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AMC3301具有集成直流/直流转换器的精密、±250mV输入、增强型隔离放大器1特性3.
3V或5V单电源,具有集成直流/直流转换器±250mV线性输入电压范围,针对使用分流电阻器测量电流进行了优化固定增益:8.
2低直流误差:–输入失调电压:±0.
15mV(最大值)–输入温漂±1V/°C(最大值)–增益误差:±0.
2%(最大值)–增益误差漂移:±40ppm/°C(最大值)–非线性度:±0.
04%(最大值)高CMTI:85kV/s(最小值)系统级诊断功能安全相关认证:–符合DINVDEV0884-11标准的6000V1PK2增强型隔离–符合UL1577标准且长达1分钟的4250V1RMS2隔离符合CISPR-11和CISPR-25EMI标准2应用可用于以下应用的隔离式电压感应:–电机驱动器–光电逆变器–电力输送系统–电表–保护继电器3说明AMC3301是一款具有完全集成的隔离式直流/直流转换器的精密隔离式放大器,能实现器件低侧的单电源运行.
该增强型电容隔离层通过了VDEV0884-11和UL1577标准认证,将以不同共模电压电平运行的系统各部分隔开,并保护低压域免受损坏.
AMC3301的输入经过优化,可直接连接至分流电阻器或其他低电压电平信号源.
集成式隔离直流/直流转换器可实现分流器和AMC3301的灵活布置,并使该器件成为空间受限应用的独特解决方案.
该器件具有出色的性能,可支持精确的电流监测和控制,这一特性对于在电机控制应用中实现低扭矩纹波非常重要.
AMC3301的集成直流/直流转换器故障检测和诊断输出引脚可简化系统级设计和诊断.
AMC3301的额定工业工作温度范围为-40°C至+125°C.
器件信息(1)器件型号封装封装尺寸(标称值)AMC3301SOIC(16)10.
30mm*7.
50mm(1)如需了解所有可用封装,请参阅数据表末尾的可订购产品附录.
应用示例www.
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cnAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020Copyright2020TexasInstrumentsIncorporatedSubmitDocumentFeedback1ProductFolderLinks:AMC3301AMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020本文档旨在为方便起见,提供有关TI产品中文版本的信息,以确认产品的概要.
有关适用的官方英文版本的最新信息,请访问www.
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TI不保证翻译的准确性和有效性.
在实际设计之前,请务必参考最新版本的英文版本.
EnglishDataSheet:SBAS917TableofContents1特性.
12应用.
13说明.
14RevisionHistory.
25PinConfigurationandFunctions.
3PinFunctions.
36Specifications.
46.
1AbsoluteMaximumRatings.
46.
2ESDRatings.
46.
3RecommendedOperatingConditions.
46.
4ThermalInformation.
56.
5PowerRatings.
56.
6InsulationSpecifications.
66.
7Safety-RelatedCertifications.
76.
8SafetyLimitingValues.
76.
9ElectricalCharacteristics.
76.
10SwitchingCharacteristics.
96.
11TimingDiagram.
96.
12InsulationCharacteristicsCurves.
106.
13TypicalCharacteristics.
117DetailedDescription.
187.
1Overview.
187.
2FunctionalBlockDiagram.
187.
3FeatureDescription.
187.
4DeviceFunctionalModes.
228ApplicationandImplementation.
228.
1ApplicationInformation.
228.
2TypicalApplication.
238.
3WhattoDoandWhatNottoDo.
269PowerSupplyRecommendations.
2610Layout.
2810.
1LayoutGuidelines.
2810.
2LayoutExample.
2811DeviceandDocumentationSupport.
2911.
1DeviceSupport.
2911.
2DocumentationSupport.
2911.
3ReceivingNotificationofDocumentationUpdates.
.
2911.
4SupportResources.
2911.
5Trademarks.
2911.
6ElectrostaticDischargeCaution.
2911.
7Glossary.
2912Mechanical,Packaging,andOrderableInformation.
294RevisionHistory注:以前版本的页码可能与当前版本的页码不同ChangesfromRevision*(August2019)toRevisionA(July2020)Page将文档状态从"预告信息"更改为"生产数据"1AMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn2SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC33015PinConfigurationandFunctions图5-1.
DWEPackage,16-PinSOIC,TopViewPinFunctionsPINTYPEDESCRIPTIONNO.
NAME1DCDC_OUTPowerHigh-sideoutputoftheisolatedDC/DCconverter;connectthispintotheHLDO_INpin.
(1)2DCDC_HGNDPowerHigh-sidegroundreferencefortheisolatedDC/DCconverter;connectthispintotheHGNDpin.
3HLDO_INPowerInputofthehigh-sidelow-dropout(LDO)regulator;connectthispintotheDCDC_OUTpin(1)4NC—Nointernalconnection;connectthispintoHGNDorleavethispinunconnected(floating).
5HLDO_OUTPowerOutputofthehigh-sideLDO.
(1)6INPInputNoninvertinganaloginput.
EitherINPorINNmusthaveaDCcurrentpathtoHGNDtodefinethecommon-modeinputvoltage.
See节10fordetails.
7INNInputInvertinganaloginput.
EitherINPorINNmusthaveaDCcurrentpathtoHGNDtodefinethecommon-modeinputvoltage.
See节10fordetails.
8HGNDAnalogHigh-sideanalogground;connectthispintotheDCDC_HGNDpin.
9GNDAnalogLow-sideanalogground;connectthispintotheDCDC_GNDpin.
10OUTNOutputInvertinganalogoutput.
11OUTPOutputNoninvertinganalogoutput.
12VDDPowerLow-sidepowersupply.
(1)13LDO_OUTPowerOutputoftheprimary-sideLDO;connectthispintotheDCDC_INpin.
(1)14DIAGOutputActive-low,open-drainstatusindicatoroutput;connectthispintothepullupsupply(forexample,VDD)usingaresistororleavethispinfloatingifnotused.
15DCDC_GNDPowerLow-sidegroundreferencefortheisolatedDC/DCconverter;connectthispintotheGNDpin.
