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AN11717KMA22x;KMA32xhandlinginformationRev.
2—9July2018ApplicationnoteDocumentinformationInfoContentKeywordsKMA220,KMA221,KMA320,KMA321,package,handling,assemblyAbstractThisdocumentdescribesthelimitationstopackagehandlingandprecautionsforsafeassembly.
AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20182of13ContactinformationFormoreinformation,pleasevisit:http://www.
nxp.
comForsalesofficeaddresses,pleasesendanemailto:salesaddresses@nxp.
comNXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformationRevisionhistoryRevDateDescription2.
020180622changedtypeKMA332toKMA3201.
020151021initialversionAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20183of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation1.
Introduction1.
1GeneralNXPSemiconductorsisnottheownerofcustomerprocessesandcannottestthemunderallconditions.
Therefore,theinformationbelowisageneralguidelineforproducthandlingandpackageassembly.
Itdoesnotreplacetheprocessdevelopmentandreleasebythecustomer.
1.
2PackageinformationTheproductsKMA22xandKMA32xusethepackageSOT1188.
Itisfitforsolderingandwelding.
Theleadscanbebentaccordingtocustomerrequirements.
Theproductsrequiregentlehandlingasespeciallytheleadscanbendunintentionallyduetotheirsmallcrosssectionandlength.
2.
Storage2.
1StoreconditionsSecureandcleanstoreareasmustbeprovidedtoisolateandprotecttheproducts.
Conditionsinthestoreareasshallbesuchthatthequalityoftheproductsdoesnotdeterioratedueto,amongothers,harmfulgassesorelectricalfields.
Storageconditions:Temperature–Min.
+8C–Max.
+45CHumidity–Min.
25%–Max.
75%–NocondensationisallowedunderanyconditionLightintensity–NodirectsunlightFig1.
KMA220deviceinSOT1188packageDDD.
0$AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20184of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation2.
2ShelflifeTheshelflifeforpackedproductsis4yearsafterthedatecode.
3.
Precautions3.
1StresstosensorheadAsallMagnetoResistive(MR)sensors,KMA22xandKMA32xreactonseveremechanicalstress.
Itcancompromisetheaccuracyofthedevice.
Preventbending(warping)ofthesensorheadasthatappliesenormousstresstothesensorchip.
Oftenthesensorisattachedtoasubstrate(e.
g.
athrottlebodycover).
Thesensorshouldbedecoupledasmuchaspossiblefromthesubstrate,e.
g.
byusingasoftsiliconegluetofixthesensor.
3.
2StresstosensorleadsCausedbydifferencesinthermalexpansionofsensorandenvironment(socket),highamountofstresscanbegenerated.
Toreducethatstress,bendthesensororexternalleadstoprepareaflexibleregion.
BendingrecommendationsseeSection5.
2.
4.
Producthandling4.
1ESDprotectionDespitetheKMA22xandKMA32xdevicesbeingequippedwithcapacitorstoincreasetheESDrobustness,applytheusualESDprotectionmeasures.
Fig2.
StraightandwarpedsensorheadDDDFig3.
StressreductionbyleadbendingDDDWKHOHDGFDQFRPSHQVDWHWKHUPDOH[SDQVLRQGLIIHUHQFHVDWEHQGLQJ]RQHVWUDLJKWFRQVWUXFWLRQLQGXFHVKLJKWKHUPRPHFKDQLFDOVWUHVVOHYHOAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20185of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation4.
2ForcesonbodyForcesontheplasticbodyduringgeneralhandlingshouldnotexceed10N.
Applyforcesviaflatsurfaces,paralleltothesensorsurface.
Avoidstressconcentrationsatsmallerareas.
4.
3ForcesalongleadsMaximumpullforcealongleadsislimitedto10Nperlead.
Forcesinotherdirectionsshouldbepreventedastheleadstendtobendeasily.
Pushingofleadscancausecaving-in.
4.
4ForcesatfinMaximumpullforceislimitedto15N.
Forcesperpendiculartothefinshouldbepreventedasthefintendstobendeasily.
Fig4.
PullforcealongleadDDD.
0$)Fig5.
PullforceatfinDDD).
0$AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20186of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation4.
5ProductpickingoutoftapeProductsshouldbepickedbyeitheraflatorcavitytypesucker.
5.
Productassembly5.
1Productalignment5.
1.
