2.7www232sihu
www232sihu 时间:2021-02-21 阅读:()
MICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-2Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comGaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzv02.
0209GeneralDescriptionFeaturesFunctionalDiagramSmallSignalGain:12dBOutputVoltage:upto8Vpk-pkSingle-EndedI/OsHighSpeedPerformance:46GHz3dBBandwidthLowPowerDissipation:0.
9WSmallDieSize:2.
1x1.
70x0.
1mmElectricalSpecifications*,TA=+25°CTypicalApplicationsThisHMC-AUH232isidealfor:40Gb/sLithiumNiobate/MachZenderFiberOpticModulatorsBroadbandGainBlockforTest&MeasurementEquipmentBroadbandGainBlockforRFApplicationsMilitary&SpaceTheHMC-AUH232isaGaAsMMICHEMTDistributedDriverAmplifierdiewhichoperatesbetweenDCand43GHzandprovidesatypical3dBbandwidthof46GHz.
Theamplifierprovides12dBofsmallsignalgainwhilerequiringonly180mAfroma+5Vsupply.
TheHMC-AUH232exhibitsverygoodgainandphaserippleto40GHz,andcanoutputupto8Vpeak-to-peakwithlowjitter,makingitidealforuseinbroadbandwireless,fiberopticcommunicationandtestequipmentapplications.
Theamplifierdieoccupieslessthan3.
6mm2whichfacilitateseasyintegrationintoMulti-Chip-Modules(MCMs).
TheHMC-AUH232requiresexternalbias-teeaswellasoff-chipblockingcomponentsandbypasscapacitorsfortheDCsupplylines.
Agatevoltageadjust,Vgg2isprovidedforlimitedgainadjustment,whileVgg1adjuststhebiascurrentforthedevice.
HMC-AUH232ParameterMin.
Typ.
Max.
UnitsFrequencyRangeDC-43GHzSmallSignalGain0.
5-5.
0GHz1214dB35-45GHz1012.
5dBInputReturnLoss10dBOutputReturnLoss8.
5dBSupplyCurrent180225mA3dBBandwidth4346GHzGainRipple(5to35GHz)±0.
6±1dBGroupDelayVariation[1]0.
5-5.
0GHz±14±20ps5-30GHz±10±11ps30-45GHz±22±25psMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-3Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzParameterMin.
Typ.
Max.
Units10%to90%Rise/FallTime[2]6-12psOutputVoltageLevel[3]8Vp-pAdditivejitter(RMS)0.
4ps1dBOutputGainCompressionPointat20GHz16.
5dBmOutputPower20GHz@Pin=15dBm[4]2222dBm40GHz@Pin=15dBm[4]1719.
5dBmPowerDissipation0.
91.
25WNoiseFigure5GHz5.
4dB10&15GHz4.
2dB20GHz4.
6dB25GHz5.
4dB30GHz8.
3dB35GHz7.
4dB40GHz9.
1dB[1]Measuredwitha1GHzaperture[4]VerifiedatRFon-waferprobe.
Vgg1isadjusteduntilthedraincur-rentis200mAandVgg2=1.
5V.
ThedrainvoltageisappliedthroughtheRFoutputportusingabiasteewith5voltsonthebiasTee.
[2]Measurementlimitedbyrise/falltimeofinputreferencesignal[3]Witha2.
7VP-Pinputsignal*Unlessotherwiseindicated,allmeasurementsarefromprobeddieElectricalSpecifications(Continued)*ParameterSymbolMin.
Typ.
Max.
UnitsPositiveSupplyVoltageVD56VPositiveSupplyCurrentID150180225mARFInputPower1216dBmBiasCurrentAdjustVgg1-1.
5-0.
2VOutputVoltageAdjustVgg201.
52VOperatingTemperatureTOP02585°CPowerDissipationPD0.
91.
25WRecommendedOperatingConditionsParameterPDISSTBASETCHRMTF(W)(°C)(°C)(°C/W)(Hrs)ThermalResistancetobacksideofchip1.
2585145485.
