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IntelI/OControllerHub7(ICH7)ThermalDesignGuidelines—FortheIntel82801GBICH7and82801GRICH7RI/OControllerHubsApril2005DocumentNumber:307015-001RR2IntelI/OControllerHub7(ICH7)ThermalDesignGuideTHISDOCUMENTANDRELATEDMATERIALSANDINFORMATIONAREPROVIDED"ASIS"WITHNOWARRANTIES,EXPRESSORIMPLIED,INCLUDINGBUTNOTLIMITEDTOANYIMPLIEDWARRANTYOFMERCHANTABILITY,FITNESSFORAPARTICULARPURPOSE,NON-INFRINGEMENTOFINTELLECTUALPROPERTYRIGHTS,ORANYWARRANTYOTHERWISEARISINGOUTOFANYPROPOSAL,SPECIFICATION,ORSAMPLE.
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Allrightsreserved.
RIntelI/OControllerHub7(ICH7)ThermalDesignGuide3Contents1Introduction.
71.
1Terminology81.
2ReferenceDocuments.
82ProductSpecifications.
92.
1PackageDescription.
92.
2ThermalSpecifications92.
3PowerSpecifications113ThermalMetrology.
133.
1CaseTemperatureMeasurements.
133.
20°AngleThermocoupleAttachMethodology.
133.
3AmbientTemperatureandAirflowMeasurement.
144AlternativeHeatsinkDeterminationGuidance174.
1ConfigurationsSupportedinthisMethodology.
174.
2SystemConfigurationforTCAnalysis.
184.
3HeatsinkDeterminationProcedure.
184.
3.
1ProcedureDescription.
184.
3.
2Application.
204.
4HeatsinkAdequacyDeterminationProcedure214.
4.
1ProcedureDescription.
214.
4.
2Application.
225ReferenceThermalSolution.
235.
1EnvironmentalReliabilityRequirements.
23AppendixAEnabledSuppliers25AppendixBMechanicalDrawings27R4IntelI/OControllerHub7(ICH7)ThermalDesignGuideFiguresFigure1.
0°AngleAttachMethodology(TopView,NottoScale)14Figure2.
0°AngleAttachHeatsinkModifications(GenericHeatsinkShown,NottoScale)14Figure3.
RecommendedTemperatureMeasurementPlacement(TopView)15Figure4.
RecommendedAirflowandTemperaturePlacement(SideView)15Figure5.
HeatsinkDeterminationChart(Configuration1and4)19Figure6.
HeatsinkDeterminationChart(Configuration2and3)19Figure7.
HeatsinkAdequacyDeterminationChart(Configurations1and4)21Figure8.
HeatsinkAdequacyDeterminationChart(Configurations2and3)22Figure9.
IntelICH7ComponentPackageDrawing28Figure10.
IntelICH7MotherboardReferenceKeep-Out.
29Figure11.
IntelICH7ReferenceHeatsinkExtrusion30Figure12.
IntelICH7ReferenceHeatsinkClip31Figure13.
IntelICH7ReferenceHeatsinkAssembly.
32TablesTable1.
IntelICH7ComponentCaseTemperatureSpecifications10Table2.
IntelICH7ThermalDesignPowerGuidelines.
11Table3.
IntelICH7ConfigurationswithAssociatedConfigurationPowerandDevicesConnected.
17Table4.
ReferenceThermalSolutionEnvironmentalReliabilityRequirements23Table5.
EnabledSuppliersfortheIntelICH7ReferenceHeatsink25RIntelI/OControllerHub7(ICH7)ThermalDesignGuide5RevisionHistoryRev.
No.
DescriptionDate-001InitialRelease.
April2005§R6IntelI/OControllerHub7(ICH7)ThermalDesignGuideIntroductionRIntelI/OControllerHub7(ICH7)ThermalDesignGuide71IntroductionTheobjectiveofthermalmanagementistoensurethatthetemperaturesofallcomponentsinasystemaremaintainedwithinfunctionallimits.
Thefunctionaltemperaturelimitistherangewithinwhichtheelectricalcircuitscanbeexpectedtomeetspecifiedperformancerequirements.
Operationoutsidethefunctionallimitcandegradesystemperformance,causelogicerrors,orcausecomponentand/orsystemdamage.
Temperaturesexceedingthemaximumoperatinglimitsmayresultinirreversiblechangesintheoperatingcharacteristicsofthecomponent.