1PackagefeaturesforalignmentBlueareasarepreferredforalignmentinsocket.
Redareasshouldnotbeusedforalignmentduetouncontrolledpackageoutlinecausedbygateremainsorpotentialmoldcompoundflash.
Otherareascanbeusedforalignment.
Fig6.
KMA22x;KMA32xintapeDDD.
0$.
0$.
0$.
0$Fig7.
PackagealignmentareasDDDDOLJQPHQWIHDWXUHVDWSDFNDJHVLGHVULPVKRXOGEHDWOHDVWPPZLGHJDWHUHPDLQDWDOWHUQDWLQJVLGHVXSWRPSURWUXGLQJUHFRPPHQGHGDOLJQPHQWDUHDVQRWUHFRPPHQGHGDOLJQPHQWDUHDVAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20187of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation5.
1.
2ReadingpointalignmentBestreferencefortheReadingPoint(RP)istheLeadFrame(LF)asthedieisattachedtotheLF.
Asthefinispartoftheleadframe,itisthepreferredalignmentfeature.
TheRPhasatoleranceof0.
1mmregardingthefin.
Theleadframeformedtherim(moldcompoundflowedtotheleadframeedge,formingtherim).
Therefore,ithasthesametoleranceof0.
1mm.
5.
1.
3PinalignmentJustaligningthepackageatthesensorheadmaynotbesufficienttoensureproperpositioningofthepinstotheirexternalcounterparts.
Aligntheproductattherim.
Itisalsopossibletoalignattheleadsitself.
Fig8.
ReadingpointalignmentfeaturesDDD.
0$ILQULPFig9.
AlignpinstoexternalleadsatlowerbodyDDDDOLJQPHQWIHDWXUHVDWSDFNDJHVLGHVULPFORVHWRJDWHORFDWLRQWRDOLJQVHQVRUOHDGVZLWKH[WHUQDOOHDGVAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20188of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation5.
2LeadbendingToadaptthepackagestocustomerrequirements,theleadscanbebentasshowninFigure10andFigure11.
Itisnotrecommendedtobendthedambar(andfin)region(seeFigurenote1ofFigure11)astheleadgeometryinthoseareascancompromisethebendingresult.
Instead,bendingisrecommendedatthestraightpartsoftheleads.
Topreventleadpullforcesattheentrancetotheplasticbody,useproperclampingattheleadsinbetweenthebendingpositionandtheplasticbody.
Fig10.
BendingpositionDimensionsinmm(1)Nobendingallowed.
(2)Plasticbodyandinterfaceplasticbody-leads:applicationofbendingforcesnotallowed.
Fig11.
LeadbendingsketchDDD.
0$EHVWEHQGLQJUHVXOWVDWVWUDLJKWSDUWRIOHDGV5PLQDDDAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20189of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation5.
2.
1LeadbendcontrolAfterintentionalorunintentionalleadbendingortwisting,verifythattheproductsarenotmechanicallydamaged.
Smoothbendingwithoutbucklinginbendingzone,innerradius>250m.
NoexposedCu(Snlayercracked,Cucorematerialexposed)allowed.
Leadsjustinfrontofpackageentrancenotbent,nogapsatleadentranceallaroundleads.
5.
3SolderingThesolderabilityqualificationisaccordingtoAEC-Q100Rev-G.
Recommendedsolderingprocessforleadeddevicesiswavesoldering.
Themaximumsolderingtemperatureis260Cformaximum5s.
Alternatively,thedevicecanbereflowsoldered.
Fig12.
SmoothbendingFig13.
Kinkinbendingzone,rejectFig14.
LeadentrancetobodycheckDDDDDD.
0$DDDQRJDSVLQEHWZHHQOHDGVDQGSODVWLFERG\QROHDGGHIRUPDWLRQLQEHWZHHQGDPEDUDQGSODVWLFERG\AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July201810of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation5.
4WeldingDuringelectrowelding,aheatwavetravelsalongtheleadscausinghighstresstothesensorproduct.
Tolimitthestress,controltheheatbyverifyingthattheSnreflowzonedoesstopinfrontofplasticbody(atbodyentrance).
Fig15.
Weldinginformation.
0$DDDZHOGLQJ]RQHERG\HQWUDQFHAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July201811of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation6.
Legalinformation6.
1DefinitionsDraft—Thedocumentisadraftversiononly.