8x108Thermalresistancetobacksideofcarrierusing25.
4umof84-1LMITepoxy1.
2585155561.
8x108ThermalResistancetobacksideofchip1.
25110170483.
9x107Thermalresistancetobacksideofcarrierusing25.
4umof84-1LMITepoxy1.
25110180561.
4x107ThermalCharacteristicsParameterSymbolTyp.
UnitsActivationEnergyEA1.
7eVMediantimetoFailure(MTF)@125°CChannelTemperatureMTF6x109HoursReliabilityCharacteristicsMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-4Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comInputReturnLossvs.
FrequencyOutputReturnLossvs.
FrequencyGainvs.
FrequencyNoiseFigurevs.
FrequencyOutputVoltageDeltavs.
ControlVoltageNote:MeasuredPerformanceCharacteristics(TypicalPer-formanceat25°C)Vgg2=1.
5V,Vdd=5V,Idd=200mA(Measureddataobtainedfromdieinatestfixtureunlessotherwisestated)91011121314151617051015202530354045GAIN(dB)FREQUENCY(GHz)-25-20-15-10-50051015202530354045INPUTRETURNLOSS(dB)FREQUENCY(GHz)456789100510152025303540NOISEFIGURE(dB)FREQUENCY(GHz)-35-30-25-20-15-10-50051015202530354045OUTPUTRETURNLOSS(dB)FREQUENCY(GHz)-1.
4-1.
2-1-0.
8-0.
6-0.
4-0.
200.
60.
70.
80.
911.
11.
21.
31.
41.
5OUPUTVOLTAGEDELTA(Vpp)Vgg2PINVOLTAGEHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-5Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comAbsoluteMaximumRatingsInputReferenceSignalPRBS=231-1,2.
1VInput,Datarateof40Gb/sNote:MeasuredPerformanceCharacteristics(TypicalPerformanceat25°C)(Measureddataobtainedfromdieinatestfixtureunlessotherwisestated)OutputReferenceSignalPRBS=231-1,7.
3VInput,Datarateof40Gb/sDrainBiasVoltage(Vdd)+6VdcGainBiasVoltage(Vgg1)-1.
5to0VdcOutputVoltageAdjust(Vgg2)0to+2VdcRFInputPower+18.
5dBm40Gb/sInputVoltagePk-Pk(Vpp)3VThermalResistance(channeltodiebottom)48°C/WChannelTemperature180°CStorageTemperature-65to+150°COperatingTemperature-55to+110°CELECTROSTATICSENSITIVEDEVICEOBSERVEHANDLINGPRECAUTIONSHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-6Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comOutlineDrawingNOTES:1.
ALLDIMENSIONSAREININCHES[MM].
2.
TYPICALBONDPADIS.
004"SQUARE.
3.
BACKSIDEMETALLIZATION:GOLD.
4.
BACKSIDEMETALISGROUND.
5.
BONDPADMETALLIZATION:GOLD.
6.
CONNECTIONNOTREQUIREDFORUNLABELEDBONDPADS.
7.
OVERALLDIESIZE±.
002"DiePackagingInformation[1]StandardAlternateGP-1(GelPack)[2][1]Refertothe"PackagingInformation"sectionfordiepackagingdimensions.
[2]ForalternatepackaginginformationcontactHittiteMicrowaveCorporation.
HMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-7Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comPadNumberFunctionDescriptionInterfaceSchematic1RES1DCcoupled35Ωtermination.
2Vgg1Gatecontrolforamplifier.
Pleasefollow"MMICAmplifierBiasingProcedure"applicationnote.
Seeassemblyforrequiredexternalcomponents.
5Vgg2GateControlforamplifier.
Limitedgaincontroladjust.
SeeAssemblyDiagramforexternalcomponents.
6Vdd&RFOUTRFoutputandDCBias(vdd)fortheoutputstage.
3RFINDCcoupled.
BlockingCapisneeded.
4RES2ACcoupled50Ωtermination.
PadDescriptionsApplicationCircuitHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-8Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comAssemblyDiagramNote1:DrainBias(Vdd)mustbeappliedthroughabroadbandbiasteeorexternalbiasnetworkHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-9Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comDeviceMounting1mildiameterwirebondsareusedonVgg1andVgg2connectionstothecapacitorsand27Ωresistors.
0.
5milx3milribbonbondsareusedonRFconnectionsCapacitorsandresistorsonVgg1andVgg2areusedtofilterlowfrequency,<800MHz,RFpickup35Ωand50Ωresistorsarefabricatedona5milaluminasubstrateandshouldbesuitableforuseasahighfrequencytermination.
Forbestgainflatnessandgroupdelayvariation,eccosorbcanbeepoxiedonthetransmissionlinecoveringthecenter3/4ofthetransmissionlinelength.
EccosorbmayalsobeplacedpartiallyacrosstheVg1padand35Ωresistorforimprovedgainflatnessandgroupdelayvariation.
(Theinsertionofthetransmissionlinehelpsreducelowfrequency,<10GHz,gainripple)Silver-filledconductiveepoxyisusedfordieattachment(BacksideofthedieshouldbegroundedandtheGNDpadsareconnectedtothebacksidemetalthroughVias)DeviceOperationThesedevicesaresusceptibletodamagefromElectrostaticDischarge.
Properprecautionsshouldbeobservedduringhandling,assemblyandtest.
TheinputtothisdeviceshouldbeAC-coupled.
Toprovidethetypical8Vppoutputvoltageswing,a2.
7VppAC-cou-pledinputvoltageswingisrequired.
Atthisoutputlevel,thedevicewillbein1dBto3dBofcompression.
DevicePowerUpInstructions1.
Groundthedevice2.
BringVgg1to-0.
5V(nodraincurrent)3.
BringVgg2to+1.
5V(nodraincurrent)4.
BringVddto+5V(150mAto225mAdraincurrent)(Initiallythedraincurrentwillrisesharplywithasmalldrainvoltage,butwillwillflattenoutasVddapproaches5V)Vgg1maybevariedbetween-1Vand0Vtoprovidethedesiredeyecrossingpointpercentage(i.
e.
50%crosspoint)andalimitedcrosspointcontrolcapability.
Vddmaybeincreasedto+5.
5Vifrequiredtoachievegreateroutputvoltageswing.
Vgg2maybeadjustedbetween+1.
5Vand+0.
3Vtovarytheoutputvoltageswing.
DevicePowerDownInstructions1.
Reversethesequenceidentifiedaboveinsteps1through4.
HMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-10Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comMounting&BondingTechniquesforMillimeterwaveGaAsMMICsThedieshouldbeattacheddirectlytothegroundplaneeutecticallyorwithconductiveepoxy(seeHMCgeneralHandling,Mounting,BondingNote).
50OhmMicrostriptransmissionlineson0.
127mm(5mil)thickaluminathinfilmsubstratesarerecommendedforbringingRFtoandfromthechip(Figure1).
If0.
254mm(10mil)thickaluminathinfilmsubstratesmustbeused,thedieshouldberaised0.
150mm(6mils)sothatthesurfaceofthedieiscoplanarwiththesurfaceofthesubstrate.
Onewaytoaccom-plishthisistoattachthe0.
102mm(4mil)thickdietoa0.
150mm(6mil)thickmolybdenumheatspreader(moly-tab)whichisthenattachedtothegroundplane(Figure2).
Microstripsubstratesshouldbeplacedasclosetothedieaspossibleinordertominimizebondwirelength.
Typicaldie-to-substratespacingis0.
076mmto0.
152mm(3to6mils).
HandlingPrecautionsFollowtheseprecautionstoavoidpermanentdamage.
Storage:AllbaredieareplacedineitherWaffleorGelbasedESDprotec-tivecontainers,andthensealedinanESDprotectivebagforshipment.
OncethesealedESDprotectivebaghasbeenopened,alldieshouldbestoredinadrynitrogenenvironment.
Cleanliness:Handlethechipsinacleanenvironment.