ThegoalofthisdocumentistoprovideanunderstandingoftheoperatinglimitsoftheIntel82801GBICH7and82801GRICH7RI/OControllerHubs.
Asthecomplexityofcomputersystemsincreases,sodopowerdissipationrequirements.
Theadditionalpowerofnextgenerationsystemsmustbeproperlydissipated.
Heatcanbedissipatedusingimprovedsystemcooling,selectiveuseofducting,and/orpassiveheatsinks.
Thesimplestandmostcost-effectivemethodistoimprovetheinherentsystemcoolingcharacteristicsoftheICH7throughcarefuldesignandplacementoffans,vents,andducts.
Whenadditionalcoolingisrequired,componentthermalsolutionsmaybeimplementedinconjunctionwithsystemthermalsolutions.
Thesizeofthefanorheatsinkcanbevariedtobalancesizeandspaceconstraintswithacousticnoise.
ThisdocumentpresentstheconditionsandrequirementstoproperlydesignacoolingsolutionforsystemsthatimplementtheICH7component.
ProperlydesignedsolutionsprovideadequatecoolingtomaintaintheICH7componentcasetemperatureatorbelowthermalspecifications.
Thisisaccomplishedbyprovidingalowlocal-ambienttemperature,ensuringadequatelocalairflow,andminimizingthecasetolocal-ambientthermalresistance.
BymaintainingtheICH7componentcasetemperatureatorbelowmaximumspecifications,asystemdesignercanensuretheproperfunctionality,performance,andreliabilityofthiscomponent.
Note:ThisdocumentonlyappliestothedesktopimplementationoftheIntelICH7component.
Note:Unlessotherwisespecified,thetermICH7referstotheIntel82801GBICH7and82801GRICH7RI/OControllerHubs.
IntroductionR8IntelI/OControllerHub7(ICH7)ThermalDesignGuide1.
1TerminologyTermDescriptionBGABallGridArray.
Apackagetypedefinedbyaresin-fibersubstratewhereadieismountedandbonded.
Theprimaryelectricalinterfaceisanarrayofsolderballsattachedtothesubstrateoppositethedieandmoldingcompound.
mBGAMiniBallGridArray.
mBGAisasmallerversionoftheBGAwithaballpitchof1.
07mm.
Wirebondedpackagewithdieencasedwithamoldencapsulant.
TCThemeasuredcasetemperatureofacomponent.
Itisgenerallymeasuredatthegeometriccenterofthedieorcase,asspecifiedinthecomponentdocumentation.
TC-MAXThemaximumcase/dietemperature.
TC-MINTheminimumcase/dietemperature.
TDPThermalDesignPowerisspecifiedasthehighestsustainablepowerlevelofmostoralloftherealapplicationsexpectedtoberunonthegivenproduct,basedonextrapolationsinbothhardwareandsoftwaretechnologyoverthelifeofthecomponent.
Thermalsolutionsshouldbedesignedtodissipatethistargetpowerlevel.
TIMThermalInterfaceMaterial:thermallyconductivematerialinstalledbetweentwosurfacestoimproveheattransferandreduceinterfacecontactresistance.
LFMLinearFeetperMinute.
Unitsofairflowvelocity.
PTCPackageThermalCapability.
Thepowerlevelatwhichatorbelowitsvalue,thecomponentdoesnotrequireaheatsinkunderthereferenceboundaryconditionassumptions.
Theta_CAThermalResistancedescribedusingpowerdissipatedbetweentwopoints.
Here,theta_caisdefinedas:(TC–Tambient)/(PowerCA)1.
2ReferenceDocumentsDocumentDocNumber/LocationIntelPentiumDProcessorThermalMechanicalDesignGuidelineshttp://developer.
intel.
com//design/chipsets/designex/306830.
htmIntelI/OControllerHub7(ICH7)FamilyDatasheethttp://developer.
intel.
com//design/chipsets/datashts/307013.
htmVariousSystemThermalDesignSuggestionshttp://www.
formfactors.
org§ProductSpecificationsRIntelI/OControllerHub7(ICH7)ThermalDesignGuide92ProductSpecifications2.
1PackageDescriptionTheICH7componentisavailableina652ball,31mmsquaremBGApackageshowninFigure9inAppendixB.
2.
2ThermalSpecificationsToensureproperoperationandreliabilityoftheICH7component,thecasetemperatureTCmustbeatorbelowthemaximumvalueTC_MaxspecifiedinTable1.