16DCDC_INPowerPrimary-sideinputoftheisolatedDC/DCconverter;connectthispintotheLDO_OUTpin.
(1)(1)See节9forpower-supplydecouplingrecommendations.
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cnAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020Copyright2020TexasInstrumentsIncorporatedSubmitDocumentFeedback3ProductFolderLinks:AMC33016Specifications6.
1AbsoluteMaximumRatingssee(1)MINMAXUNITPower-supplyvoltageVDDtoGND–0.
36.
5VAnaloginputvoltageINP,INNHGND–6VHLDOout+0.
5VAnalogoutputvoltageOUTP,OUTNGND–0.
5VDD+0.
5VDigitaloutputvoltageDIAGGND–0.
55.
5VInputcurrentContinuous,anypinexceptpower-supplypins–1010mATemperatureJunction,TJ150°CStorage,Tstg–65150(1)StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.
Thesearestressratingsonly,anddonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder节6.
3.
Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability.
6.
2ESDRatingsVALUEUNITV(ESD)ElectrostaticdischargeHumanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1)±2000VChargeddevicemodel(CDM),perJESD22-C101(2)±1000(1)JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.
(2)JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess.
6.
3RecommendedOperatingConditionsoveroperatingambienttemperaturerange(unlessotherwisenoted)MINNOMMAXUNITPOWERSUPPLYVDDLow-sidepowersupplyVDDtoGND33.
35.
5VANALOGINPUTVClippingDifferentialinputvoltagebeforeclippingoutputVIN=VINP–VINN±320mVVFSRSpecifiedlineardifferentialfull-scalevoltageVIN=VINP–VINN–250250mVAbsolutecommon-modeinputvoltage(1)(VINP+VINN)/2toHGND–2VHLDOoutVVCMOperatingcommon-modeinputvoltage(VINP+VINN)/2toHGND–0.
161VTEMPERATURERANGETASpecifiedambienttemperature–40125°C(1)Steady-statevoltagesupportedbythedeviceincaseofasystemfailure.
Seespecifiedcommon-modeinputvoltageVCMfornormaloperation.
Observeanaloginputvoltagerangeasspecifiedin节6.
1.
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4ThermalInformationTHERMALMETRIC(1)AMC3301UNITDWE(SOIC)16PINSRθJAJunction-to-ambientthermalresistance73.
5°C/WRθJC(top)Junction-to-case(top)thermalresistance31°C/WRθJBJunction-to-boardthermalresistance44°C/WYJTJunction-to-topcharacterizationparameter16.
7°C/WYJBJunction-to-boardcharacterizationparameter42.
8°C/WRθJC(bot)Junction-to-case(bottom)thermalresistancen/a°C/W(1)Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplicationreport.
6.
5PowerRatingsPARAMETERTESTCONDITIONSMINTYPMAXUNITPDMaximumpowerdissipationVDD=5.
5V231mWVDD=3.
6V151www.
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6InsulationSpecificationsoveroperatingambienttemperaturerange(unlessotherwisenoted)PARAMETERTESTCONDITIONSVALUEUNITGENERALCLRExternalclearance(1)Shortestpin-to-pindistancethroughair≥8mmCPGExternalcreepage(1)Shortestpin-to-pindistanceacrossthepackagesurface≥8mmDTIDistancethroughtheinsulationMinimuminternalgap(internalclearance-capacitivesignalisolation)≥21mMinimuminternalgap(internalclearance-transformerpowerisolation)≥120CTIComparativetrackingindexDINEN60112(VDE0303-11);IEC60112≥600VMaterialgroupAccordingtoIEC60664-1IOvervoltagecategoryperIEC60664-1Ratedmainsvoltage≤600VRMSI-IVRatedmainsvoltage≤1000VRMSI-IIIDINVDEV0884-11(VDEV0884-11):2017-01(2)VIORMMaximumrepetitivepeakisolationvoltageAtACvoltage(bipolar)1700VPKVIOWMMaximum-ratedisolationworkingvoltageAtACvoltage(sinewave);time-dependentdielectricbreakdown(TDDB)test1200VRMSAtDCvoltage1700VDCVIOTMMaximumtransientisolationvoltageVTEST=VIOTM,t=60s(qualificationtest)6000VPKVTEST=1.
2*VIOTM,t=1s(100%productiontest)7200VPKVIOSMMaximumsurgeisolationvoltage(3)TestmethodperIEC60065,1.
2/50-swaveform,VTEST=1.
6*VIOSM=10000VPK(qualification)6250VPKqpdApparentcharge(4)Methoda,afterinput/outputsafetytestsubgroup2/3,Vini=VIOTM,tini=60s,Vpd(m)=1.
2*VIORM,tm=10s≤5pCMethoda,afterenvironmentaltestssubgroup1,Vini=VIOTM,tini=60s,Vpd(m)=1.
6*VIORM,tm=10s≤5Methodb1,atroutinetest(100%production)andpreconditioning(typetest),Vini=VIOTM,tini=1s,Vpd(m)=1.
875*VIORM,tm=1s≤5CIOBarriercapacitance,inputtooutput(5)VIO=0.
5VPPat1MHz~3.
5pFRIOInsulationresistance,inputtooutput(5)VIO=500VatTA=25°C>1012ΩVIO=500Vat100°C≤TA≤125°C>1011VIO=500VatTS=150°C>109Pollutiondegree2Climaticcategory40/125/21UL1577VISOWithstandisolationvoltageVTEST=VISO=4250VRMSor6000VDC,t=60s(qualification),VTEST=1.
2*VISO,t=1s(100%productiontest)4250VRMS(1)Applycreepageandclearancerequirementsaccordingtothespecificequipmentisolationstandardsofanapplication.
Caremustbetakentomaintainthecreepageandclearancedistanceofaboarddesigntoensurethatthemountingpadsoftheisolatorontheprintedcircuitboard(PCB)donotreducethisdistance.
CreepageandclearanceonaPCBbecomeequalincertaincases.
Techniquessuchasinsertinggrooves,ribs,orbothonaPCBareusedtohelpincreasethesespecifications.
