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2015MicrochipTechnologyInc.
DS50002417AMCP9600ThermocoupleICEvaluationBoardUser'sGuide2015MicrochipTechnologyInc.
DS50002417A-page2Informationcontainedinthispublicationregardingdeviceapplicationsandthelikeisprovidedonlyforyourconvenienceandmaybesupersededbyupdates.
Itisyourresponsibilitytoensurethatyourapplicationmeetswithyourspecifications.
MICROCHIPMAKESNOREPRESENTATIONSORWARRANTIESOFANYKINDWHETHEREXPRESSORIMPLIED,WRITTENORORAL,STATUTORYOROTHERWISE,RELATEDTOTHEINFORMATION,INCLUDINGBUTNOTLIMITEDTOITSCONDITION,QUALITY,PERFORMANCE,MERCHANTABILITYORFITNESSFORPURPOSE.
Microchipdisclaimsallliabilityarisingfromthisinformationanditsuse.
UseofMicrochipdevicesinlifesupportand/orsafetyapplicationsisentirelyatthebuyer'srisk,andthebuyeragreestodefend,indemnifyandholdharmlessMicrochipfromanyandalldamages,claims,suits,orexpensesresultingfromsuchuse.
Nolicensesareconveyed,implicitlyorotherwise,underanyMicrochipintellectualpropertyrightsunlessotherwisestated.
NotethefollowingdetailsofthecodeprotectionfeatureonMicrochipdevices:MicrochipproductsmeetthespecificationcontainedintheirparticularMicrochipDataSheet.
Microchipbelievesthatitsfamilyofproductsisoneofthemostsecurefamiliesofitskindonthemarkettoday,whenusedintheintendedmannerandundernormalconditions.
Therearedishonestandpossiblyillegalmethodsusedtobreachthecodeprotectionfeature.
Allofthesemethods,toourknowledge,requireusingtheMicrochipproductsinamanneroutsidetheoperatingspecificationscontainedinMicrochip'sDataSheets.
Mostlikely,thepersondoingsoisengagedintheftofintellectualproperty.
Microchipiswillingtoworkwiththecustomerwhoisconcernedabouttheintegrityoftheircode.
NeitherMicrochipnoranyothersemiconductormanufacturercanguaranteethesecurityoftheircode.
Codeprotectiondoesnotmeanthatweareguaranteeingtheproductas"unbreakable.
"Codeprotectionisconstantlyevolving.
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AttemptstobreakMicrochip'scodeprotectionfeaturemaybeaviolationoftheDigitalMillenniumCopyrightAct.
Ifsuchactsallowunauthorizedaccesstoyoursoftwareorothercopyrightedwork,youmayhavearighttosueforreliefunderthatAct.
MicrochipreceivedISO/TS-16949:2009certificationforitsworldwideheadquarters,designandwaferfabricationfacilitiesinChandlerandTempe,Arizona;Gresham,OregonanddesigncentersinCaliforniaandIndia.
TheCompany'squalitysystemprocessesandproceduresareforitsPICMCUsanddsPICDSCs,KEELOQcodehoppingdevices,SerialEEPROMs,microperipherals,nonvolatilememoryandanalogproducts.
Inaddition,Microchip'squalitysystemforthedesignandmanufactureofdevelopmentsystemsisISO9001:2000certified.
QUALITYMANAGEMENTSYSTEMCERTIFIEDBYDNV==ISO/TS16949==TrademarksTheMicrochipnameandlogo,theMicrochiplogo,dsPIC,FlashFlex,flexPWR,JukeBlox,KEELOQ,KEELOQlogo,Kleer,LANCheck,MediaLB,MOST,MOSTlogo,MPLAB,OptoLyzer,PIC,PICSTART,PIC32logo,RightTouch,SpyNIC,SST,SSTLogo,SuperFlashandUNI/OareregisteredtrademarksofMicrochipTechnologyIncorporatedintheU.
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andothercountries.
TheEmbeddedControlSolutionsCompanyandmTouchareregisteredtrademarksofMicrochipTechnologyIncorporatedintheU.