Ifthetemperatureofthecomponentexceedsthemaximumtemperaturelisted,systemorcomponentlevelthermalenhancementsarerequiredtodissipatetheheatgenerated.
ThesystemdesignermustdesignathermalsolutionfortheICH7suchthatitmaintainsTCbelowTC_MaxforsustainedpowerlevelequaltotheThermalDesignpower(TDP).
NotethattheTC_MaxspecificationisarequirementforasustainedpowerlevelequaltoTDP,andthatthecasetemperaturemustbemaintainedattemperatureslessthanTC_MaxwhenoperatingatpowerlevelslessthanTDP.
Thistemperaturecomplianceistoensurechipsetreliabilityoveritsusefullife.
Chapter3providesthethermalmetrologyguidelinesforcasetemperaturemeasurements.
Chapter5providesinformationonthereferencecoolingsolutionforATXsystems.
Intel'sreferenceboundaryconditionsforICH7inanATXsystemare60°Cinletambienttemperatureand0.
25m/s[50lfm]ofairflow.
TheICH7packagewillnotrequireaheatsinkwhenpowerdissipationisatorbelow3.
1W.
ThisvalueisreferredtoasthePackageThermalCapability,orPTC.
Notethatthepowerlevelatwhichaheatsinkisrequiredwillalsochangedependingonsystemlocaloperatingambientconditionsandsystemconfiguration.
Forexample,thelocalinletambientairfortheICH7componentinaBTXsystemisprojectedtobeapproximately55°C.
ForBTXplatformsthathavesimilarboundaryconditionstowhatisstatedabove,ICH7doesnotrequireaheatsink.
Note:ThelocalambientairtemperatureforBTXisaprojectionbasedonanticipatedpowerincreasesona2005platformandaresubjecttochangeinthenextrevisionofthisdocument.
Itisimportanttonote,however,thatsincetheICH7packagehasamoldedplasticencapsulant,andbecauseplasticissuchapoorheatconductor,therelativeimportanceofthemotherboardheattransfercharacteristicsincreases.
TheheattransfercapabilityofthemotherboardintheareaoftheICH7shouldbecharacterized.
KnowledgeoftheseheattransferpathscanbeusedtodetermineifanICH7heatsinkisrequired.
AfuturerevisionofthisdocumentwillincludecharacterizedICH7theta_jadataonaBTXplatformwithunderandaboveboardairflowsensitivitystudies.
Notethatourcurrentthermalspecificationsaccountfortheheattransfercharacteristicsofatypicalmotherboard.
Inaddition,highpowerPCIExpress*graphiccardsmayalterthelocalambienttemperatureaswellastheairflowpatternsinthevicinityofthechipset.
SystemsthathaveinterfaceutilizationlessthanthatoftheTDPconfigurationmaybeatpowerlevelsthatmaynotrequireaheatsink.
ProductSpecificationsR10IntelI/OControllerHub7(ICH7)ThermalDesignGuideThermalvalidationshouldbeperformedintheanticipatedsystemenvironment,inparticularmeasuringtheICH7casetemperaturetoensureitdoesnotexceeditsmaximumcasetemperaturespecification.
ToevaluatethecapabilityofthesystemforcoolingtheICH7,thefollowingsystemleveltestsaresuggestedtoassessICH7casetemperaturecompliancy:1.
Shippingconfiguration(s)withexpectedenduseradd-incardsandI/Operipheralsinstalled.
2.
Allavailableslotsontheboardpopulated(onlyworstcaseifallI/OisfullypopulatedincludingSATA,USB,etc.
).
Forcompleteness,bothroomambientconditions(approximately23°C,tosimulateimpactoffanspeedcontrol)andworsecasemaximumexternaltemperature(35°C)conditionsshouldbeconsideredinthevalidationtestsuite.
IftheICH7casetemperatureisabovethepublishedTC-MAXinanytestscenario,aheatsinkisrequired.
IfitisdeterminedthattheICH7packagerequiresaheatsinkinthesystemconfiguration,refertoAppendixAforthereferenceICH7heatsinkvendorinformation.
ThecomponentshouldbeoperatedabovetheminimumcasetemperaturespecificationlistedinTable1.
Table1.
IntelICH7ComponentCaseTemperatureSpecificationsParameterValueSeeTable2foradditionalconfigurationNoHeatsinkAttached:108°CTC-MAX(Note1below)forTDPconditionof3.