Thecontentisstillunderinternalreviewandsubjecttoformalapproval,whichmayresultinmodificationsoradditions.
NXPSemiconductorsdoesnotgiveanyrepresentationsorwarrantiesastotheaccuracyorcompletenessofinformationincludedhereinandshallhavenoliabilityfortheconsequencesofuseofsuchinformation.
6.
2DisclaimersLimitedwarrantyandliability—Informationinthisdocumentisbelievedtobeaccurateandreliable.
However,NXPSemiconductorsdoesnotgiveanyrepresentationsorwarranties,expressedorimplied,astotheaccuracyorcompletenessofsuchinformationandshallhavenoliabilityfortheconsequencesofuseofsuchinformation.
NXPSemiconductorstakesnoresponsibilityforthecontentinthisdocumentifprovidedbyaninformationsourceoutsideofNXPSemiconductors.
InnoeventshallNXPSemiconductorsbeliableforanyindirect,incidental,punitive,specialorconsequentialdamages(including-withoutlimitation-lostprofits,lostsavings,businessinterruption,costsrelatedtotheremovalorreplacementofanyproductsorreworkcharges)whetherornotsuchdamagesarebasedontort(includingnegligence),warranty,breachofcontractoranyotherlegaltheory.
Notwithstandinganydamagesthatcustomermightincurforanyreasonwhatsoever,NXPSemiconductors'aggregateandcumulativeliabilitytowardscustomerfortheproductsdescribedhereinshallbelimitedinaccordancewiththeTermsandconditionsofcommercialsaleofNXPSemiconductors.
Righttomakechanges—NXPSemiconductorsreservestherighttomakechangestoinformationpublishedinthisdocument,includingwithoutlimitationspecificationsandproductdescriptions,atanytimeandwithoutnotice.
Thisdocumentsupersedesandreplacesallinformationsuppliedpriortothepublicationhereof.
Suitabilityforuseinautomotiveapplications—ThisNXPSemiconductorsproducthasbeenqualifiedforuseinautomotiveapplications.
Unlessotherwiseagreedinwriting,theproductisnotdesigned,authorizedorwarrantedtobesuitableforuseinlifesupport,life-criticalorsafety-criticalsystemsorequipment,norinapplicationswherefailureormalfunctionofanNXPSemiconductorsproductcanreasonablybeexpectedtoresultinpersonalinjury,deathorseverepropertyorenvironmentaldamage.
NXPSemiconductorsanditssuppliersacceptnoliabilityforinclusionand/oruseofNXPSemiconductorsproductsinsuchequipmentorapplicationsandthereforesuchinclusionand/oruseisatthecustomer'sownrisk.
Applications—Applicationsthataredescribedhereinforanyoftheseproductsareforillustrativepurposesonly.
NXPSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertestingormodification.
CustomersareresponsibleforthedesignandoperationoftheirapplicationsandproductsusingNXPSemiconductorsproducts,andNXPSemiconductorsacceptsnoliabilityforanyassistancewithapplicationsorcustomerproductdesign.
Itiscustomer'ssoleresponsibilitytodeterminewhethertheNXPSemiconductorsproductissuitableandfitforthecustomer'sapplicationsandproductsplanned,aswellasfortheplannedapplicationanduseofcustomer'sthirdpartycustomer(s).
Customersshouldprovideappropriatedesignandoperatingsafeguardstominimizetherisksassociatedwiththeirapplicationsandproducts.
NXPSemiconductorsdoesnotacceptanyliabilityrelatedtoanydefault,damage,costsorproblemwhichisbasedonanyweaknessordefaultinthecustomer'sapplicationsorproducts,ortheapplicationorusebycustomer'sthirdpartycustomer(s).
Customerisresponsiblefordoingallnecessarytestingforthecustomer'sapplicationsandproductsusingNXPSemiconductorsproductsinordertoavoidadefaultoftheapplicationsandtheproductsoroftheapplicationorusebycustomer'sthirdpartycustomer(s).
NXPdoesnotacceptanyliabilityinthisrespect.
Exportcontrol—Thisdocumentaswellastheitem(s)describedhereinmaybesubjecttoexportcontrolregulations.
Exportmightrequireapriorauthorizationfromcompetentauthorities.
Translations—Anon-English(translated)versionofadocumentisforreferenceonly.
TheEnglishversionshallprevailincaseofanydiscrepancybetweenthetranslatedandEnglishversions.