S.
A.
Analog-for-the-DigitalAge,BodyCom,chipKIT,chipKITlogo,CodeGuard,dsPICDEM,dsPICDEM.
net,ECAN,In-CircuitSerialProgramming,ICSP,Inter-ChipConnectivity,KleerNet,KleerNetlogo,MiWi,motorBench,MPASM,MPF,MPLABCertifiedlogo,MPLIB,MPLINK,MultiTRAK,NetDetach,OmniscientCodeGeneration,PICDEM,PICDEM.
net,PICkit,PICtail,RightTouchlogo,REALICE,SQI,SerialQuadI/O,TotalEndurance,TSHARC,USBCheck,VariSense,ViewSpan,WiperLock,WirelessDNA,andZENAaretrademarksofMicrochipTechnologyIncorporatedintheU.
S.
A.
andothercountries.
SQTPisaservicemarkofMicrochipTechnologyIncorporatedintheU.
S.
A.
SiliconStorageTechnologyisaregisteredtrademarkofMicrochipTechnologyInc.
inothercountries.
GestICisaregisteredtrademarkofMicrochipTechnologyGermanyIIGmbH&Co.
KG,asubsidiaryofMicrochipTechnologyInc.
,inothercountries.
Allothertrademarksmentionedhereinarepropertyoftheirrespectivecompanies.
2015,MicrochipTechnologyIncorporated,PrintedintheU.
S.
A.
,AllRightsReserved.
ISBN:978-1-63277-748-52015MicrochipTechnologyInc.
DS50002417A-page3ObjectofDeclaration:MCP9600ThermocoupleICEvaluationBoardDS50002417A-page42015MicrochipTechnologyInc.
NOTES:MCP9600THERMOCOUPLEICEVALUATIONBOARDUSER'SGUIDE2015MicrochipTechnologyInc.
DS50002417A-page5TableofContentsPreface7Introduction.
7DocumentLayout7ConventionsUsedinThisGuide.
8RecommendedReading.
9TheMicrochipWebSite9CustomerSupport9RevisionHistory9Chapter1.
ProductOverview1.
1Introduction111.
2WhatistheMCP9600Device111.
3WhatistheMCP9600ThermocoupleICEvaluationBoard111.
4WhattheMCP9600ThermocoupleICEvaluationBoardKitContains11Chapter2.
InstallationandOperation2.
1Introduction132.
2RequiredTool132.
3GettingStarted142.
3.
1HardwareSetup142.
3.
2HardwareOperation142.
4MicrochipThermalManagementSoftwareGUI152.
5ConfiguringtheMCP9600172.
6DataAcquisition18AppendixA.
SchematicandLayoutsA.
1Introduction19A.
2BoardSchematic20A.
3Board–TopSilk21A.
4Board–TopCopperandSilk21A.
5Board–TopCopper22A.
6Board–BottomCopper22A.
7Board–BottomCopperandSilk23A.
8Board–BottomSilk23AppendixB.
BillofMaterials(BOM)25WorldwideSalesandService28MCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page62015MicrochipTechnologyInc.
NOTES:MCP9600THERMOCOUPLEICEVALUATIONBOARDUSER'SGUIDE2015MicrochipTechnologyInc.
DS50002417A-page7PrefaceINTRODUCTIONThischaptercontainsgeneralinformationthatwillbeusefultoknowbeforeusingtheMCP9600ThermocoupleICEvaluationBoard.
Itemsdiscussedinthischapterinclude:DocumentLayoutConventionsUsedinThisGuideRecommendedReadingTheMicrochipWebSiteCustomerSupportRevisionHistoryDOCUMENTLAYOUTThisdocumentdescribeshowtousetheMCP9600ThermocoupleICEvaluationBoardasadevelopmenttool.
Thedocumentisorganizedasfollows:Chapter1.
"ProductOverview"–ThischapterincludesimportantinformationabouttheMCP9600ThermocoupleICEvaluationBoard.
Chapter2.
