广受欢迎的ULN2003系列7通道达灵顿(Darlington)复合晶体管支持高达8V的输出上拉电压阵列的低压和低功耗升级产品.
ULN2003LV下沉式支持3V至5V的宽范围中继和电感线圈驱动器特有7个低输出阻抗驱动器以支持低压中继和0.
4V(典型值)的低输出VOL电感线圈应用.
低阻抗驱动器大大降低了片上功耗;–在3.
3V的逻辑输入上,每通道具有100mA(典型值)的电流吸收能力(1)对于典型3V中继,功率耗散低了多达5倍.
–在5.
0V的逻辑输入上,每通道具有140mAULN2003LV驱动器与相似封装内的ULN2003系列器(典型值)的电流吸收能力(1)件引脚到引脚兼容.
与3.
3V和5.
0V微控制器和逻辑接口兼容ULN2003LV支持3.
3V至5VCMOS逻辑输入接口,用于电感反冲保护的内部续流二极管从而使得此器件与大范围的微控制器和其它逻辑接口兼输入下拉电阻可实现三态输入驱动器容.
ULN2003LV特有一个改进的输入接口,此接口用来消除嘈杂环境中寄生运行的输入电阻电容(RC)可以大大降低取自外部驱动器的输入DC电流.
缓冲器ULN2003LV特有一个输入RC缓冲器,此缓冲器能够低输入和输出泄漏电流极大地改进此器件在嘈杂运行条件下的性能.
易于使用的并行接口ULN2003LV通道输入特有一个内部输入下拉电阻器从静电放电(ESD)保护性能超过JESD22规范要求而可实现三态输入逻辑.
ULN2003LV也可以支持其–2kV人体放电模式(HBM),500V组件充电模式他逻辑输入电平,例如TTL和1.
8V,相关详细信息请(CDM)参见ApplicationInformation部分.
采用16引脚小外形尺寸集成电路(SOIC)和薄型小外形尺寸(TSSOP)封装ULN2003LV通过将几条相邻的并联通道相组合来提供(1)总灌电流可能会受到内部结温、绝对最大电流等的限制-详细增加电流吸收能力的灵活性.
在通常情况下,当所有信息请参见电气规范部分.
7个通道并联时,ULN2003LV能够支持高达1.
0A的负载电流.
此外,ULN2003LV还可用于各类需要灌2应应用用电流驱动器的应用,例如驱动LED和逻辑电平转换.
在多种电信、消费类、和工业应用中的中继和电感负载驱动器器器件件信信息息(1)照明灯和LED显示器器件件型型号号封封装装封封装装尺尺寸寸((标标称称值值))逻辑电平转换器ULN2003LVDRSOIC(16)3.
90mmx9.
90mmULN2003LVPWRTSSOP(16)4.
40mmx5.
00mm(1)要了解所有可用封装,请见数据表末尾的可订购产品附录.
简简化化功功能能图图1AnIMPORTANTNOTICEattheendofthisdatasheetaddressesavailability,warranty,changes,useinsafety-criticalapplications,intellectualpropertymattersandotherimportantdisclaimers.
PRODUCTIONDATA.
EnglishDataSheet:SLRS059ULN2003LVZHCS846B–APRIL2012–REVISEDJUNE2015www.
ti.
com.
cn目目录录7.
4DeviceFunctionalModes.
91特特性性.
18ApplicationandImplementation102应应用用.
18.
1ApplicationInformation.
103说说明明.
18.
2TypicalApplication104修修订订历历史史记记录录28.
3SystemExamples125PinConfigurationandFunctions.
39PowerSupplyRecommendations.
166Specifications.
410Layout.
166.
1AbsoluteMaximumRatings410.
1LayoutGuidelines166.
2ESDRatings410.
2LayoutExample166.
3RecommendedOperatingConditions.
410.
3On-ChipPowerDissipation.
166.
4ThermalInformation410.
4ThermalConsiderations.
176.
5ElectricalCharacteristics.
511器器件件和和文文档档支支持持186.
6SwitchingCharacteristics.
611.
1社区资源.
186.
7DissipationRatings611.
2商标.
186.
8TypicalCharacteristics.
711.
3静电放电警告.