3WSeeTable2foradditionalconfigurationHeatsinkAttached:99°CTC-MIN0°CStorageTemperature-10°Cto+45°CNOTES:1.
Withoutaheatsink,mostoftheheatdissipatedbytheICH7goesthroughthePCB,actingasaheatspreader,andthenintotheambientair.
Whenaheatsinkisinstalledonthepackage,morepowerisnowbeingpulledthroughthecase.
Asaresultthemaximumcasetemperaturemustbemaintainedatlowerlevelthanwithoutaheatsinktomaintainthejunctionwithinspecification.
ProductSpecificationsRIntelI/OControllerHub7(ICH7)ThermalDesignGuide112.
3PowerSpecificationsTheICH7componentisestimatedtodissipatetheThermalDesignPower(TDP)valueprovidedinTable2.
ThisTDPvalueisestimatedbasedonvariousfactorsincluding:systemconfiguration,industrystressapplications,dietemperature,andpart-to-partvariance.
Note:Table2reflectspost-siliconvalidatedpowernumbers.
Table2.
IntelICH7ThermalDesignPowerGuidelinesConfigurationConfig1:TDPConfig2Config3Config4USB(HS/FS)16/26/26/28PCIExpress4214SATA3444PATA22221222DevicesPCI3333ConfigurationBasedPower33.
3W3W2.
9W3.
3WNoHeatsink108°C109°C109°C108°CTC-MAXWithHeatsink99°C100°C100°C99°CNOTES:1.
USBHS=USB2.
0HighSpeedDevice(480Mb/s),USBFS=USB2.
0FullSpeedDevice(12Mb/s)2.
Thecontrollerisusedwithuptotwodrivesconnected.
3.
Referstothepowerofeachlistedconfiguration.
Configuration1isthetypicalconfigurationforThermalDesignPower.
§ProductSpecificationsR12IntelI/OControllerHub7(ICH7)ThermalDesignGuideThermalMetrologyRIntelI/OControllerHub7(ICH7)ThermalDesignGuide133ThermalMetrologyThesystemdesignermustmaketemperaturemeasurementstoaccuratelydeterminethethermalperformanceofthesystem.
Intelhasestablishedguidelinesmeasuringchipsetcomponentcasetemperatures.
3.
1CaseTemperatureMeasurementsToensurefunctionalityandreliability,thechipsetcomponentisspecifiedforproperoperationwhenTCismaintainedatorbelowthemaximumtemperaturelistedinTable1.
ThesurfacetemperatureatthegeometriccenterofthemoldencapsulantcorrespondstoTC.
MeasuringTCrequiresspecialcaretoensureanaccuratetemperaturemeasurement.
Temperaturedifferencesbetweenthetemperatureofasurfaceandthesurroundinglocalambientaircanintroduceerrorinthemeasurements.
Themeasurementerrorscouldbeduetoapoorthermalcontactbetweenthethermocouplejunctionandthesurfaceofthepackage,heatlossbyradiationand/orconvection,and/orconductionthroughthermocoupleleads.
Tominimizethesemeasurementerrors,theapproachdescribedinSection3.
2isrecommendedforthermocoupleattach.
3.
20°AngleThermocoupleAttachMethodology1.
Milla3.
3mm[0.
13in]diameterholecenteredonbottomoftheheatsinkbase.
Themilledholeshouldbeapproximately1.
5mm[0.
06in]deep.
2.
Milla1.
3mm[0.
05in]wideslot,0.
5mm[0.
02in]deep,fromthecenteredholetooneedgeoftheheatsink.
Theslotshouldbeinthedirectionparalleltotheheatsinkfins(seeFigure2).
3.
Attachthermalinterfacematerial(TIM)tothebottomoftheheatsinkbase.
4.
CutoutportionsoftheTIMtomakeroomforthethermocouplewireandbead.
Thecutoutsshouldmatchtheslotandholemilledintotheheatsinkbase.
5.
Attacha36gaugeorsmallercalibratedK-typethermocouplebeadorjunctiontothecenterofthetopsurfaceofthecaseusingahighthermalconductivitycement.
Duringthisstep,makesurenocontactispresentbetweenthethermocouplecementandtheheatsinkbasebecauseanycontactwillaffectthethermocouplereading.
Itiscriticalthatthethermocouplebeadmakescontactwiththecase(seeFigure1).
6.