"InstallationandOperation"–Thischapterincludesadetaileddescriptionofeachfunctionoftheevaluationboardandinstructionsonhowtobeginusingtheboard.
AppendixA.
"SchematicandLayouts"–ShowstheschematicandlayoutdiagramsforMCP9600ThermocoupleICEvaluationBoard.
AppendixB.
"BillofMaterials(BOM)"–ListsthepartsusedtobuildtheMCP9600ThermocoupleICEvaluationBoard.
NOTICETOCUSTOMERSAlldocumentationbecomesdated,andthismanualisnoexception.
Microchiptoolsanddocumentationareconstantlyevolvingtomeetcustomerneeds,sosomeactualdialogsand/ortooldescriptionsmaydifferfromthoseinthisdocument.
Pleaserefertoourwebsite(www.
microchip.
com)toobtainthelatestdocumentationavailable.
Documentsareidentifiedwitha"DS"number.
Thisnumberislocatedonthebottomofeachpage,infrontofthepagenumber.
ThenumberingconventionfortheDSnumberis"DSXXXXXXXXA",where"XXXXXXXX"isthedocumentnumberand"A"istherevisionlevelofthedocument.
Forthemostup-to-dateinformationondevelopmenttools,seetheMPLABIDEonlinehelp.
SelecttheHelpmenu,andthenTopicstoopenalistofavailableonlinehelpfiles.
MCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page82015MicrochipTechnologyInc.
CONVENTIONSUSEDINTHISGUIDEThismanualusesthefollowingdocumentationconventions:DOCUMENTATIONCONVENTIONSDescriptionRepresentsExamplesArialfont:ItaliccharactersReferencedbooksMPLABIDEUser'sGuideEmphasizedtext.
.
.
istheonlycompiler.
.
.
InitialcapsAwindowtheOutputwindowAdialogtheSettingsdialogAmenuselectionselectEnableProgrammerQuotesAfieldnameinawindowordialog"Saveprojectbeforebuild"Underlined,ItalictextwithrightanglebracketAmenupathFile>SaveBoldcharactersAdialogbuttonClickOKAtabClickthePowertabN'RnnnnAnumberinverilogformat,whereNisthetotalnumberofdigits,Ristheradixandnisadigit.
4'b0010,2'hF1TextinanglebracketsAkeyonthekeyboardPress,CourierNewfont:PlainCourierNewSamplesourcecode#defineSTARTFilenamesautoexec.
batFilepathsc:\mcc18\hKeywords_asm,_endasm,staticCommand-lineoptions-Opa+,-Opa-Bitvalues0,1Constants0xFF,'A'ItalicCourierNewAvariableargumentfile.
o,wherefilecanbeanyvalidfilenameSquarebrackets[]Optionalargumentsmcc18[options]file[options]Curlybracketsandpipecharacter:{|}Choiceofmutuallyexclusivearguments;anORselectionerrorlevel{0|1}Ellipses.
.
.
Replacesrepeatedtextvar_name[,var_name.
.
.
]Representscodesuppliedbyuservoidmain(void){.
.
.
}Preface2015MicrochipTechnologyInc.
DS50002417A-page9RECOMMENDEDREADINGThisuser'sguidedescribeshowtouseMCP9600ThermocoupleICEvaluationBoard.
Otherusefuldocumentsarelistedbelow.
ThefollowingMicrochipdocumentsareavailableandrecommendedassupplementalreferenceresources:MCP9600DataSheet–"ThermocoupleVoltagetoTemperatureConverter,±1.
5°CMaximumAccuracy"(DS20005426)ThisdatasheetprovidesdetailedinformationregardingtheMCP9600device.
PIC18F2455/2550/4455/4550DataSheet–"28/40/44-Pin,High-Performance,EnhancedFlash,USBMicrocontrollerswithnanoWattTechnology"(DS39632)ThisdatasheetprovidesdetailedinformationregardingthePIC18F2455/2550/4455/4550devices.
THEMICROCHIPWEBSITEMicrochipprovidesonlinesupportviaourwebsiteatwww.
microchip.
com.