6.
3TrademarksNotice:Allreferencedbrands,productnames,servicenamesandtrademarksarethepropertyoftheirrespectiveowners.
AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July201812of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation7.
FiguresFig1.
KMA220deviceinSOT1188package3Fig2.
Straightandwarpedsensorhead4Fig3.
Stressreductionbyleadbending.
4Fig4.
Pullforcealonglead5Fig5.
Pullforceatfin5Fig6.
KMA22x;KMA32xintape6Fig7.
Packagealignmentareas6Fig8.
Readingpointalignmentfeatures7Fig9.
Alignpinstoexternalleadsatlowerbody7Fig10.
Bendingposition8Fig11.
Leadbendingsketch8Fig12.
Smoothbending.
9Fig13.
Kinkinbendingzone,reject.
9Fig14.
Leadentrancetobodycheck.
9Fig15.
Weldinginformation10NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformationNXPSemiconductorsN.
V.
2018.
Allrightsreserved.
Formoreinformation,pleasevisit:http://www.
nxp.
comForsalesofficeaddresses,pleasesendanemailto:salesaddresses@nxp.
comDateofrelease:9July2018Documentidentifier:AN11717Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s)describedherein,havebeenincludedinsection'Legalinformation'.
8.
Contents1Introduction31.
1General.
31.
2Packageinformation.
32Storage32.
1Storeconditions32.
2Shelflife43Precautions43.
1Stresstosensorhead.
43.
2Stresstosensorleads44Producthandling44.
1ESDprotection44.
2Forcesonbody.
54.
3Forcesalongleads54.
4Forcesatfin54.
5Productpickingoutoftape65Productassembly65.
1Productalignment.
65.
1.
1Packagefeaturesforalignment65.
1.
2Readingpointalignment.
75.
1.
3Pinalignment75.
2Leadbending85.
2.
1Leadbendcontrol.
95.
3Soldering95.
4Welding.
106Legalinformation.
116.
1Definitions.
116.
2Disclaimers116.
3Trademarks.
117Figures128Contents13
2—9July2018ApplicationnoteDocumentinformationInfoContentKeywordsKMA220,KMA221,KMA320,KMA321,package,handling,assemblyAbstractThisdocumentdescribesthelimitationstopackagehandlingandprecautionsforsafeassembly.
AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20182of13ContactinformationFormoreinformation,pleasevisit:http://www.
nxp.
comForsalesofficeaddresses,pleasesendanemailto:salesaddresses@nxp.
comNXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformationRevisionhistoryRevDateDescription2.
020180622changedtypeKMA332toKMA3201.
020151021initialversionAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20183of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation1.
Introduction1.
1GeneralNXPSemiconductorsisnottheownerofcustomerprocessesandcannottestthemunderallconditions.
Therefore,theinformationbelowisageneralguidelineforproducthandlingandpackageassembly.
Itdoesnotreplacetheprocessdevelopmentandreleasebythecustomer.
1.
2PackageinformationTheproductsKMA22xandKMA32xusethepackageSOT1188.
Itisfitforsolderingandwelding.
Theleadscanbebentaccordingtocustomerrequirements.
Theproductsrequiregentlehandlingasespeciallytheleadscanbendunintentionallyduetotheirsmallcrosssectionandlength.
2.
Storage2.
1StoreconditionsSecureandcleanstoreareasmustbeprovidedtoisolateandprotecttheproducts.
Conditionsinthestoreareasshallbesuchthatthequalityoftheproductsdoesnotdeterioratedueto,amongothers,harmfulgassesorelectricalfields.
Storageconditions:Temperature–Min.
+8C–Max.
+45CHumidity–Min.
25%–Max.
75%–NocondensationisallowedunderanyconditionLightintensity–NodirectsunlightFig1.
KMA220deviceinSOT1188packageDDD.
0$AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20184of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation2.
2ShelflifeTheshelflifeforpackedproductsis4yearsafterthedatecode.
3.
Precautions3.
1StresstosensorheadAsallMagnetoResistive(MR)sensors,KMA22xandKMA32xreactonseveremechanicalstress.
Itcancompromisetheaccuracyofthedevice.
Preventbending(warping)ofthesensorheadasthatappliesenormousstresstothesensorchip.
Oftenthesensorisattachedtoasubstrate(e.
g.
athrottlebodycover).