(2)Thiscouplerissuitableforsafeelectricalinsulationonlywithinthesafetyratings.
Compliancewiththesafetyratingsmustbeensuredbymeansofsuitableprotectivecircuits.
(3)Testingiscarriedoutinairoroiltodeterminetheintrinsicsurgeimmunityoftheisolationbarrier.
(4)Apparentchargeiselectricaldischargecausedbyapartialdischarge(pd).
(5)Allpinsoneachsideofthebarrieraretiedtogether,creatingatwo-pindevice.
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7Safety-RelatedCertificationsVDEULCertifiedaccordingtoDINVDEV0884-11(VDEV0884-11):2017-01,DINEN60950-1(VDE0805Teil1):2014-08,andDINEN60065(VDE0860):2005-11Recognizedunder1577componentrecognitionandCSAcomponentacceptanceNO5programsReinforcedinsulationSingleprotectionCertificatenumber:40040142Certificateplanned6.
8SafetyLimitingValuesSafetylimiting(1)intendstominimizepotentialdamagetotheisolationbarrieruponfailureofinputoroutputcircuitry.
AfailureoftheI/Ocanallowlowresistancetogroundorthesupplyand,withoutcurrentlimiting,dissipatesufficientpowertooverheatthedieanddamagetheisolationbarrierpotentiallyleadingtosecondarysystemfailures.
PARAMETERTESTCONDITIONSMINTYPMAXUNITISSafetyinput,output,orsupplycurrentRθJA=73.
5°C/W,VDD=5.
5V,TJ=150°C,TA=25°C309mARθJA=73.
5°C/W,VDD=3.
6V,TJ=150°C,TA=25°C472PSSafetyinput,output,ortotalpowerRθJA=73.
5°C/W,TJ=150°C,TA=25°C1700mWTSMaximumsafetytemperature150°C(1)Themaximumsafetytemperature,TS,hasthesamevalueasthemaximumjunctiontemperature,TJ,specifiedforthedevice.
TheISandPSparametersrepresentthesafetycurrentandsafetypower,respectively.
DonotexceedthemaximumlimitsofISandPS.
Theselimitsvarywiththeambienttemperature,TA.
Thejunction-to-airthermalresistance,RθJA,inthe节6.
4tableisthatofadeviceinstalledonahigh-Ktestboardforleadedsurface-mountpackages.
Usetheseequationstocalculatethevalueforeachparameter:TJ=TA+RθJA*P,wherePisthepowerdissipatedinthedevice.
TJ(max)=TS=TA+RθJA*PS,whereTJ(max)isthemaximumjunctiontemperature.
PS=IS*VDDmax,whereVDDmaxisthemaximumlow-sidevoltage.
6.
9ElectricalCharacteristicsminimumandmaximumspecificationsapplyfromTA=–40°Cto+125°C,VDD=3.
0Vto5.
5V,INP=–250mVto+250mV,INN=HGND=0V,andtheexternalcomponentslistedintheTypicalApplicationsection;typicalspecificationsareatTA=25°C,andVDD=3.
3V(unlessotherwisenoted)PARAMETERTESTCONDITIONSMINTYPMAXUNITANALOGINPUTRINSingle-endedinputresistanceINN=HGND19kΩRINDDifferentialinputresistance22IIBInputbiascurrentINP=INN=HGND;IIB=(IIBP+IIBN)/2–41–30–24ATCIIBInputbiascurrentdrift0.
8nA/°CIIOInputoffsetcurrentIIO=|IIBP–IIBN|1.
4nACINSingle-endedinputcapacitanceINN=HGND,fIN=275kHz2pFCINDDifferentialinputcapacitancefIN=275kHz1www.
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cnAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020Copyright2020TexasInstrumentsIncorporatedSubmitDocumentFeedback7ProductFolderLinks:AMC3301minimumandmaximumspecificationsapplyfromTA=–40°Cto+125°C,VDD=3.
0Vto5.
5V,INP=–250mVto+250mV,INN=HGND=0V,andtheexternalcomponentslistedintheTypicalApplicationsection;typicalspecificationsareatTA=25°C,andVDD=3.
3V(unlessotherwisenoted)PARAMETERTESTCONDITIONSMINTYPMAXUNITANALOGOUTPUTNominalgain8.
2VCMoutCommon-modeoutputvoltage1.
391.
441.
49VVCLIPoutClippingdifferentialoutputvoltageVOUT=(VOUTP-VOUTN);|VIN|=|VINP-VINN|>VClipping±2.
49VVFailsafeFailsafedifferentialoutputvoltageVOUT=(VOUTP-VOUTN);VDCDCout≤VDCDCUV,orVHLDOout≤VHLDOUV–2.
57-2.
5VBWOUTOutputbandwidth250334kHzROUTOutputresistanceOnOUTPorOUTN0.
2ΩOutputshort-circuitcurrentOnOUTPorOUTN,sourcingorsinking,INP=INN=HGND,outputsshortedtoeitherGNDorVDD14mACMTICommon-modetransientimmunity|HGND–GND|=2kV85135kV/sACCURACYEGGainerror(1)TA=25°C–0.
2%±0.
04%0.
2%TCEGGainerrordrift(1)–40±640ppm/°CVOSInputoffsetvoltage(1)TA=25°C,INP=INN=HGND–0.
15±0.
020.
15mVTCVOSInputoffsetdrift(1)–1±0.
151uV/°CNonlinearity(1)–0.
04%±0.
002%0.
04%Nonlinearitydrift(1)0.
9ppm/°CSNRSignal-to-noiseratioVIN=0.
5VPP,fIN=1kHz,BW=10kHz,10kHzfilter8085dBVIN=0.
5VPP,fIN=10kHz,BW=100kHz,1MHzfilter6771THDTotalharmonicdistortionVIN=0.
5Vpp,fIN=10kHz,BW=100kHz–85dBOutputnoiseINP=INN=HGND,fIN=0Hz,BW=100kHz300VRMSCMRRCommon-moderejectionratiofIN=0Hz,VCMmin≤VCM≤VCMmax–97dBfIN=10kHz,VCMmin≤VCM≤VCMmax–98PSRRPower-supplyrejectionratioVDDfrom3.