Thiswebsiteisusedasameanstomakefilesandinformationeasilyavailabletocustomers.
AccessiblebyusingyourfavoriteInternetbrowser,thewebsitecontainsthefollowinginformation:ProductSupport–Datasheetsanderrata,applicationnotesandsampleprograms,designresources,user'sguidesandhardwaresupportdocuments,latestsoftwarereleasesandarchivedsoftwareGeneralTechnicalSupport–FrequentlyAskedQuestions(FAQs),technicalsupportrequests,onlinediscussiongroups,MicrochipconsultantprogrammemberlistingBusinessofMicrochip–Productselectorandorderingguides,latestMicrochippressreleases,listingofseminarsandevents,listingsofMicrochipsalesoffices,distributorsandfactoryrepresentativesCUSTOMERSUPPORTUsersofMicrochipproductscanreceiveassistancethroughseveralchannels:DistributororRepresentativeLocalSalesOfficeFieldApplicationEngineer(FAE)TechnicalSupportCustomersshouldcontacttheirdistributor,representativeorfieldapplicationengineer(FAE)forsupport.
Localsalesofficesarealsoavailabletohelpcustomers.
Alistingofsalesofficesandlocationsisincludedinthebackofthisdocument.
Technicalsupportisavailablethroughthewebsiteat:http://www.
microchip.
com/support.
REVISIONHISTORYRevisionA(September2015)Originalreleaseofthisdocument.
MCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page102015MicrochipTechnologyInc.
NOTES:MCP9600THERMOCOUPLEICEVALUATIONBOARDUSER'SGUIDE2015MicrochipTechnologyInc.
DS50002417A-page11Chapter1.
ProductOverview1.
1INTRODUCTIONThischapterprovidesanoverviewoftheMCP9600ThermocoupleICEvaluationBoardandcoversthefollowingtopics:WhatistheMCP9600DeviceWhatistheMCP9600ThermocoupleICEvaluationBoardWhattheMCP9600ThermocoupleICEvaluationBoardKitContains1.
2WHATISTHEMCP9600DEVICETheMCP9600isaThermocoupleElectromotiveForce(EMF)totemperatureconverter.
ThisdeviceconvertsthermocoupleEMFtodegreeCelsiuswithintegratedCold-Junctioncompensation.
MCP9600correctsthethermocouplenonlinearerrorcharacteristicsofeightthermocoupletypesandoutputs±1.
5°Caccuratetemperaturedatafortheselectedthermocouple.
ThecorrectioncoefficientsarederivedfromtheNationalInstituteofStandardsandTechnology(NIST)ITS-90ThermocoupleDatabase.
1.
3WHATISTHEMCP9600THERMOCOUPLEICEVALUATIONBOARDTheMCP9600ThermocoupleICEvaluationBoardisusedtoevaluateMCP9600ThermocoupleEMFvoltagetodegreeCelsiusconverter.
UserscaneasilyevaluatealldevicefeaturesusingaTypeKthermocouple.
ThedevicealsosupportsTypesJ,T,N,E,B,SandRthermocouples.
EachofthesetypescanbeevaluatedbyreplacingtheTypeKthermocoupleconnectorwiththecorrespondingconnectors.
Inaddition,theMCP9600ThermocoupleICEvaluationBoardconnectstoaPCviaaUSBinterface.
Temperaturecanbedata-loggedusingtheMicrochipThermalManagementSoftwareGraphicalUserInterface(GUI).
1.
4WHATTHEMCP9600THERMOCOUPLEICEVALUATIONBOARDKITCONTAINSTheMCP9600ThermocoupleICEvaluationBoardpackageincludes:MCP9600ThermocoupleICEvaluationBoard(ADM00665)TypeKThermocoupleMiniUSBCableImportantInformationSheetMCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page122015MicrochipTechnologyInc.
NOTES:MCP9600THERMOCOUPLEICEVALUATIONBOARDUSER'SGUIDE2015MicrochipTechnologyInc.
DS50002417A-page13Chapter2.
InstallationandOperation2.