187DetailedDescription811.
4Glossary.
187.
1Overview812机机械械、、封封装装和和可可订订购购信信息息.
187.
2FunctionalBlockDiagram87.
3FeatureDescription84修修订订历历史史记记录录NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion.
ChangesfromRevisionA(April2012)toRevisionBPage已添加引脚配置和功能部分,ESD额定值表,特性描述部分,器件功能模式,应用和实施部分,电源相关建议部分,布局部分,器件和文档支持部分以及机械、封装和可订购信息部分.
12Copyright2012–2015,TexasInstrumentsIncorporatedULN2003LVwww.
ti.
com.
cnZHCS846B–APRIL2012–REVISEDJUNE20155PinConfigurationandFunctionsDorPWPackage16-PinSOICorTSSOPTopViewPinFunctionsPINTYPEDESCRIPTIONNAMENO.
IN11InputIN22InputIN33InputIN44InputLogicInputPinsIN1throughIN7IN55InputIN66InputIN77InputGND8GroundGroundReferencePinCOM9OutputInternalFree-WheelingDiodeCommonCathodePinOUT710OutputOUT611OutputOUT512OutputOUT413OutputChannelOutputPinsOUT7throughOUT1OUT314OutputOUT215OutputOUT116OutputCopyright2012–2015,TexasInstrumentsIncorporated3ULN2003LVZHCS846B–APRIL2012–REVISEDJUNE2015www.
ti.
com.
cn6Specifications6.
1AbsoluteMaximumRatingsSpecifiedatTJ=–40°Cto125°Cunlessotherwisenoted.
(1)MINMAXUNITVINPinsIN1-IN7toGNDvoltage–0.
35.
5VVOUTPinsOUT1–OUT7toGNDvoltage8VVCOMPinCOMtoGNDvoltage8VMaximumGND-pincontinuouscurrent(TJ>+125°C)700mAIGNDMaximumGND-pincontinuouscurrent(TJVIH).
Figure12.
ULN2003LVasaNORdriver14Copyright2012–2015,TexasInstrumentsIncorporatedULN2003LVwww.
ti.
com.
cnZHCS846B–APRIL2012–REVISEDJUNE2015SystemExamples(continued)8.
3.
51.
8-VRelayDriverTodrivelowervoltagerelays,like1.
8V,connecttwoormoreadjacentchannelsinparallelasshowninFigure13.
ConnectingseveralchannelsinparallellowersthechanneloutputresistanceandthusminimizesVOLforafixedcurrent.
Figure13.
ULN2003LVDriving1.
8VRelaysCopyright2012–2015,TexasInstrumentsIncorporated15ULN2003LVZHCS846B–APRIL2012–REVISEDJUNE2015www.
ti.
com.
cn9PowerSupplyRecommendationsTheCOMpinisthepowersupplypinofthisdevicetopowerthegatedrivecircuitry.
Althoughnotrequiredbutdependingonthepowersupply,TIrecommendstoputabypasscapacitorof100nFacrosstheVcompinandGnd.
10Layout10.
1LayoutGuidelinesThintracescanbeusedontheinputduetothelowcurrentlogicthatistypicallyusedtodriveULN2003LV.
Takecaretoseparatetheinputchannelsasmuchaspossible,astoeliminatecross-talk.
Thicktracesarerecommendedfortheoutput,inordertodrivehighcurrentsthatmaybeneeded.
Wirethicknesscanbedeterminedbythetracematerial'scurrentdensityanddesireddrivecurrent.
Sinceallofthechannelscurrentsreturntoacommonground,itisbesttosizethattracewidthtobeverywide.
Someapplicationsrequireupto1A.
10.
2LayoutExampleFigure14.
LayoutExampleRecommendation10.
3On-ChipPowerDissipationUseEquation3tocalculateULN2003LVon-chippowerdissipationPD:whereNisthenumberofchannelsactivetogether.
VOLiistheOUTipinvoltagefortheloadcurrentILi.
(3)16Copyright2012–2015,TexasInstrumentsIncorporatedULN2003LVwww.
ti.
com.
cnZHCS846B–APRIL2012–REVISEDJUNE201510.