0Vto5.
5V,atdc,inputreferred–109dBINP=INN=HGND,VDDfrom3.
0Vto5.
5V,10kHz/100mVripple,inputreferred–98AMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn8SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC3301minimumandmaximumspecificationsapplyfromTA=–40°Cto+125°C,VDD=3.
0Vto5.
5V,INP=–250mVto+250mV,INN=HGND=0V,andtheexternalcomponentslistedintheTypicalApplicationsection;typicalspecificationsareatTA=25°C,andVDD=3.
3V(unlessotherwisenoted)PARAMETERTESTCONDITIONSMINTYPMAXUNITPOWERSUPPLYIDDLow-sidesupplycurrentnoexternalloadonHLDO27.
540mA1mAexternalloadonHLDO29.
542VDCDCoutDCDCoutputvoltageDCDCouttoHGND3.
13.
54.
65VVDCDCUVDCDCoutputundervoltagedetectionthresholdvoltageDCDCoutputfalling2.
12.
25VVHLDOoutHigh-sideLDOoutputvoltageHLDOtoHGND,upto1mAexternalload33.
23.
4VVHLDOUVHigh-sideLDOoutputundervoltagedetectionthresholdvoltageHLDOoutputfalling2.
42.
6VIHHigh-sidesupplycurrentforauxiliarycircuitryLoadconnectedfromHLDOouttoHGND,non-switching1mAtASAnalogsettlingtimeVDDstepto3.
0V,toOUTPandOUTNvalid,0.
1%settling0.
91.
4ms(1)Thetypicalvalueincludesonestandarddeviation("sigma")atnominaloperatingconditions.
6.
10SwitchingCharacteristicsoveroperatingambienttemperaturerange(unlessotherwisenoted)PARAMETERTESTCONDITIONSMINTYPMAXUNITtrOutputsignalrisetime1.
3stfOutputsignalfalltime1.
3sVINxtoVOUTxsignaldelay(50%-10%)Unfilteredoutput11.
5sVINxtoVOUTxsignaldelay(50%-50%)Unfilteredoutput1.
62.
1sVINxtoVOUTxsignaldelay(50%-90%)Unfilteredoutput2.
53s6.
11TimingDiagram图6-1.
Rise,Fall,andDelayTimeWaveformswww.
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12InsulationCharacteristicsCurves图6-2.
ThermalDeratingCurveforSafety-LimitingCurrentperVDE图6-3.
ThermalDeratingCurveforSafety-LimitingPowerperVDETAupto150°C,stress-voltagefrequency=60Hz,isolationworkingvoltage=1000VRMS,operatinglifetime=1184years图6-4.
ReinforcedIsolationCapacitorLifetimeProjectionAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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13TypicalCharacteristicsatVDD=3.
3V,INP=–250mVto250mV,INN=HGND=0V,andfIN=10kHz(unlessotherwisenoted)图6-5.
InputOffsetVoltageHistogram图6-6.
InputOffsetVoltagevsSupplyVoltage图6-7.
InputOffsetVoltagevsTemperatureVDD1=3.
3V图6-8.
InputOffsetDriftHistogram图6-9.
Common-ModeRejectionRatiovsInputFrequency图6-10.
Common-ModeRejectionRatiovsTemperaturewww.
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InputBiasCurrentvsCommon-ModeInputVoltage图6-12.
InputBiasCurrentvsSupplyVoltage图6-13.
InputBiasCurrentvsTemperature图6-14.
NormalizedGainvsInputFrequency图6-15.
OutputPhasevsInputFrequencyVDD1=3.
3V图6-16.
GainErrorHistogramAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn12SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC3301图6-17.
GainErrorvsSupplyVoltage图6-18.
GainErrorvsTemperatureVDD1=3.
3V图6-19.
GainErrorDriftHistogram图6-20.
OutputVoltagevsInputVoltage图6-21.
NonlinearityvsInputVoltage图6-22.
NonlinearityvsSupplyVoltagewww.
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cnAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020Copyright2020TexasInstrumentsIncorporatedSubmitDocumentFeedback13ProductFolderLinks:AMC3301图6-23.
NonlinearityvsTemperature图6-24.
TotalHarmonicDistortionvsSupplyVoltage图6-25.
TotalHarmonicDistortionvsTemperature图6-26.
Signal-to-NoiseRatiovsInputVoltage图6-27.
Signal-to-NoiseRatiovsSupplyVoltage图6-28.
Signal-to-NoiseRatiovsTemperatureAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn14SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC3301图6-29.
Input-ReferredNoiseDensityvsFrequency图6-30.
Power-SupplyRejectionRatiovsRippleFrequency图6-31.
OutputRiseandFalltimevsSupplyVoltage图6-32.
OutputRiseandFallTimevsTemperature图6-33.
VINtoVOUTSignalDelayvsSupplyVoltage图6-34.
VINtoVOUTSignalDelayvsTemperaturewww.
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cnAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020Copyright2020TexasInstrumentsIncorporatedSubmitDocumentFeedback15ProductFolderLinks:AMC3301图6-35.
OutputCommon-ModeVoltagevsSupplyVoltage图6-36.
OutputCommon-ModeVoltagevsTemperature图6-37.
OutputBandwidthvsSupplyVoltage图6-38.
OutputBandwidthvsTemperature图6-39.
SupplyCurrentvsSupplyVoltage图6-40.
SupplyCurrentvsTemperatureAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn16SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC3301图6-41.
High-SideLDOLineRegulationwww.
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cnAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020Copyright2020TexasInstrumentsIncorporatedSubmitDocumentFeedback17ProductFolderLinks:AMC33017DetailedDescription7.
1OverviewTheAMC3301isafullydifferential,precision,isolatedamplifierwithafullyintegratedDC/DCconverterthatcansupplythedevicefromasingle3.
3-Vor5-Vvoltagesupplyonthelow-side.
Theinputstageofthedeviceconsistsofafullydifferentialamplifierthatdrivesasecond-order,delta-sigma(ΔΣ)modulator.