Thesensorshouldbedecoupledasmuchaspossiblefromthesubstrate,e.
g.
byusingasoftsiliconegluetofixthesensor.
3.
2StresstosensorleadsCausedbydifferencesinthermalexpansionofsensorandenvironment(socket),highamountofstresscanbegenerated.
Toreducethatstress,bendthesensororexternalleadstoprepareaflexibleregion.
BendingrecommendationsseeSection5.
2.
4.
Producthandling4.
1ESDprotectionDespitetheKMA22xandKMA32xdevicesbeingequippedwithcapacitorstoincreasetheESDrobustness,applytheusualESDprotectionmeasures.
Fig2.
StraightandwarpedsensorheadDDDFig3.
StressreductionbyleadbendingDDDWKHOHDGFDQFRPSHQVDWHWKHUPDOH[SDQVLRQGLIIHUHQFHVDWEHQGLQJ]RQHVWUDLJKWFRQVWUXFWLRQLQGXFHVKLJKWKHUPRPHFKDQLFDOVWUHVVOHYHOAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20185of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation4.
2ForcesonbodyForcesontheplasticbodyduringgeneralhandlingshouldnotexceed10N.
Applyforcesviaflatsurfaces,paralleltothesensorsurface.
Avoidstressconcentrationsatsmallerareas.
4.
3ForcesalongleadsMaximumpullforcealongleadsislimitedto10Nperlead.
Forcesinotherdirectionsshouldbepreventedastheleadstendtobendeasily.
Pushingofleadscancausecaving-in.
4.
4ForcesatfinMaximumpullforceislimitedto15N.
Forcesperpendiculartothefinshouldbepreventedasthefintendstobendeasily.
Fig4.
PullforcealongleadDDD.
0$)Fig5.
PullforceatfinDDD).
0$AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20186of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation4.
5ProductpickingoutoftapeProductsshouldbepickedbyeitheraflatorcavitytypesucker.
5.
Productassembly5.
1Productalignment5.
1.
1PackagefeaturesforalignmentBlueareasarepreferredforalignmentinsocket.
Redareasshouldnotbeusedforalignmentduetouncontrolledpackageoutlinecausedbygateremainsorpotentialmoldcompoundflash.
Otherareascanbeusedforalignment.
Fig6.
KMA22x;KMA32xintapeDDD.
0$.
0$.
0$.
0$Fig7.
PackagealignmentareasDDDDOLJQPHQWIHDWXUHVDWSDFNDJHVLGHVULPVKRXOGEHDWOHDVWPPZLGHJDWHUHPDLQDWDOWHUQDWLQJVLGHVXSWRPSURWUXGLQJUHFRPPHQGHGDOLJQPHQWDUHDVQRWUHFRPPHQGHGDOLJQPHQWDUHDVAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20187of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation5.
1.
2ReadingpointalignmentBestreferencefortheReadingPoint(RP)istheLeadFrame(LF)asthedieisattachedtotheLF.
Asthefinispartoftheleadframe,itisthepreferredalignmentfeature.
TheRPhasatoleranceof0.
1mmregardingthefin.
Theleadframeformedtherim(moldcompoundflowedtotheleadframeedge,formingtherim).
Therefore,ithasthesametoleranceof0.
1mm.
5.
1.
3PinalignmentJustaligningthepackageatthesensorheadmaynotbesufficienttoensureproperpositioningofthepinstotheirexternalcounterparts.
Aligntheproductattherim.
Itisalsopossibletoalignattheleadsitself.
Fig8.
ReadingpointalignmentfeaturesDDD.
0$ILQULPFig9.
AlignpinstoexternalleadsatlowerbodyDDDDOLJQPHQWIHDWXUHVDWSDFNDJHVLGHVULPFORVHWRJDWHORFDWLRQWRDOLJQVHQVRUOHDGVZLWKH[WHUQDOOHDGVAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20188of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation5.
2LeadbendingToadaptthepackagestocustomerrequirements,theleadscanbebentasshowninFigure10andFigure11.
Itisnotrecommendedtobendthedambar(andfin)region(seeFigurenote1ofFigure11)astheleadgeometryinthoseareascancompromisethebendingresult.
Instead,bendingisrecommendedatthestraightpartsoftheleads.
Topreventleadpullforcesattheentrancetotheplasticbody,useproperclampingattheleadsinbetweenthebendingpositionandtheplasticbody.