DONOTattempttocleanthechipusingliquidcleaningsystems.
StaticSensitivity:FollowESDprecautionstoprotectagainstESDstrikes.
Transients:Suppressinstrumentandbiassupplytransientswhilebiasisapplied.
Useshieldedsignalandbiascablestominimizeinductivepick-up.
GeneralHandling:Handlethechipalongtheedgeswithavacuumcolletorwithasharppairofbenttweezers.
Thesurfaceofthechiphasfragileairbridgesandshouldnotbetouchedwithvacuumcollet,tweezers,orfingers.
MountingThechipisback-metallizedandcanbediemountedwithAuSneutecticpreformsorwithelectricallyconductiveepoxy.
Themountingsurfaceshouldbecleanandflat.
EutecticDieAttach:A80/20goldtinpreformisrecommendedwithaworksurfacetemperatureof255°Candatooltemperatureof265°C.
Whenhot90/10nitrogen/hydrogengasisapplied,tooltiptemperatureshouldbe290°C.
DONOTexposethechiptoatemperaturegreaterthan320°Cformorethan20seconds.
Nomorethan3secondsofscrubbingshouldberequiredforattachment.
EpoxyDieAttach:Applyaminimumamountofepoxytothemountingsurfacesothatathinepoxyfilletisobservedaroundtheperimeterofthechiponceitisplacedintoposition.
Cureepoxyperthemanufacturer'sschedule.
WireBondingRFbondsmadewith0.
003"x0.
0005"ribbonarerecommended.
Thesebondsshouldbethermosonicallybondedwithaforceof40-60grams.
DCbondsof0.
001"(0.
025mm)diameter,thermosonicallybonded,arerecommended.
Ballbondsshouldbemadewithaforceof40-50gramsandwedgebondsat18-22grams.
Allbondsshouldbemadewithanominalstagetemperatureof150°C.
Aminimumamountofultrasonicenergyshouldbeappliedtoachievereliablebonds.
Allbondsshouldbeasshortaspossible,lessthan12mils(0.
31mm).
0.
102mm(0.
004")ThickGaAsMMICRibbonBond0.
076mm(0.
003")RFGroundPlane0.
127mm(0.
005")ThickAluminaThinFilmSubstrateFigure1.
0.
102mm(0.
004")ThickGaAsMMICRibbonBond0.
076mm(0.
003")RFGroundPlane0.
150mm(0.
005")ThickMolyTab0.
254mm(0.
010"ThickAluminaThinFilmSubstrateFigure2.
HMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-11Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comNotesHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHz
hittite.
comGaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzv02.
0209GeneralDescriptionFeaturesFunctionalDiagramSmallSignalGain:12dBOutputVoltage:upto8Vpk-pkSingle-EndedI/OsHighSpeedPerformance:46GHz3dBBandwidthLowPowerDissipation:0.
9WSmallDieSize:2.
1x1.
70x0.
1mmElectricalSpecifications*,TA=+25°CTypicalApplicationsThisHMC-AUH232isidealfor:40Gb/sLithiumNiobate/MachZenderFiberOpticModulatorsBroadbandGainBlockforTest&MeasurementEquipmentBroadbandGainBlockforRFApplicationsMilitary&SpaceTheHMC-AUH232isaGaAsMMICHEMTDistributedDriverAmplifierdiewhichoperatesbetweenDCand43GHzandprovidesatypical3dBbandwidthof46GHz.
Theamplifierprovides12dBofsmallsignalgainwhilerequiringonly180mAfroma+5Vsupply.
TheHMC-AUH232exhibitsverygoodgainandphaserippleto40GHz,andcanoutputupto8Vpeak-to-peakwithlowjitter,makingitidealforuseinbroadbandwireless,fiberopticcommunicationandtestequipmentapplications.
Theamplifierdieoccupieslessthan3.
6mm2whichfacilitateseasyintegrationintoMulti-Chip-Modules(MCMs).
TheHMC-AUH232requiresexternalbias-teeaswellasoff-chipblockingcomponentsandbypasscapacitorsfortheDCsupplylines.