1INTRODUCTIONTheMCP9600ThermocoupleICEvaluationBoardenablesuserstoeasilyevaluatealluser-programmablefeaturessuchasthermocoupleselection,temperaturealertlimitsettings,temperatureresolutionsandPowermode.
Itemsdiscussedinthischapterinclude:RequiredToolGettingStartedMicrochipThermalManagementSoftwareGUIConfiguringtheMCP9600DataAcquisition2.
2REQUIREDTOOLThePersonalComputer(PC)showninFigure2-1needstorunonWindows98SEorlater.
Itprovidesaconvenientinterfacefortheuser,communicateswiththeboardandprovidespowerthroughtheUSBconnection.
FIGURE2-1:MCP9600ThermocoupleICEvaluationBoardSetup.
MCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page142015MicrochipTechnologyInc.
2.
3GETTINGSTARTEDThissectiondescribeshowtopowerupandinterfacewiththeMCP9600ThermocoupleICEvaluationBoard.
2.
3.
1HardwareSetup1.
TheMCP9600ThermocoupleICEvaluationBoardhasaminiUSBconnectorforaPCinterface.
ConnecttheUSBcablefromtheevaluationboardtoaPC.
FIGURE2-2:MCP9600ThermocoupleICEvaluationBoard.
2.
3.
2HardwareOperationTheMCP9600ThermocoupleICEvaluationBoardisfullypoweredfromaPCUSB5Vsource.
OncepowerisappliedviaUSBandtheUSBissuccessfullyenumerated,thePICmicrocontrollerisreadytoreceivecommandsfromthehostPCtoprogramtheMCP9600settingsortransfertemperaturedata.
FIGURE2-3:FunctionalBlockDiagram.
MiniUSBconnectorPIC18F2550PCUSBInterface4AlertOutputTestPointsI2CbusTypeKConnectorMCP9600K+K+TypeKThermocouple2015MicrochipTechnologyInc.
DS50002417A-page15Theblockdiagram(Figure2-3)showsthatthethermocoupleconnectorisdirectlyconnectedtotheMCP9600.
ThefourAlertoutputsareconnectedtotestpointsforexternalconnections.
Additionally,theseoutputsarealsoconnectedtothemicrocontrollerI/OpinssothattheAlertOutputstatusescanbedetectedinsoftware.
2.
4MICROCHIPTHERMALMANAGEMENTSOFTWAREGUITheMicrochipThermalManagementGraphicalUserInterfaceallowsuserstoevaluatetheMCP9600fortemperature-sensingapplications.
Thissoftwaretoolcanbedownloadedandinstalledfromtheevaluationboardproductpage.
Thesoftwarerequiresthe'Microsoft.
NETFramework'package.
Ifthisframeworkpackageisnotinstalledonthecomputer,thenthesoftwarewillautomaticallydownloadandinstallit.
Aftertheinstallationissuccessfullycompleted,thehardwareisrequiredtostartthegraphicaluserinterface.
Oncethehardwareisconnected,thesoftwarerecognizesthedeviceIDanddisplaysthecorrespondingGUIfortheevaluationboard.
DisconnectingtheUSBwillclosetheGUI.
Thistoolenablestheusertoevaluatethesensorfeaturesandperformtemperaturedatalogging.
Figure2-4showsthedataacquisitioninterfacewithaplotofthethermocoupleHot-JunctionandCold-Junctiontemperaturedata.
TheY1axisistheHot-JunctiontemperatureandtheY2axisistheCold-Junctiontemperature.
Thisdatacanalsobeexportedbyright-clickingtheplotandfollowingtheexportoptions.
FIGURE2-4:DataAcquisitionInterface.
MCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page162015MicrochipTechnologyInc.
UsetheThermalManagementSoftwareGraphicalUserInterface(GUI)fortemperaturedataloggingortoevaluatethesensorboardfeatures.
Ifthehardwareisproperlyconnected,thesoftwarewillrecognizethehardware,otherwise,thesoftwarewillshowthe'HardwareNotDetected'messagebox,asindicatedinFigure2-5.