Themodulatorusesaninternalvoltagereferenceandclockgeneratortoconverttheanaloginputsignaltoadigitalbitstream.
Thedrivers(termedTXin节7.
2)transfertheoutputofthemodulatoracrosstheisolationbarrierthatseparatesthehigh-sideandlow-sidevoltagedomains.
Asshownin节7.
2,thereceivedbitstreamandclockaresynchronizedandprocessedbyafourth-orderanalogfilteronthelow-sideandpresentedasadifferentialoutputofthedeviceThesignalpathisisolatedbyadoublecapacitivesilicondioxide(SiO2)insuationbarrier,whereaspowerisolationusesanon-chiptransformerseparatedbyathin-filmpolymerastheinsulatingmaterial.
7.
2FunctionalBlockDiagram7.
3FeatureDescription7.
3.
1AnalogInputThedifferentialamplifierinputstageoftheAMC3301feedsasecond-order,switched-capacitor,feed-forwardΔΣmodulator.
Thegainofthedifferentialamplifierissetbyinternalprecisionresistorstoafactorof4withadifferentialinputimpedanceof22kΩ.
Themodulatorconvertstheanalogsignalintoabitstreamthatistransferredovertheisolationbarrier,asdescribedin节7.
3.
2.
Therearetworestrictionsontheanaloginputsignals(INPandINN).
First,iftheinputvoltageexceedstherangeHGND–6VtoHLDO_OUT+0.
5V,theinputcurrentmustbelimitedto10mAbecausethedeviceinputelectrostaticdischarge(ESD)diodesturnson.
Inaddition,thelinearityandnoiseperformanceofthedeviceareensuredonlywhentheanaloginputvoltageremainswithinthespecifiedlinearfull-scalerange(FSR)andwithinthespecifiedcommon-modeinputvoltagerange.
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3.
2DataIsolationChannelSignalTransmissionTheAMC3301usesanon-offkeying(OOK)modulationschemetotransmitthemodulatoroutputbitstreamacrossthecapacitiveSiO2-basedisolationbarrier.
图7-1showstheblockdiagramofanisolationchannel.
ThetransmittermodulatesthebitstreamatTXINwithaninternallygenerated,480-MHzcarrierandsendsaburstacrosstheisolationbarriertorepresentadigitaloneandsendsanosignaltorepresentthedigitalzero.
Thereceiverdemodulatesthesignalafteradvancedsignalconditioningandproducestheoutput.
Thesymmetricaldesignofeachisolationchannelimprovesthecommon-modetransientimmunity(CMTI)performanceandreducestheradiatedemissionscausedbythehigh-frequencycarrier.
图7-1.
BlockDiagramofaDataIsolationChannel图7-2showstheconceptoftheOOKscheme.
图7-2.
OOK-BasedModulationSchemewww.
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3.
3AnalogOutputTheAMC3301offersadifferentialanalogoutputcomprisedoftheOUTPandOUTNpins.
Fordifferentialinputvoltages(VINP–VINN)intherangefrom–250mVto250mV,thedeviceprovidesalinearresponsewithanominalgainof8.
2.
Forexample,foradifferentialinputvoltageof250mV,thedifferentialoutputvoltage(VOUTP–VOUTN)is2.
05V.
Atzeroinput(INPshortedtoINN),bothpinsoutputthesamecommon-modeoutputvoltageVCMout,asspecifiedintheElectricalCharacteristicstablein节6.
Forabsolutedifferentialinputvoltagesgreaterthan250mVbutlessthan320mV,thedifferentialoutputvoltagecontinuestoincreaseinmagnitudebutwithreducedlinearityperformance.
TheoutputssaturateatadifferentialoutputvoltageofVCLIPoutasshownin图7-3ifthedifferentialinputvoltageexceedstheVClippingvalue.
图7-3.
AMC3301OutputBehaviorTheAMC3301providesafail-safeoutputthatsimplifiesdiagnosticsonsystemlevel.
Thefail-safeoutputisactivewhentheintegratedDC/DCconverterdoesn'tdelivertherequiredsupplyvoltageonthesecondarysideofthedevice.
图7-4and图7-5illustratethefail-safeoutputoftheAMC3301thatisanegativedifferentialoutputvoltagevaluethatdoesnotoccurundernormaloperatingconditions.
UsethemaximumVFAILSAFEvoltagespecifiedintheElectricalCharacteristicstablein节6asareferencevalueforthefail-safedetectiononsystemlevel.
图7-4.
TypicalNegativeClippingOutputoftheAMC3301AMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn20SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC3301图7-5.
TypicalFailsafeOutputoftheAMC33017.
3.
4IsolatedDC/DCConverterTheAMC3301offersafullyintegratedisolatedDC/DCconverterstagethatincludesfollowingcomponentsillustratedin节7.
2:Low-dropoutregulator(LDO)ontheprimarysidetostabilizethesupplyvoltageVDDthatdrivestheprimarysideoftheconverterPrimaryfull-bridgeinverteranddriversLaminate-based,air-coretransformerforhighimmunitytomagneticfieldsSecondaryfull-bridgerectifierSecondaryLDOtostabilizetheoutputvoltageoftheDC/DCconverterforhighanalogperformanceofthesignalpathTheDC/DCconverterusesaspread-spectrumclockgenerationtechniquetoreducethespectraldensityoftheelectromagneticradiation.
TheresonatorfrequencyissynchronizedtotheoperationoftheΔΣmodulatortominimizetheinterferencewithdatatransmissionandsupportthehighanalogperformanceofthedevice.
ThearchitectureoftheDC/DCconverterisoptimizedtodrivethehigh-sidecircuitryoftheAMC3301andcansourceuptoIHofadditionalDCcurrentforanoptionalauxiliarycircuitsuchasanactivefilter,pre-amplifierorcomparator.
IHisspecifiedintheElectricalCharacteristicstablein节6asaDC,non-switchingcurrent.
7.
3.
5DiagnosticOutputTheopen-drainDIAGpincanbemonitoredtoconfirmthedeviceisoperational,andtheoutputvoltageisvalid.