Attachheatsinkassemblytothe(G)MCH,androutethermocouplewiresoutthroughthemilledslot.
ThermalMetrologyR14IntelI/OControllerHub7(ICH7)ThermalDesignGuideFigure1.
0°AngleAttachMethodology(TopView,NottoScale)Figure2.
0°AngleAttachHeatsinkModifications(GenericHeatsinkShown,NottoScale)3.
3AmbientTemperatureandAirflowMeasurementFigure3describestherecommendedlocationforairtemperaturemeasurementsmeasuredrelativetothecomponent.
Foramoreaccuratemeasurementoftheaverageapproachairtemperature,Intelrecommendsaveragingtemperaturesrecordedfromtwothermocouplesspacedabout25mm[1.
0in]apart.
Locationsforbothasinglethermocoupleandapairofthermocouplesarepresented.
Airflowvelocityshouldbemeasuredusingindustrystandardairvelocitysensors.
Typicalairflowsensortechnologymayincludehotwireanemometers.
Figure4providesguidanceforairflowvelocitymeasurementlocations.
TheselocationsareforatypicalJEDECtestsetupandmaynotbecompatiblewithallchassislayoutsduetotheproximityoftheprocessortothe(G)MCH,PCIandPCI-Express*add-incards.
Theusermayhavetoadjustthelocationsforaspecificchassis.
Beawarethatsensorsmayneedtobealignedperpendiculartotheairflowvelocityvectororaninaccuratemeasurementmayresult.
Measurementsshouldbetakenwiththechassisfullysealedinitsoperationalconfigurationtoachievearepresentativeairflowprofilewithinthechassis.
ThermalMetrologyRIntelI/OControllerHub7(ICH7)ThermalDesignGuide15Figure3.
RecommendedTemperatureMeasurementPlacement(TopView)13mm(0.
5in)13mm(0.
5in)CLSingleT/ClocationICHpackageT/CpairlocationT/CpairlocationTopViewFigure4.
RecommendedAirflowandTemperaturePlacement(SideView)H/2HSideViewAirflowICHHeatsink,ifrequired§ThermalMetrologyR16IntelI/OControllerHub7(ICH7)ThermalDesignGuideAlternativeHeatsinkDeterminationGuidanceRIntelI/OControllerHub7(ICH7)ThermalDesignGuide174AlternativeHeatsinkDeterminationGuidanceOftenthesystemintegratorwillhaveasystemenvironmentthatdiffersfromthereferenceboundaryconditionsaslistedinSection2.
2.
Thischapterprovidesadditionalguidanceon:1)Makingaheatsinkdecision(Section4.
3),and2)Determiningifapre-selectedheatsinkisadequate(Section4.
4)inmeetingIntelICH7specificationsbasedontheboundaryconditionsasmeasuredinyourspecificsystem.
NotethattheguidancemethodologyinthissectionismeanttosupplementthespecificationslistedinChapter2,anduseoftheinformationinthissectionisoptional.
Chapter2providesthecasetemperaturespecificationsfortheTDPconfigurationaswellasotherconfigurationsofinterestwhileoperatingundertheIntelreferenceboundaryconditionsasstatedinSection2.
2.
IfthesystemintegratorbelievesthatIntel'sreferenceboundaryconditionscorrectlyreflecttheconditionsintheirownsystem,theguidanceinthischapterdoesnotneedtobeused.
4.
1ConfigurationsSupportedinthisMethodologyTheheatsinkdeterminationmethodologypresentedbelowrequiresconfiguringyoursystemtooneoftheconfigurationslistedinTable3andthenmeasuringtheICH7casetemperatureandcomparingittothechartsinFigure5andFigure6foreachconfiguration.
Table3.
IntelICH7ConfigurationswithAssociatedConfigurationPowerandDevicesConnectedDevices(s)ConfigurationPower(W)USB(HS/FS)1PCIExpress*SATAPATAPCIConfig1:TDP3.
36/24323Config23.
06/22423Config32.
96/21413Config43.
384423NOTES:1.
USBHS=USB2.
0HighSpeedDevice(480Mb/s),USBFS=USB2.
0FullSpeedDevice(12Mb/s)AlternativeHeatsinkDeterminationGuidanceR18IntelI/OControllerHub7(ICH7)ThermalDesignGuide4.
2SystemConfigurationforTCAnalysisSystemperipheralssuchasadd-incardsandcablescaneffectthesystemenvironment,therebychangingtheeffectivecoolingcapabilityofthesystem.