FIGURE2-5:HardwareNotDetectedMessageBox.
2015MicrochipTechnologyInc.
DS50002417A-page172.
5CONFIGURINGTHEMCP9600Figure2-6showstheuserinterfaceforvarioussensoroptions.
Oncetheseoptionsareselected,thesoftwareprogramsthedeviceandrefreshestheGUIfromthedevice.
ThereforetheGUIdisplaystheupdateddevicesettings.
FIGURE2-6:SensorConfigurationOptions.
GUIupdatebuttonSensorconfigurationoptionssuchasShutdownandBurstmodes,sensorresolution,andtemperaturefilteroptionsTemperatureAlertoptionsThermocoupletemperaturetodetectTemperaturechangedirectionTemperatureAlertandHysteresisupdatebuttonRead/Read-WriteregistersfromtheMCP9600Thermocoupleselection:TypeK,J,T,N,S,E,B,RDataacquisitionoptionsOutputpolarityOutputmodeTemperaturelimitTemperaturehysteresislimitMCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page182015MicrochipTechnologyInc.
2.
6DATAACQUISITIONTheblack"Play","Stop",and"Reset"icons(Figure2-7)canbeusedtoperformcontinuousdataacquisitions.
Thered"Record"iconenablestheusertodatalogtoanexternalfile.
TheloggingintervalcanbeadjustedusingtheIntervalscrollbarfrom100msto30s,asshowninFigure2-4.
FIGURE2-7:Real-TimeAcquisition.
Thedataacquisitiondisplaychart(Figure2-4)canbecustomized.
Thecustomizingoptions(Figure2-8)canbeselectedbyeitherdouble-clickingorright-clickingthechart(Figure2-4).
Thedisplayeddatacanalsobeexported.
FIGURE2-8:ChartSetupOptions.
Startreal-timeacquisitionStopreal-timeacquisitionResetreal-timeacquisitionStart/Recordreal-timeacquisitionStoprecordingreal-timeacquisitionExportDataMCP9600THERMOCOUPLEICEVALUATIONBOARDUSER'SGUIDE2015MicrochipTechnologyInc.
DS50002417A-page19AppendixA.
SchematicandLayoutsA.
1INTRODUCTIONThisappendixcontainsthefollowingschematicsandlayoutsfortheMCP9600ThermocoupleICEvaluationBoard:BoardSchematicBoard–TopSilkBoard–TopCopperandSilkBoard–TopCopperBoard–BottomCopperBoard–BottomCopperandSilkBoard–BottomSilkMCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page202015MicrochipTechnologyInc.
A.
2BOARDSCHEMATICVDDN/CVDDN/CVDDSCLSDAGNDGNDGNDGNDGNDGNDGNDVCCVCCALERT1ALERT2ALERT3ALERT4VDDVCCHDR-2.
54Male1x6123456J14.
99k08051%R14.
99k08051%R20.
1uFC1SDASCLUSBMINI-BFemaleID4VBUS1GND5D-2D+30J310R08051%R410R08051%R510uF6.
3V0805C410uF6.
3V0805C5100k08050.
1%R81uF16V0805C60.
47uF16V0805C310uHL112MHz231X1GNDMCLR/VPP/RE31RA0/AN0/C12IN0-2RA1/AN1/C12IN1-3RA2/AN2/VREF-/CVREF/C2IN+4RA3/AN3/VREF+/C1IN+5RA4/T0CKI/C1OUT6RA5/AN4/SS/HLVDIN/C2OUT7VSS8OSC1/CLKIN/RA79OSC2/CLKOUT/RA610RC0/T1OSO/T13CKI11RC1/T1OSI/CCP212RC2/CCP1/P1A13RC3/SCK/SCL14RC4/SDI/SDA15RC5/SDO16RC6/TX/CK17RC7/RX/DT18VSS19VDD20RB0/INT0/FLT0/AN1221RB1/INT1/AN10/C12IN3-/P1C22RB2/INT2/AN8/P1B23RB3/AN9/C12IN2-/CCP224RB4/KBI0/AN11/P1D25RB5/KBI1/PGM26RB6/KBI2/PGC27RB7/KBI3/PGD28PIC18F2520-I/SOU3GNDGNDVIN-VIN+VDDVDDR7DNPR6DNPR9DNPR10DNPFB1FerriteBeadFB2FerriteBead0.