Agatevoltageadjust,Vgg2isprovidedforlimitedgainadjustment,whileVgg1adjuststhebiascurrentforthedevice.
HMC-AUH232ParameterMin.
Typ.
Max.
UnitsFrequencyRangeDC-43GHzSmallSignalGain0.
5-5.
0GHz1214dB35-45GHz1012.
5dBInputReturnLoss10dBOutputReturnLoss8.
5dBSupplyCurrent180225mA3dBBandwidth4346GHzGainRipple(5to35GHz)±0.
6±1dBGroupDelayVariation[1]0.
5-5.
0GHz±14±20ps5-30GHz±10±11ps30-45GHz±22±25psMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-3Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzParameterMin.
Typ.
Max.
Units10%to90%Rise/FallTime[2]6-12psOutputVoltageLevel[3]8Vp-pAdditivejitter(RMS)0.
4ps1dBOutputGainCompressionPointat20GHz16.
5dBmOutputPower20GHz@Pin=15dBm[4]2222dBm40GHz@Pin=15dBm[4]1719.
5dBmPowerDissipation0.
91.
25WNoiseFigure5GHz5.
4dB10&15GHz4.
2dB20GHz4.
6dB25GHz5.
4dB30GHz8.
3dB35GHz7.
4dB40GHz9.
1dB[1]Measuredwitha1GHzaperture[4]VerifiedatRFon-waferprobe.
Vgg1isadjusteduntilthedraincur-rentis200mAandVgg2=1.
5V.
ThedrainvoltageisappliedthroughtheRFoutputportusingabiasteewith5voltsonthebiasTee.
[2]Measurementlimitedbyrise/falltimeofinputreferencesignal[3]Witha2.
7VP-Pinputsignal*Unlessotherwiseindicated,allmeasurementsarefromprobeddieElectricalSpecifications(Continued)*ParameterSymbolMin.
Typ.
Max.
UnitsPositiveSupplyVoltageVD56VPositiveSupplyCurrentID150180225mARFInputPower1216dBmBiasCurrentAdjustVgg1-1.
5-0.
2VOutputVoltageAdjustVgg201.
52VOperatingTemperatureTOP02585°CPowerDissipationPD0.
91.
25WRecommendedOperatingConditionsParameterPDISSTBASETCHRMTF(W)(°C)(°C)(°C/W)(Hrs)ThermalResistancetobacksideofchip1.
2585145485.
8x108Thermalresistancetobacksideofcarrierusing25.
4umof84-1LMITepoxy1.
2585155561.
8x108ThermalResistancetobacksideofchip1.
25110170483.
9x107Thermalresistancetobacksideofcarrierusing25.
4umof84-1LMITepoxy1.
25110180561.
4x107ThermalCharacteristicsParameterSymbolTyp.
UnitsActivationEnergyEA1.
7eVMediantimetoFailure(MTF)@125°CChannelTemperatureMTF6x109HoursReliabilityCharacteristicsMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-4Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comInputReturnLossvs.
FrequencyOutputReturnLossvs.
FrequencyGainvs.
FrequencyNoiseFigurevs.
FrequencyOutputVoltageDeltavs.
ControlVoltageNote:MeasuredPerformanceCharacteristics(TypicalPer-formanceat25°C)Vgg2=1.
5V,Vdd=5V,Idd=200mA(Measureddataobtainedfromdieinatestfixtureunlessotherwisestated)91011121314151617051015202530354045GAIN(dB)FREQUENCY(GHz)-25-20-15-10-50051015202530354045INPUTRETURNLOSS(dB)FREQUENCY(GHz)456789100510152025303540NOISEFIGURE(dB)FREQUENCY(GHz)-35-30-25-20-15-10-50051015202530354045OUTPUTRETURNLOSS(dB)FREQUENCY(GHz)-1.
4-1.
2-1-0.
8-0.
6-0.
4-0.
200.
60.
70.
80.
911.
11.
21.
31.
41.
