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2015MicrochipTechnologyInc.
DS20005357A-page1CL8800FeaturesMinimalcomponentcount(baseconfig:CL8800+6resistors+diodebridge)Nomagnetics,nocapacitorsUpto7.
5Woutput(13Ww/heatsink)>110Lm/WusingefficientLEDs85%typicalelectricalefficiency>0.
95powerfactor<20%THDlinecurrentLowconductedEMIw/ofilters85%LEDluminousutilizationPhasedimmercompatiblewithanRCnetworkApplicationsFluorescenttuberetrofitIncandescent&CFLbulbreplacementGeneralLEDlightingDescriptionCL8800isdesignedtodrivealongstringofinexpen-sive,low-currentLEDsdirectlyfromtheACmains.
AbasicdrivercircuitconsistsofCL8800,sixresistors,andabridgerectifier.
Twotofouradditionalcompo-nentsareoptionalforvariouslevelsoftransientprotec-tion.
Nocapacitors,EMIfilters,orpowerfactorcorrectioncircuitsareneeded.
Astringofseries/parallelLEDsistappedatsixloca-tions.
Sixlinearcurrentregulatorssinkcurrentateachtapandaresequentiallyturnedonandoff.
Therebytrackingtheinputsinewavevoltage.
Voltageacrosseachregulatorisminimizedwhenconducting,provid-inghighefficiency.
Outputcurrentateachtapisindivid-uallyresistor-adjustable.
Cross-regulation,astheCL8800switchesfromoneregulatortoanother,pro-videssmoothtransitions.
Thecurrentwaveformcanbetailoredtooptimizeforinputvoltagerange,line/loadregulation,outputpower/current,efficiency,powerfac-tor,THD,dimmercompatibility,andLEDutilization.
WiththeadditionofanRCnetwork,thedriveriscom-patiblewithphasedimming.
SequentialLinearLEDDriverCL8800DS20005357A-page22015MicrochipTechnologyInc.
PackageTypeTypicalApplicationCircuit133SET1NCSET2NCSET3NCSET4NCSET5SET6BIASTAP1TAP2TAP3TAP4TAP5TAP6GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDSeeTable2-1forpininformationBIASGNDCL8800SET1SET2SET3SET4SET5SET6ACMainsTAP1TAP2TAP3TAP4TAP5TAP6additionalcomponentsfor230VAC100-120VACTransientProtection2015MicrochipTechnologyInc.
DS20005357A-page3CL88001.
0ELECTRICALCHARACTERISTICSABSOLUTEMAXIMUMRATINGSVBIAS,VTAP1.
0.
5Vto+550VVTAP2-650Vto+320VVSET1-6.
4.
0VOperatingtemperature.
55°Cto+125°CStoragetemperature,TS65°Cto+150°CNote:AbsoluteMaximumRatingsarethosevaluesbeyondwhichdamagetothedevicemayoccur.
Functionaloperationundertheseconditionsisnotimplied.
Continuousoperationofthedeviceattheabsoluteratinglevelmayaffectdevicereli-ability.
Allvoltagesarereferencedtodeviceground.
1.
1ELECTRICALSPECIFICATIONSTABLE1-1:RECOMMENDEDOPERATINGCONDITIONSSymbolParameterMinTypMaxUnitsConditionsIOUTOutputCurrentTAP160mATAP290mATAP3115mATAP4115mATAP5115mATAP6115mAVOUTOutputVoltageTAP1400VNon-conductingTAP2-6300VNon-conductingTAP1-6varies11Voltagecapabilityisdeterminedbypowerdissipation(V*I).
VConductingVBIASAppliedBIASvoltage440VTABLE1-2:ELECTRICALCHARACTERISTICS11Overrecommendedoperatingconditionsat25°C,unlessspecifiedotherwise.
SymbolParameterMinTypMaxUnitsConditionsIBIASBIASpininputcurrent250410AVBIAS=340VITAP(ON)Outputcurrent,onTAP160mAVTAP1=30V,VSET1-6=GNDTAP290mAVTAP2=17V,VSET1-6=GNDTAP3115mAVTAP3=17V,VSET1-6=GNDTAP4115mAVTAP4=17V,VSET1-6=GNDTAP5115mAVTAP5=17V,VSET1-6=GNDTAP6115mAVTAP6=17V,VSET1-6=GNDITAP(OFF)Outputcurrent,off010ATap1-5,VBIAS=312VVREGRegulationvoltageatSETpinsSET1-51.
802.
002.
20VSET61.
892.
102.
31VCL8800DS20005357A-page42015MicrochipTechnologyInc.