Duringpower-up,theDIAGpinisactivelyheldlowuntilthehigh-sidesupplyisinregulationandthedeviceoperatesproperly.
DuringnormaloperationtheDIAGpinisinhigh-impedance(HiZ)stateandpulledhighthroughanexternalpull-upresistor.
TheDIAGpinisactivelypulledlowif:Thelow-sidedoesnotreceivedatafromthehigh-side(forexample,becauseofalossofpoweronthehigh-side).
Theamplifieroutputsaredriventonegativefull-scale.
Thehigh-sideDC/DCoutputvoltage(DCDC_OUT)orthehigh-sideLDOoutputvoltage(HLDO_OUT)dropbelowtheirrespectiveundervoltagedetectionthresholds(brown-out).
Inthiscase,thelow-sidemaystillreceivedatafromthehigh-sidebutthedatamaynotbevalid.
Theamplifieroutputsaredriventonegativefull-scale.
Duringnormaloperation,theDIAGpinisinahigh-impedancestate.
ConnecttheDIAGpintoapullupsupplythrougharesistororleaveopenifnotused.
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4DeviceFunctionalModesTheAMC3301isoperationalwhenthepowersupplyVDDisapplied,asspecifiedintheRecommendedOperatingConditionstablein节6.
8ApplicationandImplementationNoteInformationinthefollowingapplicationssectionsisnotpartoftheTIcomponentspecification,andTIdoesnotwarrantitsaccuracyorcompleteness.
TI'scustomersareresponsiblefordeterminingsuitabilityofcomponentsfortheirpurposes.
Customersshouldvalidateandtesttheirdesignimplementationtoconfirmsystemfunctionality.
8.
1ApplicationInformationThelowinputvoltagerange,lownonlinearity,andlowtemperaturedriftmaketheAMC3301ahigh-performancesolutionforindustrialapplicationswhereshunt-basedcurrentsensingwithhighcommon-modevoltagelevelsisrequired.
TheintegratedisolatedDC/DCconverteroffersadditionalflexibilityforplacementoftheshuntandtheAMC3301,enablingsystemlayoutoptimizationandsmallerprintedcircuitboard(PCB)sizecomparingtosolutionsbasedondiscretecomponents.
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2TypicalApplicationIsolatedamplifiersarewidelyusedforshunt-basedcurrentmeasurementsinhigh-voltageapplicationsthatmustbeisolatedfromalow-voltagedomain.
Typicalapplicationsarephasecurrentmeasurementsinmotorandservodrivesorsolarinverters,orDCcurrentmeasurementsattheoutputofapowerfactorcorrection(PFC)stageorDC/DCconverter.
TheAMC3301integratesanisolatedpowersupplyforthehigh-voltagesideandthereforeisparticularlyeasytouseinapplicationsthatdonothaveahigh-sidesupplyreadilyavailableorwhereahigh-sidesupplyisreferencedtoadifferentgroundpotentialthanthesignaltobemeasured.
图8-1showsasimplifiedschematicusingtheAMC3301tomeasurethephasecurrentintheoutputstageofasolarinverter.
Atthislocationinthesystem,thereisnosupplyreadilyavailableforpoweringtheisolatedamplifier.
Theintegratedisolatedpowersupplysolvesthisproblemand,togetherwithitsbipolarinputvoltagerange,makestheAMC3301ideallysuitedforACcurrentsensing.
Inthisexample,theACline-voltageissensedbytheAMC3301onthegrid-sidewherethereisalsonosuitablesupplyavailableforpoweringtheisolatedamplifier.
Theintegratedpowersupply,highinputimpedance,andbipolarinputvoltagerangeoftheAMC3301makesthedeviceideallysuitedforgrid-sideACvoltagesensingapplications.
图8-1.
TheAMC3301inaSolarInverterApplicationwww.
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2.
1DesignRequirements表8-1liststheparametersforthistypicalapplication.
Table8-1.
DesignRequirementsPARAMETERVALUESupplyvoltage3.
3Vor5VVoltagedropacrosstheshuntforalinearresponse(VSHUNT)±250mV(maximum)8.
2.
2DetailedDesignProcedureTheAMC3301requiresasingle3.
3-Vor5-Vsupplyonitslow-side.
Thehigh-sidesupplyisinternallygeneratedbyanintegratedDC/DCconverterasexplainedin节7.
3.
4.
Thegroundreference(HGND)isderivedfromtheterminaloftheshuntresistorthatisconnectedtothenegativeinputoftheAMC3301(INN).
Ifafour-pinshuntisused,theinputsoftheAMC3301areconnectedtotheinnerleadsandHGNDisconnectedtooneoftheoutershuntleads.
Tominimizeoffsetandimproveaccuracy,setthegroundconnectiontoaseparatetracethatconnectsdirectlytotheshuntresistorratherthanshortingHGNDtoINNdirectlyattheinputtothedevice.
See节10formoredetails.
8.
2.
2.
1ShuntResistorSizingUseOhm'sLawtocalculatethevoltagedropacrosstheshuntresistor(VSHUNT)forthedesiredmeasuredcurrent:VSHUNT=I*RSHUNT.
Considerthefollowingtworestrictionstochoosethepropervalueoftheshuntresistor,RSHUNT:Thevoltagedropcausedbythenominalcurrentrangemustnotexceedtherecommendeddifferentialinputvoltagerange:|VSHUNT|≤|VFSR|Thevoltagedropcausedbythemaximumallowedovercurrentmustnotexceedtheinputvoltagethatcausesaclippingoutput:|VSHUNT|≤|VClipping|8.
2.
2.
2InputFilterDesignTIrecommendsplacinganRCfilterinfrontoftheisolatedamplifiertoimprovesignal-to-noiseperformanceofthesignalpath.
Designtheinputfiltersuchthat:Thecutofffrequencyofthefilterisatleastoneorderofmagnitudelowerthanthesamplingfrequency(20MHz)oftheΔΣmodulatorTheinputbiascurrentdoesnotgeneratesignificantvoltagedropacrosstheDCimpedanceoftheinputfilterTheimpedancesmeasuredfromtheanaloginputsareequalFormostapplicationsthestructureshownin图8-2achievesexcellentperformance.