5OUPUTVOLTAGEDELTA(Vpp)Vgg2PINVOLTAGEHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-5Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comAbsoluteMaximumRatingsInputReferenceSignalPRBS=231-1,2.
1VInput,Datarateof40Gb/sNote:MeasuredPerformanceCharacteristics(TypicalPerformanceat25°C)(Measureddataobtainedfromdieinatestfixtureunlessotherwisestated)OutputReferenceSignalPRBS=231-1,7.
3VInput,Datarateof40Gb/sDrainBiasVoltage(Vdd)+6VdcGainBiasVoltage(Vgg1)-1.
5to0VdcOutputVoltageAdjust(Vgg2)0to+2VdcRFInputPower+18.
5dBm40Gb/sInputVoltagePk-Pk(Vpp)3VThermalResistance(channeltodiebottom)48°C/WChannelTemperature180°CStorageTemperature-65to+150°COperatingTemperature-55to+110°CELECTROSTATICSENSITIVEDEVICEOBSERVEHANDLINGPRECAUTIONSHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-6Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comOutlineDrawingNOTES:1.
ALLDIMENSIONSAREININCHES[MM].
2.
TYPICALBONDPADIS.
004"SQUARE.
3.
BACKSIDEMETALLIZATION:GOLD.
4.
BACKSIDEMETALISGROUND.
5.
BONDPADMETALLIZATION:GOLD.
6.
CONNECTIONNOTREQUIREDFORUNLABELEDBONDPADS.
7.
OVERALLDIESIZE±.
002"DiePackagingInformation[1]StandardAlternateGP-1(GelPack)[2][1]Refertothe"PackagingInformation"sectionfordiepackagingdimensions.
[2]ForalternatepackaginginformationcontactHittiteMicrowaveCorporation.
HMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-7Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comPadNumberFunctionDescriptionInterfaceSchematic1RES1DCcoupled35Ωtermination.
2Vgg1Gatecontrolforamplifier.
Pleasefollow"MMICAmplifierBiasingProcedure"applicationnote.
Seeassemblyforrequiredexternalcomponents.
5Vgg2GateControlforamplifier.
Limitedgaincontroladjust.
SeeAssemblyDiagramforexternalcomponents.
6Vdd&RFOUTRFoutputandDCBias(vdd)fortheoutputstage.
3RFINDCcoupled.
BlockingCapisneeded.
4RES2ACcoupled50Ωtermination.
PadDescriptionsApplicationCircuitHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-8Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comAssemblyDiagramNote1:DrainBias(Vdd)mustbeappliedthroughabroadbandbiasteeorexternalbiasnetworkHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-9Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comDeviceMounting1mildiameterwirebondsareusedonVgg1andVgg2connectionstothecapacitorsand27Ωresistors.
0.
5milx3milribbonbondsareusedonRFconnectionsCapacitorsandresistorsonVgg1andVgg2areusedtofilterlowfrequency,<800MHz,RFpickup35Ωand50Ωresistorsarefabricatedona5milaluminasubstrateandshouldbesuitableforuseasahighfrequencytermination.
Forbestgainflatnessandgroupdelayvariation,eccosorbcanbeepoxiedonthetransmissionlinecoveringthecenter3/4ofthetransmissionlinelength.
EccosorbmayalsobeplacedpartiallyacrosstheVg1padand35Ωresistorforimprovedgainflatnessandgroupdelayvariation.
(Theinsertionofthetransmissionlinehelpsreducelowfrequency,<10GHz,gainripple)Silver-filledconductiveepoxyisusedfordieattachment(BacksideofthedieshouldbegroundedandtheGNDpadsareconnectedtothebacksidemetalthroughVias)DeviceOperationThesedevicesaresusceptibletodamagefromElectrostaticDischarge.
Properprecautionsshouldbeobservedduringhandling,assemblyandtest.
TheinputtothisdeviceshouldbeAC-coupled.
Toprovidethetypical8Vppoutputvoltageswing,a2.
7VppAC-cou-pledinputvoltageswingisrequired.
Atthisoutputlevel,thedevicewillbein1dBto3dBofcompression.