Fig10.
BendingpositionDimensionsinmm(1)Nobendingallowed.
(2)Plasticbodyandinterfaceplasticbody-leads:applicationofbendingforcesnotallowed.
Fig11.
LeadbendingsketchDDD.
0$EHVWEHQGLQJUHVXOWVDWVWUDLJKWSDUWRIOHDGV5PLQDDDAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July20189of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation5.
2.
1LeadbendcontrolAfterintentionalorunintentionalleadbendingortwisting,verifythattheproductsarenotmechanicallydamaged.
Smoothbendingwithoutbucklinginbendingzone,innerradius>250m.
NoexposedCu(Snlayercracked,Cucorematerialexposed)allowed.
Leadsjustinfrontofpackageentrancenotbent,nogapsatleadentranceallaroundleads.
5.
3SolderingThesolderabilityqualificationisaccordingtoAEC-Q100Rev-G.
Recommendedsolderingprocessforleadeddevicesiswavesoldering.
Themaximumsolderingtemperatureis260Cformaximum5s.
Alternatively,thedevicecanbereflowsoldered.
Fig12.
SmoothbendingFig13.
Kinkinbendingzone,rejectFig14.
LeadentrancetobodycheckDDDDDD.
0$DDDQRJDSVLQEHWZHHQOHDGVDQGSODVWLFERG\QROHDGGHIRUPDWLRQLQEHWZHHQGDPEDUDQGSODVWLFERG\AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July201810of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation5.
4WeldingDuringelectrowelding,aheatwavetravelsalongtheleadscausinghighstresstothesensorproduct.
Tolimitthestress,controltheheatbyverifyingthattheSnreflowzonedoesstopinfrontofplasticbody(atbodyentrance).
Fig15.
Weldinginformation.
0$DDDZHOGLQJ]RQHERG\HQWUDQFHAN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July201811of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation6.
Legalinformation6.
1DefinitionsDraft—Thedocumentisadraftversiononly.
Thecontentisstillunderinternalreviewandsubjecttoformalapproval,whichmayresultinmodificationsoradditions.
NXPSemiconductorsdoesnotgiveanyrepresentationsorwarrantiesastotheaccuracyorcompletenessofinformationincludedhereinandshallhavenoliabilityfortheconsequencesofuseofsuchinformation.
6.
2DisclaimersLimitedwarrantyandliability—Informationinthisdocumentisbelievedtobeaccurateandreliable.
However,NXPSemiconductorsdoesnotgiveanyrepresentationsorwarranties,expressedorimplied,astotheaccuracyorcompletenessofsuchinformationandshallhavenoliabilityfortheconsequencesofuseofsuchinformation.
NXPSemiconductorstakesnoresponsibilityforthecontentinthisdocumentifprovidedbyaninformationsourceoutsideofNXPSemiconductors.
InnoeventshallNXPSemiconductorsbeliableforanyindirect,incidental,punitive,specialorconsequentialdamages(including-withoutlimitation-lostprofits,lostsavings,businessinterruption,costsrelatedtotheremovalorreplacementofanyproductsorreworkcharges)whetherornotsuchdamagesarebasedontort(includingnegligence),warranty,breachofcontractoranyotherlegaltheory.
Notwithstandinganydamagesthatcustomermightincurforanyreasonwhatsoever,NXPSemiconductors'aggregateandcumulativeliabilitytowardscustomerfortheproductsdescribedhereinshallbelimitedinaccordancewiththeTermsandconditionsofcommercialsaleofNXPSemiconductors.
Righttomakechanges—NXPSemiconductorsreservestherighttomakechangestoinformationpublishedinthisdocument,includingwithoutlimitationspecificationsandproductdescriptions,atanytimeandwithoutnotice.
Thisdocumentsupersedesandreplacesallinformationsuppliedpriortothepublicationhereof.
Suitabilityforuseinautomotiveapplications—ThisNXPSemiconductorsproducthasbeenqualifiedforuseinautomotiveapplications.
Unlessotherwiseagreedinwriting,theproductisnotdesigned,authorizedorwarrantedtobesuitableforuseinlifesupport,life-criticalorsafety-criticalsystemsorequipment,norinapplicationswherefailureormalfunctionofanNXPSemiconductorsproductcanreasonablybeexpectedtoresultinpersonalinjury,deathorseverepropertyorenvironmentaldamage.