1uF50V0805C7Thermocoupler+1-2GND0TC1GNDUSB-AMaletoCBL1SDASCLVIN-VIN+ALERT4ALERT3ALERT2ALERT1VDDGND0.
1uF0603C2GNDGNDGND1VIN+2GND3VIN-4GND5GNDVIN+GNDVIN-GNDGND6GND7VDD8GND9N/C10Alert111Alert212GND13Alert314Alert415Vadd16GND17GND18SCL19SDA20MCP9600U2ALERT1ALERT2ALERT3ALERT4GNDVDDGNDGNDPADGNDMiniUSB-BMale2015MicrochipTechnologyInc.
DS50002417A-page21A.
3BOARD–TOPSILKA.
4BOARD–TOPCOPPERANDSILKMCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page222015MicrochipTechnologyInc.
A.
5BOARD–TOPCOPPERA.
6BOARD–BOTTOMCOPPER2015MicrochipTechnologyInc.
DS50002417A-page23A.
7BOARD–BOTTOMCOPPERANDSILKA.
8BOARD–BOTTOMSILKMCP9600ThermocoupleICEvaluationBoardUser'sGuideDS50002417A-page242015MicrochipTechnologyInc.
NOTES:MCP9600THERMOCOUPLEICEVALUATIONBOARDUSER'SGUIDE2015MicrochipTechnologyInc.
DS50000000A-page25AppendixB.
BillofMaterials(BOM)TABLEB-1:BILLOFMATERIALS(BOM)QtyReferenceDescriptionManufacturerPartNumber9Alert1,Alert2,Alert3,Alert4,GND,GND,SCL,SDA,VDDConnectorTPtabsilvermini3.
8x2.
03SMDKeystoneElectronicsCorp.
50192C1,C7Ceramiccapacitor,1F,50V,10%,X7RSMD,0805Cal-ChipElectronicsInc.
GMC21X7R104K50NTLF1C2CeramicCapacitor,0.
1F,25V,20%,Y5VSMD,0603Cal-ChipElectronicsInc.
GMC10Y5V104Z25NTLF1C3Ceramiccapacitor,0.
47F,16V,10%,X7RSMD,0805Panasonic-ECGECJ-2YB1C474K2C4,C5Ceramiccapacitor,10F,6.
3V,20%,X5RSMD,0805TaiyoYudenCo.
,Ltd.
JMK212BJ106MG-T1C6Ceramiccapacitor,1F,16V,20%,Y5VSMD,0805AVXCorporation0805YG105ZAT2A2FB1,FB2Ferritechipbeads,800mA,0.
15RSMD,0805LairdTechnologiesLI0805H151R-100J1Connectorheader,2.
54male1x6,tin,5.
84mm,ThroughHole,vertical–DONOTPOPULATESullinsConnectorSolutionsPEC06SAAN1J3Connector,MiniUSB,B-Type,female,SMDR/AHiroseElectricCo.
,Ltd.
UX60-MB-5ST1L1Inductor,10H,100mA,20%,SMD,0805MurataElectronicsLQM21FN100M70L4PAD1,PAD2,PAD3,PAD4MechanicalHWrubberpad,square,L12.
1xW12.
1xH3.
1,blackHammondManufacturingLtd.
1421T8BK0PCBMCP9600ThermocoupleICEvaluationBoard–PrintedCircuitBoard—04-10413-R22R1,R2Resistor,TKF4.
99Kohm,1%,1/8W,SMD,0805ROHMSemiconductorMCR10EZHF49912R4,R5Resistor,TKF10R,1%,1/8W,SMD0805ROHMSemiconductorMCR10EZHF10R00R6,R7Resistor,TKF100K,1%,1/8W,SMD0805–DONOTPOPULATENICComponentsCorp.