DevicePowerUpInstructions1.
Groundthedevice2.
BringVgg1to-0.
5V(nodraincurrent)3.
BringVgg2to+1.
5V(nodraincurrent)4.
BringVddto+5V(150mAto225mAdraincurrent)(Initiallythedraincurrentwillrisesharplywithasmalldrainvoltage,butwillwillflattenoutasVddapproaches5V)Vgg1maybevariedbetween-1Vand0Vtoprovidethedesiredeyecrossingpointpercentage(i.
e.
50%crosspoint)andalimitedcrosspointcontrolcapability.
Vddmaybeincreasedto+5.
5Vifrequiredtoachievegreateroutputvoltageswing.
Vgg2maybeadjustedbetween+1.
5Vand+0.
3Vtovarytheoutputvoltageswing.
DevicePowerDownInstructions1.
Reversethesequenceidentifiedaboveinsteps1through4.
HMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-10Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comMounting&BondingTechniquesforMillimeterwaveGaAsMMICsThedieshouldbeattacheddirectlytothegroundplaneeutecticallyorwithconductiveepoxy(seeHMCgeneralHandling,Mounting,BondingNote).
50OhmMicrostriptransmissionlineson0.
127mm(5mil)thickaluminathinfilmsubstratesarerecommendedforbringingRFtoandfromthechip(Figure1).
If0.
254mm(10mil)thickaluminathinfilmsubstratesmustbeused,thedieshouldberaised0.
150mm(6mils)sothatthesurfaceofthedieiscoplanarwiththesurfaceofthesubstrate.
Onewaytoaccom-plishthisistoattachthe0.
102mm(4mil)thickdietoa0.
150mm(6mil)thickmolybdenumheatspreader(moly-tab)whichisthenattachedtothegroundplane(Figure2).
Microstripsubstratesshouldbeplacedasclosetothedieaspossibleinordertominimizebondwirelength.
Typicaldie-to-substratespacingis0.
076mmto0.
152mm(3to6mils).
HandlingPrecautionsFollowtheseprecautionstoavoidpermanentdamage.
Storage:AllbaredieareplacedineitherWaffleorGelbasedESDprotec-tivecontainers,andthensealedinanESDprotectivebagforshipment.
OncethesealedESDprotectivebaghasbeenopened,alldieshouldbestoredinadrynitrogenenvironment.
Cleanliness:Handlethechipsinacleanenvironment.
DONOTattempttocleanthechipusingliquidcleaningsystems.
StaticSensitivity:FollowESDprecautionstoprotectagainstESDstrikes.
Transients:Suppressinstrumentandbiassupplytransientswhilebiasisapplied.
Useshieldedsignalandbiascablestominimizeinductivepick-up.
GeneralHandling:Handlethechipalongtheedgeswithavacuumcolletorwithasharppairofbenttweezers.
Thesurfaceofthechiphasfragileairbridgesandshouldnotbetouchedwithvacuumcollet,tweezers,orfingers.
MountingThechipisback-metallizedandcanbediemountedwithAuSneutecticpreformsorwithelectricallyconductiveepoxy.
Themountingsurfaceshouldbecleanandflat.
EutecticDieAttach:A80/20goldtinpreformisrecommendedwithaworksurfacetemperatureof255°Candatooltemperatureof265°C.
Whenhot90/10nitrogen/hydrogengasisapplied,tooltiptemperatureshouldbe290°C.
DONOTexposethechiptoatemperaturegreaterthan320°Cformorethan20seconds.
Nomorethan3secondsofscrubbingshouldberequiredforattachment.
EpoxyDieAttach:Applyaminimumamountofepoxytothemountingsurfacesothatathinepoxyfilletisobservedaroundtheperimeterofthechiponceitisplacedintoposition.
Cureepoxyperthemanufacturer'sschedule.
WireBondingRFbondsmadewith0.
003"x0.
0005"ribbonarerecommended.
Thesebondsshouldbethermosonicallybondedwithaforceof40-60grams.
DCbondsof0.