4ThermalConsiderationsTIrecommendstolimitULN2003LVIC'sdiejunctiontemperaturetolessthan125°C.
TheICjunctiontemperatureisdirectlyproportionaltotheon-chippowerdissipation.
Usethefollowingequationtocalculatethemaximumallowableon-chippowerdissipationforatargetICjunctiontemperature:whereTJ(MAX)isthetargetmaximumjunctiontemperature.
TAistheoperatingambienttemperature.
RθJAisthepackagejunctiontoambientthermalresistance.
(4)10.
4.
1ImprovingPackageThermalPerformanceThepackageRθJAvalueunderstandardconditionsonaHigh-KboardislistedintheDissipationRatings.
RθJAvaluedependsonthePCBlayout.
Anexternalheatsinkand/oracoolingmechanism,likeacoldairfan,canhelpreduceRθJAandthusimprovedevicethermalcapabilities.
RefertoTI'sdesignsupportwebpageatwww.
ti.
com/thermalforageneralguidanceonimprovingdevicethermalperformance.
版权2012–2015,TexasInstrumentsIncorporated17ULN2003LVZHCS846B–APRIL2012–REVISEDJUNE2015www.
ti.
com.
cn11器器件件和和文文档档支支持持11.
1社社区区资资源源ThefollowinglinksconnecttoTIcommunityresources.
Linkedcontentsareprovided"ASIS"bytherespectivecontributors.
TheydonotconstituteTIspecificationsanddonotnecessarilyreflectTI'sviews;seeTI'sTermsofUse.
TIE2EOnlineCommunityTI'sEngineer-to-Engineer(E2E)Community.
Createdtofostercollaborationamongengineers.
Ate2e.
ti.
com,youcanaskquestions,shareknowledge,exploreideasandhelpsolveproblemswithfellowengineers.
DesignSupportTI'sDesignSupportQuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsandcontactinformationfortechnicalsupport.
11.
2商商标标E2EisatrademarkofTexasInstruments.
Allothertrademarksarethepropertyoftheirrespectiveowners.
11.
3静静电电放放电电警警告告这些装置包含有限的内置ESD保护.
存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止MOS门极遭受静电损伤.
11.
4GlossarySLYZ022—TIGlossary.
Thisglossarylistsandexplainsterms,acronyms,anddefinitions.
12机机械械、、封封装装和和可可订订购购信信息息以下页中包括机械、封装和可订购信息.
这些信息是针对指定器件可提供的最新数据.
这些数据会在无通知且不对本文档进行修订的情况下发生改变.
欲获得该数据表的浏览器版本,请查阅左侧的导航栏.
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客户在下订单前应获取最新的相关信息,并验证这些信息是否完整且是最新的.
所有产品的销售都遵循在订单确认时所提供的TI销售条款与条件.
TI保证其所销售的组件的性能符合产品销售时TI半导体产品销售条件与条款的适用规范.
仅在TI保证的范围内,且TI认为有必要时才会使用测试或其它质量控制技术.
除非适用法律做出了硬性规定,否则没有必要对每种组件的所有参数进行测试.
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deyisupport.
comIMPORTANTNOTICE邮寄地址:上海市浦东新区世纪大道1568号,中建大厦32楼邮政编码:200122Copyright2015,德州仪器半导体技术(上海)有限公司PACKAGEOPTIONADDENDUMwww.
ti.
com10-Dec-2020Addendum-Page1PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Leadfinish/Ballmaterial(6)MSLPeakTemp(3)OpTemp(°C)DeviceMarking(4/5)SamplesULN2003LVDRACTIVESOICD162500RoHS&GreenSNLevel-1-260C-UNLIM-40to85UN2003LVULN2003LVPWRACTIVETSSOPPW162000RoHS&GreenSNLevel-1-260C-UNLIM-40to85UN2003LV(1)Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.
Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.
Samplesmayormaynotbeavailable.
OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)RoHS:TIdefines"RoHS"tomeansemiconductorproductsthatarecompliantwiththecurrentEURoHSrequirementsforall10RoHSsubstances,includingtherequirementthatRoHSsubstancedonotexceed0.
1%byweightinhomogeneousmaterials.