NRC10F1003TRF1R8ResistorTF,100K,0.
1%,1/8W,SMD0805Panasonic-ECGERA-6AEB104V0R9,R10ResistorTKF,47.
5K,1%,1/8W,SMD0805–DONOTPOPULATEPanasonic-ECGERJ-6ENF4752VNote:ThecomponentslistedinthisBillofMaterialsarerepresentativeofthePCBassembly.
ThereleasedBOMusedinmanufacturingusesallRoHS-compliantcomponents.
2015MicrochipTechnologyInc.
DS50000000A-page261TC1MechanicalHWadapterthermocoupleTHR/AOmegaEngineeringInc.
PCC-SMP-K-100(100pcs.
perpackage)1U2Sensortemp.
ratiometric,20MQFNMicrochipTechnologyInc.
MCP9600-I/MX1U3MicrochipMCU8-bit,40MHz,32K,1536BPIC18F2520-I/SOSOIC-28MicrochipTechnologyInc.
PIC18F2550T-I/SO1X1Resonator,12MHz,33pF,SMD,CSTCE-GMurataElectronicsCSTCE12M0G55Z-R0BILLOFMATERIALS–MECHANICALPARTSQtyReferenceDescriptionManufacturerPartNumber1CBL1Mech.
HWcableUSB,A-Type,maletoMiniUSB,B-Type,3ft,blackQualtekElectronicsCorporation3021003-031PlugsinTC1Ready-madeinsulatedthermocoupleswithKapton,PFA,GlassbraidinsulationandMoldedconnectorsOmegaEngineeringInc.
5SRTC-TT-K-24-36(100pcs.
perpackage)Note:ThecomponentslistedinthisBillofMaterialsarerepresentativeofthePCBassembly.
ThereleasedBOMusedinmanufacturingusesallRoHS-compliantcomponents.
TABLEB-1:BILLOFMATERIALS(BOM)(CONTINUED)QtyReferenceDescriptionManufacturerPartNumberNote:ThecomponentslistedinthisBillofMaterialsarerepresentativeofthePCBassembly.
ThereleasedBOMusedinmanufacturingusesallRoHS-compliantcomponents.
2015MicrochipTechnologyInc.
DS50000000A-page27NOTES:DS50002417A-page282015MicrochipTechnologyInc.
AMERICASCorporateOffice2355WestChandlerBlvd.
Chandler,AZ85224-6199Tel:480-792-7200Fax:480-792-7277TechnicalSupport:http://www.
microchip.
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对于Megalayer云服务器提供商在之前也有对于他们家的美国服务器和香港服务器进行过评测和介绍,但是对于大部分网友来说需要独立服务器和站群服务器并不是特别的普及,我们很多网友使用较多的还是云服务器或者VPS主机比较多。在前面也有在"Megalayer新增香港VPS主机 1GB内存 50GB SSD 2M带宽 月59元"文章中有介绍到Megalayer商家有新增香港CN2优化VPS主机。那时候看这...
关于HostDare服务商在之前的文章中有介绍过几次,算是比较老牌的服务商,但是商家背景财力不是特别雄厚,算是比较小众的个人服务商。目前主流提供CKVM和QKVM套餐。前者是电信CN2 GIA,不过库存储备也不是很足,这不九月份发布新的补货库存活动,有提供九折优惠CN2 GIA,以及六五折优惠QKVM普通线路方案。这次活动截止到9月30日,不清楚商家这次库存补货多少。比如 QKVM基础的五个方案都...
LOCVPS发来了针对XEN架构VPS的促销方案,其中美国洛杉矶机房7折,其余日本/新加坡/中国香港等机房全部8折,优惠后日本/新加坡机房XEN VPS月付仅29.6元起。这是成立较久的一家国人VPS服务商,目前提供美国洛杉矶(MC/C3)、和中国香港(邦联、沙田电信、大埔)、日本(东京、大阪)、新加坡、德国和荷兰等机房VPS主机,基于XEN或者KVM虚拟架构,均选择国内访问线路不错的机房,适合建...
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