001"(0.
025mm)diameter,thermosonicallybonded,arerecommended.
Ballbondsshouldbemadewithaforceof40-50gramsandwedgebondsat18-22grams.
Allbondsshouldbemadewithanominalstagetemperatureof150°C.
Aminimumamountofultrasonicenergyshouldbeappliedtoachievereliablebonds.
Allbondsshouldbeasshortaspossible,lessthan12mils(0.
31mm).
0.
102mm(0.
004")ThickGaAsMMICRibbonBond0.
076mm(0.
003")RFGroundPlane0.
127mm(0.
005")ThickAluminaThinFilmSubstrateFigure1.
0.
102mm(0.
004")ThickGaAsMMICRibbonBond0.
076mm(0.
003")RFGroundPlane0.
150mm(0.
005")ThickMolyTab0.
254mm(0.
010"ThickAluminaThinFilmSubstrateFigure2.
HMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHzMICROWAVE&OPTICALDRIVERAMPLIFIERS-CHIP44-11Forprice,delivery,andtoplaceorders,pleasecontactHittiteMicrowaveCorporation:20AlphaRoad,Chelmsford,MA01824Phone:978-250-3343Fax:978-250-3373OrderOn-lineatwww.
hittite.
comNotesHMC-AUH232v02.
0209GaAsHEMTMMICMODULATORDRIVERAMPLIFIER,DC-43GHz
- 2.7www232sihu相关文档
- RTSwww232sihu
- notedwww232sihu
- 光纤www232sihu
- pinwww232sihu
- 波仕卡:RS-232/RS-485
- 转换www232sihu
pacificrack：超级秒杀，VPS低至$7.2/年，美国洛杉矶VPS，1Gbps带宽
pacificrack又追加了3款特价便宜vps搞促销，而且是直接7折优惠（一次性），低至年付7.2美元。这是本月第3波便宜vps了。熟悉pacificrack的知道机房是QN的洛杉矶，接入1Gbps带宽，KVM虚拟，纯SSD RAID10，自带一个IPv4。官方网站：https://pacificrack.com支持PayPal、支付宝等方式付款7折秒杀优惠码：R3UWUYF01T内存CPUSS...
IntoVPS：按小时计费KVM月费5美元起($0.0075/小时),6个机房可选
IntoVPS是成立于2004年的Hosterion SRL旗下于2009年推出的无管理型VPS主机品牌，商家提供基于OpenStack构建的VPS产品，支持小时计费是他的一大特色，VPS可选数据中心包括美国弗里蒙特、达拉斯、英国伦敦、荷兰和罗马尼亚等6个地区机房。商家VPS主机基于KVM架构，最低每小时0.0075美元起($5/月)。下面列出几款VPS主机配置信息。CPU：1core内存：2GB...
CloudCone（12.95美元/月CN2 GT线路，KVM架构1 Gbps带宽
整理一下CloudCone商家之前推送的闪购VPS云服务器产品，数量有限，活动推出可能很快机器就售罄了，有需要美国便宜VPS云服务器的朋友可以关注一下。CloudCone怎么样？CloudCone服务器好不好？CloudCone值不值得购买？CloudCone是一家成立于2017年的美国服务器提供商，国外实力大厂，自己开发的主机系统面板，CloudCone主要销售美国洛杉矶云服务器产品，优势特点是...
www232sihu为你推荐
-
google地球打不开google earth打不开怎么办？会声会影12下载谁有免费的会声会影12的素材下载地址给俺发个！要没有毒的，谢谢咧！如何免费开通黄钻如何免费开通黄钻？？51自学网站谁能给我免费学习的网站吧 谢谢了简体翻译成繁体简体字怎么换成繁体。。？湖南商标注册在湖南商标注册到底有什么用，不就是一个图标吗？中国电信互联星空互联星空是什么？是电信公司的吗？1433端口1433端口怎么打开直播加速有没有软件使已经下载好了的视频播放加速，例如30分钟的视频15分钟或者20分钟播放完godaddygodaddy域名怎样使用