Asaresult,theIDLETCmeasurementmustbetakenwiththesystempopulatedasitisintendedtoshiptoendcustomers.
Examplesofsystemperipheralsthatwillbeincluded(butarenotlimitedto)arethefollowing:PCI-Express*Graphicsadd-incardOthervariousPCICardsIDE/SATAStorageDrivesThermalsolutionassemblycomponents(heatsink,fan,duct)Notethatnothingspecificneedstobedonewiththefollowing:LANConnectInterfaceAC'97/HDAudio4.
3HeatsinkDeterminationProcedureThefollowinginformationdetailshowasystemintegratorcanassesswhetherornottheyrequireaheatsinkontheirplatforms.
RefertoSection4.
4ifyouhavealreadyselectedaheatsinkandneedtoassesswhetherornotitisadequate.
Note:TheICH7casetemperature,ambienttemperature,andairflowshouldbemeasuredaccordingtotheguidanceprovidedinChapter3:ThermalMetrology.
4.
3.
1ProcedureDescriptionTodetermineifaheatsinkisneededonICH7,followthefollowingsteps:1.
ConfiguresystemtomatchoneoftheconfigurationslistedinTable3.
2.
Bootsystemandallowsystemtoreachsteadystatetemperature.
3.
MeasureICH7casetemperature(C),ambienttemperature(C),andairflow(LFM)duringtest.
RefertoChapter3forthermalmetrologyforambienttemperatureandairflow.
4.
UseassociatedconfigurationplotinFigure5(Configurations1or4)orFigure6(Configurations2or3).
ThenplotthemeasuredICH7casetemperaturewiththemeasuredairflow(LFM)onthechart.
5.
ComparethefinalmeasurementdatapointtoIntel'sTC_maxspecificationline(asafunctionofambienttemperature)asindicatedbytheplot.
6.
IfdatapointisabovetheTC_maxspecificationline,additionalcoolingisrequired.
IfyourdatapointisbelowtheTC_maxspecificationline,additionalcoolingisnotrequired(Seefollowingchartsforausageexample).
AlternativeHeatsinkDeterminationGuidanceRIntelI/OControllerHub7(ICH7)ThermalDesignGuide19Figure5.
HeatsinkDeterminationChart(Configuration1and4)Configurations1and4NoHeatSink106.
0107.
0108.
0109.
0110.
0111.
0112.
0050100150200250LFMTcase.
maxmeasured/Tcase,max(°C)Tamb=40CTamb=50CTamb=60CFigure6.
HeatsinkDeterminationChart(Configuration2and3)Configurations2and3NoHeatSink105.
0106.
0107.
0108.
0109.
0110.
0111.
0112.
0050100150200250LFMTcase.
maxmeasured/Tcase,max(°C)Tamb=40CTamb=50CTamb=60CAlternativeHeatsinkDeterminationGuidanceR20IntelI/OControllerHub7(ICH7)ThermalDesignGuide4.
3.
2ApplicationAssumesystemconfiguredtomatchConfiguration1(TDPconfiguration)withnoheatsinkonICH7:1.
Bootsystem2.
MeasuredmaximumICH7casetemperatureatsteadystate=107°C,ambienttemperature=40°C,measuredairflow=100LFM.
3.
UsechartinFigure5toplotmeasuredcasetemperatureandairflow(LFM).
Thus,107°CTCtemperature,100LFMwasmeasured.
Seegreenstarformeasurementlocationonchart.
Configurations1and4NoHeatSink106.
0107.
0108.
0109.
0110.
0111.
0112.
0050100150200250LFMTcase.
maxmeasured/Tcase,max(°C)Tamb=40CTamb=50CTamb=60CComparethefinalmeasurementdatapointtoIntel'sTC_maxspecificationline(asafunctionofyourmeasuredambienttemperature=40°C)asindicatedbythedarkblueline"Tamb=40C".
Ourgreenstarmeasurementlocationisbelowtheambienttemperaturelineof40°C;therefore,additionalcoolingisnotrequired.
4aPassAlternativeHeatsinkDeterminationGuidanceRIntelI/OControllerHub7(ICH7)ThermalDesignGuide214.
4HeatsinkAdequacyDeterminationProcedureThefollowingsectiondetailshowasystemintegratorcanassesswhetherornottheselectedheatsinkmeetsIntelspecificationsforICH7.