NXPSemiconductorsanditssuppliersacceptnoliabilityforinclusionand/oruseofNXPSemiconductorsproductsinsuchequipmentorapplicationsandthereforesuchinclusionand/oruseisatthecustomer'sownrisk.
Applications—Applicationsthataredescribedhereinforanyoftheseproductsareforillustrativepurposesonly.
NXPSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertestingormodification.
CustomersareresponsibleforthedesignandoperationoftheirapplicationsandproductsusingNXPSemiconductorsproducts,andNXPSemiconductorsacceptsnoliabilityforanyassistancewithapplicationsorcustomerproductdesign.
Itiscustomer'ssoleresponsibilitytodeterminewhethertheNXPSemiconductorsproductissuitableandfitforthecustomer'sapplicationsandproductsplanned,aswellasfortheplannedapplicationanduseofcustomer'sthirdpartycustomer(s).
Customersshouldprovideappropriatedesignandoperatingsafeguardstominimizetherisksassociatedwiththeirapplicationsandproducts.
NXPSemiconductorsdoesnotacceptanyliabilityrelatedtoanydefault,damage,costsorproblemwhichisbasedonanyweaknessordefaultinthecustomer'sapplicationsorproducts,ortheapplicationorusebycustomer'sthirdpartycustomer(s).
Customerisresponsiblefordoingallnecessarytestingforthecustomer'sapplicationsandproductsusingNXPSemiconductorsproductsinordertoavoidadefaultoftheapplicationsandtheproductsoroftheapplicationorusebycustomer'sthirdpartycustomer(s).
NXPdoesnotacceptanyliabilityinthisrespect.
Exportcontrol—Thisdocumentaswellastheitem(s)describedhereinmaybesubjecttoexportcontrolregulations.
Exportmightrequireapriorauthorizationfromcompetentauthorities.
Translations—Anon-English(translated)versionofadocumentisforreferenceonly.
TheEnglishversionshallprevailincaseofanydiscrepancybetweenthetranslatedandEnglishversions.
6.
3TrademarksNotice:Allreferencedbrands,productnames,servicenamesandtrademarksarethepropertyoftheirrespectiveowners.
AN11717Allinformationprovidedinthisdocumentissubjecttolegaldisclaimers.
NXPSemiconductorsN.
V.
2018.
Allrightsreserved.
ApplicationnoteRev.
2—9July201812of13NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformation7.
FiguresFig1.
KMA220deviceinSOT1188package3Fig2.
Straightandwarpedsensorhead4Fig3.
Stressreductionbyleadbending.
4Fig4.
Pullforcealonglead5Fig5.
Pullforceatfin5Fig6.
KMA22x;KMA32xintape6Fig7.
Packagealignmentareas6Fig8.
Readingpointalignmentfeatures7Fig9.
Alignpinstoexternalleadsatlowerbody7Fig10.
Bendingposition8Fig11.
Leadbendingsketch8Fig12.
Smoothbending.
9Fig13.
Kinkinbendingzone,reject.
9Fig14.
Leadentrancetobodycheck.
9Fig15.
Weldinginformation10NXPSemiconductorsAN11717KMA22x;KMA32xhandlinginformationNXPSemiconductorsN.
V.
2018.
Allrightsreserved.
Formoreinformation,pleasevisit:http://www.
nxp.
comForsalesofficeaddresses,pleasesendanemailto:salesaddresses@nxp.
comDateofrelease:9July2018Documentidentifier:AN11717Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s)describedherein,havebeenincludedinsection'Legalinformation'.
8.
Contents1Introduction31.
1General.
31.
2Packageinformation.
32Storage32.
1Storeconditions32.
2Shelflife43Precautions43.
1Stresstosensorhead.
43.
2Stresstosensorleads44Producthandling44.
1ESDprotection44.
2Forcesonbody.
54.
3Forcesalongleads54.
4Forcesatfin54.
5Productpickingoutoftape65Productassembly65.
1Productalignment.
65.
1.
1Packagefeaturesforalignment65.
1.
2Readingpointalignment.
75.
1.
3Pinalignment75.
2Leadbending85.
2.
1Leadbendcontrol.
95.
3Soldering95.
4Welding.
106Legalinformation.
116.
1Definitions.
116.
2Disclaimers116.
3Trademarks.
117Figures128Contents13
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