图8-2.
DifferentialInputFilterAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn24SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC3301Forsystemsusingsingle-endedinputADCstoconverttheanalogoutputvoltageintodigital,图8-3showsanexampleofaTLV6001basedsignalconversionandfiltercircuit.
WithR1=R2=R3=R4,theoutputvoltageequals(VOUTP–VOUTN)+0.
5*VREF.
TailorthebandwidthofthisfilterstagetothebandwidthrequirementofthesystemanduseNP0-typecapacitorsforbestperformance.
Formostapplications,R1=R2=R3=R4=10kΩandC1=C2=1000pFyieldsgoodperformance.
图8-3.
ConnectingtheAMC3301OutputtoaSingle-EndedInputADCFormoreinformationonthegeneralproceduretodesignthefilteringanddrivingstagesofsuccessive-approximation-register(SAR)ADCs,see18-Bit,1MSPSDataAcquisitionBlock(DAQ)OptimizedforLowestDistortionandNoisereferenceguideand18-BitDataAcquisitionBlock(DAQ)OptimizedforLowestPowerreferenceguide,availablefordownloadatwww.
ti.
com.
8.
2.
3ApplicationCurveInfrequencyinverterapplications,thepowerswitchesmustbeprotectedincaseofanovercurrentcondition.
Toallowforfastpoweringoffofthesystem,alowdelaycausedbytheisolatedamplifierisrequired.
图8-4showsthetypicalfull-scalestepresponseoftheAMC3301.
ConsiderthedelayoftherequiredwindowcomparatorandtheMCUtocalculatetheoverallresponsetimeofthesystem.
图8-4.
StepResponseoftheAMC3301www.
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3WhattoDoandWhatNottoDoDonotleavetheanaloginputsINPandINNoftheAMC3301unconnected(floating)whenthedeviceispoweredup.
Ifthedeviceinputisleftfloating,theinputbiascurrentmaydrivetheinputstoapositivevaluethatexceedstheoperatingcommon-modeinputvoltageandtheoutputofthedeviceisundetermined.
Connectthehigh-sideground(HGND)toINN,eitherdirectlyorthrougharesistivepath.
ADCcurrentpathbetweenINNandHGNDisrequiredtodefinetheinputcommon-modevoltage.
Takecarenottoexceedtheinputcommon-moderangeasspecifiedintheElectricalCharacteristicstablein节6.
Forbestaccuracy,setthegroundconnectiontoaseparatetracethatconnectsdirectlytotheshuntresistorratherthanshortingHGNDtoINNdirectlyattheinputtothedevice.
See节10formoredetails.
9PowerSupplyRecommendationsTheAMC3301ispoweredfromthelow-sidepowersupply(VDD)withanominalvalueof3.
3V(or5V)±10%.
TIrecommendsalow-ESRdecouplingcapacitorof1nF(C8in图9-1)placedascloseaspossibletotheVDDpin,followedbya1-Fcapacitor(C9)tofilterthispower-supplypath.
Theprimary-sideoftheDC/DCconverterisdecoupledwithalow-ESR100-nFcapacitor(C4)positionedclosetothedevicebetweentheDCDC_INandDCDC_GNDpins.
Usea1-Fcapacitor(C2)todecouplethesecondarysideinadditiontoalow-ESR,1-nFcapacitor(C3)placedascloseaspossibletothedeviceandconnectedtotheDCDC_OUTandDCDC_HGNDpins.
Forthesecondary-sideLDO,uselow-ESRcapacitorsof1-nF(C6),placedascloseaspossibletotheAMC3301,followedbya100-nFdecouplingcapacitor(C5).
Thegroundreferenceforthesecondary-side(HGND)isderivedfromtheterminaloftheshuntresistorwhichisconnectedtothenegativeinput(INN)ofthedevice.
ForbestDCaccuracy,useaseparatetracetomakethisconnectioninsteadofshortingHGNDtoINNdirectlyatthedeviceinput.
Thehigh-sideDC/DCgroundterminal(DCDC_HGND)isshortedtoHGNDdirectlyatthedevicepins.
图9-1.
DecouplingtheAMC3301AMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn26SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC3301CapacitorsmustprovideadequateeffectivecapacitanceundertheapplicableDCbiasconditionstheyexperienceintheapplication.
Multilayerceramiccapacitors(MLCC)typicallyexhibitonlyafractionoftheirnominalcapacitanceunderreal-worldconditionsandthisfactormustbetakenintoconsiderationwhenselectingthesecapacitors.
Thisproblemisespeciallyacuteinlow-profilecapacitors,inwhichthedielectricfieldstrengthishigherthanintallercomponents.
ReputablecapacitormanufacturersprovidecapacitanceversusDCbiascurvesthatgreatlysimplifycomponentselection.
表9-1listscomponentssuitableforusewiththeAMC3301.
Thislistisnotexhaustive.
Othercomponentsmayexistthatareequallysuitable(orbetter),howevertheselistedcomponentshavebeenvalidatedduringthedevelopmentoftheAMC3301.
Table9-1.
RecommendedExternalComponentsDESCRIPTIONPARTNUMBERMANUFACTURERSIZE(EIA,LxW)VDDC81nF±10%,X7R,50V12065C102KAT2AAVX1206,3.
2mmx1.
6mmC91F±10%,X7R,25V12063C105KAT2AAVX1206,3.
2mmx1.
6mmDC/DCCONVERTERC4100nF±10%,X7R,50VC0603C104K5RACAUTOKemet0603,1.
6mmx0.
8mmC31nF±10%,X7R,50VC0603C102K5RACTUKemet0603,1.
6mmx0.
8mmC21F±10%,X7R,25VCGA3E1X7R1E105K080ACTDK0603,1.
6mmx0.
8mmHLDOC1100nF±10%,X7R,50VC0603C104K5RACAUTOKemet0603,1.
6mmx0.
8mmC5100nF±5%,NP0,50VC3216NP01H104J160AATDK1206,3.