RefertoSection4.
3ifyoudonothaveaheatsinkandneedtoassesswhetheroneisrequired.
Note:TheICH7casetemperature,ambienttemperature,andairflowshouldbemeasuredaccordingtotheguidanceprovidedinChapter3.
4.
4.
1ProcedureDescriptionTodetermineiftheheatsinkmeetsIntelspecificationsforICH7,followthefollowingsteps:1.
ConfiguresystemtomatchoneoftheconfigurationslistedinTable3.
2.
Bootsystemandallowsystemtoreachsteadystatetemperature.
3.
MeasureICH7casetemperature(C),ambienttemperature(C),andairflow(LFM)duringtest.
RefertoChapter3forambienttemperatureandairflowthermalmetrology.
4.
UseassociatedconfigurationplotinFigure7(Configurations1or4)orFigure8(Configurations2or3).
ThenplotthemeasuredICH7casetemperaturewiththepredictive(orvalidated)heatsinktheta_ca(°C/W)onthechart.
5.
ComparethefinalmeasurementdatapointtoIntel'sTC_maxspecificationline(asafunctionofambienttemperature)asindicatedbytheplot.
6.
IfthedatapointisabovetheTC_maxspecificationline,additionalcoolingisrequired.
IfyourdatapointisbelowtheTC_maxspecificationline,additionalcoolingisnotrequired(seefollowingusageexample).
Figure7.
HeatsinkAdequacyDeterminationChart(Configurations1and4)Configurations1and4HeatSinkApplied92.
094.
096.
098.
0100.
0102.
0104.
0106.
0108.
005101520253035404550Theta_CA(C/W)Tcase.
maxmeasured/Tcase,max(°C)Tamb=40CTamb=50CTamb=60CAlternativeHeatsinkDeterminationGuidanceR22IntelI/OControllerHub7(ICH7)ThermalDesignGuideFigure8.
HeatsinkAdequacyDeterminationChart(Configurations2and3)Configuration2and3HeatSinkApplied90.
092.
094.
096.
098.
0100.
0102.
0104.
0106.
0108.
005101520253035404550Theta_CA(C/W)Tcase.
maxmeasured/Tcase,max(°C)Tamb=40CTamb=50CTamb=60C4.
4.
2ApplicationSystemconfiguredtomatchConfiguration2withsystemintegrator'sselectedheatsinkonICH7:1.
Bootsystem2.
MeasuredmaximumICH7casetemperatureatsteadystate=103°C,ambienttemperature=40°C,measuredtheta_ca=22°C/W.
3.
UsechartinFigure8toplotmeasuredcasetemperatureandtheta_ca(°C/W).
Thus,103°CTCtemperature,theta_ca=22°C/Wwasmeasured.
Seegreenstarformeasurementlocationonchart.
Configuration2and3HeatSinkApplied90.
092.
094.
096.
098.
0100.
0102.
0104.
0106.
0108.
005101520253035404550Theta_CA(C/W)Tcase.
maxmeasured/Tcase,max(°C)Tamb=40CTamb=50CTamb=60CComparethefinalmeasurementdatapointtoIntel'sTC_maxspecificationline(asafunctionofyourmeasuredambienttemperature=40°C)asindicatedbythedarkblueline("Tamb=40C").
Ourgreenstarmeasurementlocationisabovetheambienttemperaturelineof40°C;therefore,theselectedheatsinkisinadequate,andadditionalcoolingisrequired.
§ReferenceThermalSolutionRIntelI/OControllerHub7(ICH7)ThermalDesignGuide235ReferenceThermalSolutionTheICH7referencesolutiononanATXplatformassumesacomponentlocaloperatingenvironmentwithamaximumlocal-ambienttemperatureof60°Candairflowof0.
25m/s[50lfm].
Intheseconditions,withtheTDPprojectiongiveninTable2,theICH7componentrequiresanattachedheatsinktomeetthermalspecifications.
Thelocal-ambientconditionsarebasedona35°Cexternal-ambienttemperatureatsealevel,whereexternal-ambientreferstotheenvironmentexternaltothesystem.
RefertoAppendixAforenabledsuppliersfortheICH7referencethermalsolutionandAppendixBforreferencethermalsolutionmechanicaldrawings.
NotethatthereferenceheatsinkforICH7isidenticaltothereferenceheatsinkfortheIntelICH6.