FIGURE1-1:OUTPUTCURRENTTHERMALCHARACTERISTICSTABLE1-3:THERMALRESISTANCEPackageθja1θjc233-LeadQFN24°C/W2.
5°C/W11.
0ozCu4-layerboard,3x4"PCBwiththermalpadandthermalviaarray.
2Junctiontoexposedheatslug.
250200150100500IOUT(mA)-60-40-20020406080100120140Temperature(°C)MaximumOutputCurrentTaps4&5Taps3&6Tap2Tap12015MicrochipTechnologyInc.
DS20005357A-page5CL88002.
0PINDESCRIPTIONThelocationsofthepinsarelistedinPackageType.
TABLE2-1:PINDESCRIPTIONPin#FunctionDescription1-8GNDCircuitcommon(useforheatsinkgroundplanepassthrough).
9SET1Currentsenseforlinearcurrentregulatorsforeachtap.
Resistorsonthesepinssetsthetapcurrents.
10NCNointernalconnection.
11SET2Currentsenseforlinearcurrentregulatorsforeachtap.
Resistorsonthesepinssetsthetapcurrents.
12NCNointernalconnection.
13SET3Currentsenseforlinearcurrentregulatorsforeachtap.
Resistorsonthesepinssetsthetapcurrents.
14NCNointernalconnection.
15SET4Currentsenseforlinearcurrentregulatorsforeachtap.
Resistorsonthesepinssetsthetapcurrents.
16NCNointernalconnection.
17SET5Currentsenseforlinearcurrentregulatorsforeachtap.
Resistorsonthesepinssetsthetapcurrents.
18SET6Currentsenseforlinearcurrentregulatorsforeachtap.
Resistorsonthesepinssetsthetapcurrents.
19-20GNDCircuitcommon(useforheatsinkgroundplanepassthrough).
21GNDCircuitcommon.
Connecttobridgerectifierreturn(useforheatsinkgroundplanepassthrough).
22-26GNDCircuitcommon(useforheatsinkgroundplanepassthrough).
27TAP6Currentregulatoroutputs.
ConnecttotapsalongtheLEDstring.
28TAP529TAP430TAP331TAP232TAP133BIASProvidesbiasfordriver.
ConnecttorectifiedAC.
Undersideplate(GND)Forheatsinkingpurposes,itshouldbesolderedtoa4.
0cm2exposedcopperarea.
Itshouldalsobeelectricallyconnectedtocircuitcommon(GND).
CL8800DS20005357A-page62015MicrochipTechnologyInc.
3.
0APPLICATIONINFORMATION3.
1OverviewDesigningadrivertomeetparticularrequirementsmaybeadifficulttaskconsideringthe18designvariables:tapcurrent(6),numberofseries-connectedLEDspersegment(6),andthenumberofparallel-connectedLEDspersegment(6).
Manuallyselectingvalueswillprovidelight,butthechosenvaluesmaybefarfromoptimalinregardstoefficiency,LEDutilization,andlineregulation.
ContactyournearestMicrochipFieldApplicationsEngineerfordesignassistance.
Inadditiontoconfiguringthedriver,severalcircuitsmaybeemployedtoincreasereliability,performance,andcost.
Thefollowingsectionsbrieflydescribethesecircuits.
3.
2TransientProtectionThedrivercircuitshavenoneedforcapacitorsthatcouldotherwiseabsorbtransientenergy,noristhereaneedforEMIfiltersthatwouldblocktransients.
There-fore,thefullburdenoftransientprotectionisbornebytheprotectioncircuit.
Thetwo-stageapproachinthefollowingschematicsprovide2.
5kVprotection,bothpulseandringperEN61000-4-5andEN61000-4-12,sixhitseach.
FIGURE3-1:100TO120VACTRANSIENTPROTECTIONFIGURE3-2:230VACTRANSIENTPROTECTION3.
3ZenerDiodeSubstitutionZenerdiodesmaybesubstitutedforLEDsinthebot-tomstagesofthedesign.
Thelast1or2stagesofLEDscontributelittletothelightoutput-theyaremainlypresenttooff-loadtheadjacentupstreamregu-latorathighlinevoltagestominimizelosses.
TheadvantagesofZenersubstitutionincludesminimizingunlitLEDsatlowlineforbetterlightuniformity,betterlineregulationathighline,fewerLEDsforlowercostandlessPCBarea,andfewerboard-to-boardconnec-tions.
Disadvantagesincludeslightly-reducedeffi-ciencyathighline,andadditionalheatloadonthedriverboard.
3.