Wheredesignedtobesolderedathightemperatures,"RoHS"productsaresuitableforuseinspecifiedlead-freeprocesses.
TImayreferencethesetypesofproductsas"Pb-Free".
RoHSExempt:TIdefines"RoHSExempt"tomeanproductsthatcontainleadbutarecompliantwithEURoHSpursuanttoaspecificEURoHSexemption.
Green:TIdefines"Green"tomeanthecontentofChlorine(Cl)andBromine(Br)basedflameretardantsmeetJS709Blowhalogenrequirementsof<=1000ppmthreshold.
Antimonytrioxidebasedflameretardantsmustalsomeetthe<=1000ppmthresholdrequirement.
(3)MSL,PeakTemp.
-TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
(4)Theremaybeadditionalmarking,whichrelatestothelogo,thelottracecodeinformation,ortheenvironmentalcategoryonthedevice.
(5)MultipleDeviceMarkingswillbeinsideparentheses.
OnlyoneDeviceMarkingcontainedinparenthesesandseparatedbya"~"willappearonadevice.
IfalineisindentedthenitisacontinuationofthepreviouslineandthetwocombinedrepresenttheentireDeviceMarkingforthatdevice.
(6)Leadfinish/Ballmaterial-OrderableDevicesmayhavemultiplematerialfinishoptions.
Finishoptionsareseparatedbyaverticalruledline.
Leadfinish/Ballmaterialvaluesmaywraptotwolinesifthefinishvalueexceedsthemaximumcolumnwidth.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.
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InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
PACKAGEOPTIONADDENDUMwww.
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016.
86.
510.
32.
18.
016.
0Q1ULN2003LVPWRTSSOPPW162000330.
012.
46.
95.
61.
68.
012.
0Q1PACKAGEMATERIALSINFORMATIONwww.
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0364.
027.
0ULN2003LVPWRTSSOPPW162000364.
0364.
027.
0PACKAGEMATERIALSINFORMATIONwww.
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comPACKAGEOUTLINEC14X0.
652X4.
5516X0.
300.
19TYP6.
66.
21.
2MAX0.
150.
050.
25GAGEPLANE-80BNOTE44.
54.
3ANOTE35.
14.
90.
750.
50(0.
15)TYPTSSOP-1.
2mmmaxheightPW0016ASMALLOUTLINEPACKAGE4220204/A02/2017189160.
1CABPIN1INDEXAREASEEDETAILA0.
1CNOTES:1.
Alllineardimensionsareinmillimeters.
Anydimensionsinparenthesisareforreferenceonly.
DimensioningandtolerancingperASMEY14.
5M.
2.
Thisdrawingissubjecttochangewithoutnotice.
3.
Thisdimensiondoesnotincludemoldflash,protrusions,orgateburrs.
Moldflash,protrusions,orgateburrsshallnotexceed0.
15mmperside.
4.
Thisdimensiondoesnotincludeinterleadflash.
Interleadflashshallnotexceed0.
25mmperside.
5.
ReferenceJEDECregistrationMO-153.
SEATINGPLANEA20DETAILATYPICALSCALE2.
500www.
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05MAXALLAROUND0.
05MINALLAROUND16X(1.
5)16X(0.
45)14X(0.
65)(5.
8)(R0.
05)TYPTSSOP-1.
2mmmaxheightPW0016ASMALLOUTLINEPACKAGE4220204/A02/2017NOTES:(continued)6.
PublicationIPC-7351mayhavealternatedesigns.
7.
Soldermasktolerancesbetweenandaroundsignalpadscanvarybasedonboardfabricationsite.
LANDPATTERNEXAMPLEEXPOSEDMETALSHOWNSCALE:10XSYMMSYMM1891615.
000METALSOLDERMASKOPENINGMETALUNDERSOLDERMASKSOLDERMASKOPENINGEXPOSEDMETALEXPOSEDMETALSOLDERMASKDETAILSNON-SOLDERMASKDEFINED(PREFERRED)SOLDERMASKDEFINEDwww.
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IPC-7525mayhavealternatedesignrecommendations.
9.
Boardassemblysitemayhavedifferentrecommendationsforstencildesign.
SOLDERPASTEEXAMPLEBASEDON0.
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