RefertoFigure10forreferenceATX/ATXmotherboardkeep-outinformation.
Theheatsinkcanbetape-attached,orattachedwithaZ-clip.
Thismotherboardkeep-outallowsaZ-clipheatsinkattach.
5.
1EnvironmentalReliabilityRequirementsIfanattachedheatsinkisimplementedduetoaseverecomponentlocaloperatingenvironment,thereliabilityrequirementsinTable4arerecommended.
Themechanicalloadingofthecomponentmayvarydependingontheheatsink,andattachmethodused.
Theusershoulddefinevalidationtestbasedonanticipateduseconditionsandresultingreliabilityrequirements.
Table4.
ReferenceThermalSolutionEnvironmentalReliabilityRequirementsTest1RequirementPass/FailCriteria2MechanicalShock3dropsfor+and-directionsineachof3perpendicularaxes(i.
e.
,total18drops).
Profile:50Gtrapezoidalwaveform,11msduration,170inches/secminimumvelocitychange.
Setup:Mountsampleboardontestfixture.
Visual\ElectricalCheckRandomVibrationDuration:10min/axis,3axesFrequencyRange:5Hzto500HzPowerSpectralDensity(PSD)Profile:3.
13gRMSVisual/ElectricalCheckThermalCycling-40°Cto+85°C,1000cyclesVisualCheckTemperatureLife85°C,1000hourstotalVisual/ElectricalCheckUnbiasedHumidity85%relativehumidity/55°C,1000hoursVisualCheckNOTES:1.
Theabovetestsshouldbeperformedonasamplesizeofatleast12assembliesfrom3differentlotsofmaterial.
2.
AdditionalPass/FailCriteriamaybeaddedatthediscretionoftheuser.
§ReferenceThermalSolutionR24IntelI/OControllerHub7(ICH7)ThermalDesignGuideEnabledSuppliersRIntelI/OControllerHub7(ICH7)ThermalDesignGuide25AppendixAEnabledSuppliersEnabledsuppliersfortheICH7ReferencethermalsolutionarelistedinTable5.
Table5.
EnabledSuppliersfortheIntelICH7ReferenceHeatsinkSupplierIntelPartNumberVendorPartNumberContactInformationCCI*(Chaun-ChoungTechnologyCorp.
)C46655-00100C855802BTaiwan:MonicaChiEmail:monica_chih@ccic.
com.
twTel:+886-22-995-2666Ext131USA:HarryLinEmail:HLINACK@aol.
comTel:(714)739-5797FoxconnC46655-0012Z802-009USA:JackChen,PH.
DEmail:rongchechen@foxconn.
comTel:(714)626-1233Note:ThesevendorsanddevicesarelistedbyIntelasaconveniencetoIntel'sgeneralcustomerbase,butInteldoesnotmakeanyrepresentationsorwarrantieswhatsoeverregardingquality,reliability,functionality,orcompatibilityofthesedevices.
Thislistand/orthesedevicesmaybesubjecttochangewithoutnotice.
§EnabledSuppliersR26IntelI/OControllerHub7(ICH7)ThermalDesignGuideMechanicalDrawingsRIntelI/OControllerHub7(ICH7)ThermalDesignGuide27AppendixBMechanicalDrawingsThefollowingtableliststhemechanicaldrawingsavailableinthisdocument:DrawingNamePageNumberIntelICH7ComponentPackageDrawing28IntelICH7MotherboardReferenceKeep-Out29IntelICH7ReferenceHeatsinkExtrusion30IntelICH7ReferenceHeatsinkClip31IntelICH7ReferenceHeatsinkAssembly32MechanicalDrawingsR28IntelI/OControllerHub7(ICH7)ThermalDesignGuideFigure9.
IntelICH7ComponentPackageDrawingRMechanicalDrawingsIntelI/OControllerHub7(ICH7)ThermalDesignGuide29Figure10.
IntelICH7MotherboardReferenceKeep-OutMechanicalDrawingsR30IntelI/OControllerHub7(ICH7)ThermalDesignGuideFigure11.
IntelICH7ReferenceHeatsinkExtrusionRMechanicalDrawingsIntelI/OControllerHub7(ICH7)ThermalDesignGuide31Figure12.
IntelICH7ReferenceHeatsinkClipMechanicalDrawingsR32IntelI/OControllerHub7(ICH7)ThermalDesignGuideFigure13.
IntelICH7ReferenceHeatsinkAssembly