4PhaseDimmingAswithanylightload,theLEDlampmightnotdrawenoughcurrenttoensureproperdimmeroperation.
Thisisespeciallytruefor230VACdimmers.
TriodesforAlternatingCurrent(TRIAC)usedindimmersrequireaminimumlatchingcurrentwhentriggeredtoplacetheTRIACinthelatched-onstate.
Oncelatched,amini-mumholdingcurrentisrequiredtomaintaintheTRIACintheonstate.
Latchingcurrentismanytimesgreaterthantheholdingcurrent,andisthemainconcernwithdimmercompatibility.
HigherlatchingcurrentcanbeprovidedbyasimpleseriesRCnetworkacrosstheACline.
Ashorttimecon-stantprovidesacurrentspikeattheturn-onedge.
Lesscommonisinadequateholdingcurrent.
Themini-mumdimmerholdingcurrentistypically10-20mA.
Tap1at60mA(max)exceedstheminimum.
FIGURE3-3:PHASEDIMMING3.
5StrobingTwiceperAClinecyclethelinevoltagecrosseszerovolts,duringwhichtimethereisnolightoutput.
ThecircuitinFigure3-4canprovide5-10%valleyfill.
Ithaslittleeffectoninputcurrentwaveshape(THD,PF)andefficiency.
Thiscircuitisintendedtopreventtheoutputfromreachingzero.
Itwillnotsignificantlyreduceoutputrip-ple.
22Ω150VAC10mmACLine22Ω33Ω275VAC10mm440VDC1.
5kWACLineBridgeRectifierACLineTransientProtection500Ω100-200nF2015MicrochipTechnologyInc.
DS20005357A-page7CL88003.
6PowerBoostHigheroutputpowercanbeachievedbyoff-loadingaportionofthepowerdissipationfromtheCL8800toexternalField-EffectTransistors(FET).
ThecircuitbelowdropsmostofthetapvoltageacrosstheFETs,therebyshiftingthebulkofthedissipationtotheFET.
FIGURE3-4:POWERBOOSTFIGURE3-5:VALLEYFILLCIRCUITTAP6TAP7toLEDstoLEDs200kΩ15VBIASCL8800SET1SET2SET3SET4SET5SET6GNDTAP1TAP2TAP3TAP4TAP5TAP6CF1QF2DN3135RF3RF2150kΩRF110kΩQF1Optionalflickerreductioncircuit(valleyfill)RS1RS2RS3RS4RS6RS5CL8800DS20005357A-page82015MicrochipTechnologyInc.
FIGURE3-6:SIMPLIFIEDBLOCKDIAGRAMBIASGNDCL8800SET1SET2SET3SET4SET5SET6TAP1TAP2TAP3TAP4TAP5TAP6inreg10inreg10inreg10inreg10inreg101022Ω33Ω275VAC10mm440VDC1.
5kWRSET1RSET2RSET3RSET4RSET5RSET6ACMainsadditionalcomponentsfor230VAC100-120VACTransientProtection2015MicrochipTechnologyInc.
DS20005357A-page9CL88004.
0PACKAGINGINFORMATION4.
1PackageMarkingInformationLegend:XX.
.
.
XProductCodeorCustomer-specificinformationYYearcode(lastdigitofcalendaryear)YYYearcode(last2digitsofcalendaryear)WWWeekcode(weekofJanuary1isweek'01')NNNAlphanumerictraceabilitycodePb-freeJEDECdesignatorforMatteTin(Sn)*ThispackageisPb-free.
ThePb-freeJEDECdesignator()canbefoundontheouterpackagingforthispackage.
Note:IntheeventthefullMicrochippartnumbercannotbemarkedononeline,itwillbecarriedovertothenextline,thuslimitingthenumberofavailablecharactersforproductcodeorcustomer-specificinformation.
Packagemayormaynotincludethecorporatelogo.
3e3e33-leadQFNExampleYYWWNNNYYWWNNNXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXe3XXXXXXXXXXXXK63K63CL8800CL8800e314493431449343CL8800DS20005357A-page102015MicrochipTechnologyInc.
Note:Forthemostcurrentpackagedrawings,seetheMicrochipPackagingSpecificationatwww.
microchip.
com/packaging.
2015MicrochipTechnologyInc.
DS20005357A-page11CL8800APPENDIXA:REVISIONHISTORYRevisionA(January2015)UpdatefiletonewformatCL8800DS20005357A-page122015MicrochipTechnologyInc.
PRODUCTIDENTIFICATIONSYSTEMToorderorobtaininformation,e.
g.
,onpricingordelivery,refertothefactoryorthelistedsalesoffice.
Device:CL8800=SequentialLinearLEDDriverPackage:K6(3)=QFN(6x6mmbody),33-leadEnvironmentalG=Lead(Pb)-free/ROHS-compliantpackageMediaType:(blank)=490/TrayM935=3000/ReelExamples:a)CL8800K63-G:33-leadQFNpackage,490/Tray.
b)CL8800K63-G-M93533-leadQFNpackage,3000/ReelPARTNO.
XDeviceXEnvironmentalXXPackageOptionsMedia--Type2015MicrochipTechnologyInc.
DS20005357A-page13Informationcontainedinthispublicationregardingdeviceapplicationsandthelikeisprovidedonlyforyourconvenienceandmaybesupersededbyupdates.
Itisyourresponsibilitytoensurethatyourapplicationmeetswithyourspecifications.
MICROCHIPMAKESNOREPRESENTATIONSORWARRANTIESOFANYKINDWHETHEREXPRESSORIMPLIED,WRITTENORORAL,STATUTORYOROTHERWISE,RELATEDTOTHEINFORMATION,INCLUDINGBUTNOTLIMITEDTOITSCONDITION,QUALITY,PERFORMANCE,MERCHANTABILITYORFITNESSFORPURPOSE.
Microchipdisclaimsallliabilityarisingfromthisinformationanditsuse.
UseofMicrochipdevicesinlifesupportand/orsafetyapplicationsisentirelyatthebuyer'srisk,andthebuyeragreestodefend,indemnifyandholdharmlessMicrochipfromanyandalldamages,claims,suits,orexpensesresultingfromsuchuse.
Nolicensesareconveyed,implicitlyorotherwise,underanyMicrochipintellectualpropertyrights.
TrademarksTheMicrochipnameandlogo,theMicrochiplogo,dsPIC,FlashFlex,KEELOQ,KEELOQlogo,MPLAB,PIC,PICmicro,PICSTART,PIC32logo,rfPIC,SST,SSTLogo,SuperFlashandUNI/OareregisteredtrademarksofMicrochipTechnologyIncorporatedintheU.
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FilterLab,Hampshire,HI-TECHC,LinearActiveThermistor,MTP,SEEVALandTheEmbeddedControlSolutionsCompanyareregisteredtrademarksofMicrochipTechnologyIncorporatedintheU.
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Allothertrademarksmentionedhereinarepropertyoftheirrespectivecompanies.
2015,MicrochipTechnologyIncorporated,PrintedintheU.
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,AllRightsReserved.
Printedonrecycledpaper.
ISBN:978-1-63276-957-2NotethefollowingdetailsofthecodeprotectionfeatureonMicrochipdevices:MicrochipproductsmeetthespecificationcontainedintheirparticularMicrochipDataSheet.
Microchipbelievesthatitsfamilyofproductsisoneofthemostsecurefamiliesofitskindonthemarkettoday,whenusedintheintendedmannerandundernormalconditions.
Therearedishonestandpossiblyillegalmethodsusedtobreachthecodeprotectionfeature.
Allofthesemethods,toourknowledge,requireusingtheMicrochipproductsinamanneroutsidetheoperatingspecificationscontainedinMicrochip'sDataSheets.
Mostlikely,thepersondoingsoisengagedintheftofintellectualproperty.
Microchipiswillingtoworkwiththecustomerwhoisconcernedabouttheintegrityoftheircode.
NeitherMicrochipnoranyothersemiconductormanufacturercanguaranteethesecurityoftheircode.
Codeprotectiondoesnotmeanthatweareguaranteeingtheproductas"unbreakable.
"Codeprotectionisconstantlyevolving.
WeatMicrochiparecommittedtocontinuouslyimprovingthecodeprotectionfeaturesofourproducts.
AttemptstobreakMicrochip'scodeprotectionfeaturemaybeaviolationoftheDigitalMillenniumCopyrightAct.
Ifsuchactsallowunauthorizedaccesstoyoursoftwareorothercopyrightedwork,youmayhavearighttosueforreliefunderthatAct.
MicrochipreceivedISO/TS-16949:2009certificationforitsworldwideheadquarters,designandwaferfabricationfacilitiesinChandlerandTempe,Arizona;Gresham,OregonanddesigncentersinCaliforniaandIndia.
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Inaddition,Microchip'squalitysystemforthedesignandmanufactureofdevelopmentsystemsisISO9001:2000certified.
QUALITYMANAGEMENTSYSTEMCERTIFIEDBYDNV==ISO/TS16949==DS20005357A-page142015MicrochipTechnologyInc.
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