2mmx1.
6mmC61nF±10%,X7R,50V12065C102KAT2AAVX1206,3.
2mmx1.
6mmwww.
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cnAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020Copyright2020TexasInstrumentsIncorporatedSubmitDocumentFeedback27ProductFolderLinks:AMC330110Layout10.
1LayoutGuidelines图10-1showsalayoutrecommendationwiththecriticalplacementofthedecouplingcapacitors.
Thesamecomponentreferencedesignatorsareusedasin节9.
DecouplingcapacitorsareplacedascloseaspossibletotheAMC3301supplypins.
Forbestperformance,placetheshuntresistorclosetotheINPandINNinputsoftheAMC3301andkeepthelayoutofbothconnectionssymmetrical.
ToavoidcausingerrorsinthemeasurementbytheinputbiascurrentsoftheAMC3301,connectthehigh-sidegroundpin(HGND)totheIIN-sideoftheshuntresistor.
UseaseparatetraceinthelayouttomakethisconnectiontomaintainequalcurrentsintheIINandINPtraces.
10.
2LayoutExample图10-1.
RecommendedLayoutoftheAMC3301AMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020www.
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cn28SubmitDocumentFeedbackCopyright2020TexasInstrumentsIncorporatedProductFolderLinks:AMC330111DeviceandDocumentationSupport11.
1DeviceSupport11.
1.
1DeviceNomenclatureTexasInstruments,IsolationGlossary11.
2DocumentationSupport11.
2.
1RelatedDocumentationForrelateddocumentation,seethefollowing:TexasInstruments,ISO72xDigitalIsolatorMagnetic-FieldImmunityapplicationreportTexasInstruments,AMC3330Precision,±1-VInput,ReinforcedIsolatedAmplifierdatasheetTexasInstruments,TLV600xLow-Power,Rail-to-RailIn/Out,1-MHzOperationalAmplifierforCost-SensitiveSystemsdatasheetTexasInstruments,18-Bit,1-MSPSDataAcquisitionBlock(DAQ)OptimizedforLowestDistortionandNoisereferenceguideTexasInstruments,18-Bit,1-MSPSDataAcquisitionBlock(DAQ)OptimizedforLowestPowerreferenceguide11.
3ReceivingNotificationofDocumentationUpdatesToreceivenotificationofdocumentationupdates,navigatetothedeviceproductfolderonti.
com.
Intheupperrightcorner,clickonAlertmetoregisterandreceiveaweeklydigestofanyproductinformationthathaschanged.
Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument.
11.
4SupportResourcesTIE2Esupportforumsareanengineer'sgo-tosourceforfast,verifiedanswersanddesignhelp—straightfromtheexperts.
Searchexistinganswersoraskyourownquestiontogetthequickdesignhelpyouneed.
Linkedcontentisprovided"ASIS"bytherespectivecontributors.
TheydonotconstituteTIspecificationsanddonotnecessarilyreflectTI'sviews;seeTI'sTermsofUse.
11.
5TrademarksTIE2EisatrademarkofTexasInstruments.
Allothertrademarksarethepropertyoftheirrespectiveowners.
11.
6ElectrostaticDischargeCautionThisintegratedcircuitcanbedamagedbyESD.
TexasInstrumentsrecommendsthatallintegratedcircuitsbehandledwithappropriateprecautions.
Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.
Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
11.
7GlossaryTIGlossaryThisglossarylistsandexplainsterms,acronyms,anddefinitions.
12Mechanical,Packaging,andOrderableInformationThefollowingpagesincludemechanical,packaging,andorderableinformation.
Thisinformationisthemostcurrentdataavailableforthedesignateddevices.
Thisdataissubjecttochangewithoutnoticeandrevisionofthisdocument.
Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation.
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cnAMC3301ZHCSHK2A–AUGUST2019–REVISEDJULY2020Copyright2020TexasInstrumentsIncorporatedSubmitDocumentFeedback29ProductFolderLinks:AMC3301重要声明和免责声明TI提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保.
这些资源可供使用TI产品进行设计的熟练开发人员使用.
您将独自承担以下全部责任:(1)针对您的应用选择合适的TI产品,(2)设计、验证并测试您的应用,(3)确保您的应用满足相应标准以及任何其他安全、安保或其他要求.
这些资源如有变更,恕不另行通知.
TI授权您仅可将这些资源用于开发本资源所述的使用TI产品的应用.
严禁对这些资源进行其他复制或展示.
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TI提供这些资源并不会扩展或以其他方式更改TI针对TI产品发布的适用的担保或担保免责声明.
IMPORTANTNOTICE邮寄地址:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265Copyright2020,德州仪器(TI)公司PACKAGEOPTIONADDENDUMwww.
ti.
com17-Sep-2020Addendum-Page1PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Leadfinish/Ballmaterial(6)MSLPeakTemp(3)OpTemp(°C)DeviceMarking(4/5)SamplesAMC3301DWEACTIVESOICDWE1640RoHS&GreenNIPDAULevel-3-260C-168HR-40to125AMC3301AMC3301DWERACTIVESOICDWE162000RoHS&GreenNIPDAULevel-3-260C-168HR-40to125AMC3301(1)Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.
Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.
Samplesmayormaynotbeavailable.
OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)RoHS:TIdefines"RoHS"tomeansemiconductorproductsthatarecompliantwiththecurrentEURoHSrequirementsforall10RoHSsubstances,includingtherequirementthatRoHSsubstancedonotexceed0.
1%byweightinhomogeneousmaterials.
Wheredesignedtobesolderedathightemperatures,"RoHS"productsaresuitableforuseinspecifiedlead-freeprocesses.
TImayreferencethesetypesofproductsas"Pb-Free".
RoHSExempt:TIdefines"RoHSExempt"tomeanproductsthatcontainleadbutarecompliantwithEURoHSpursuanttoaspecificEURoHSexemption.
Green:TIdefines"Green"tomeanthecontentofChlorine(Cl)andBromine(Br)basedflameretardantsmeetJS709Blowhalogenrequirementsof<=1000ppmthreshold.
Antimonytrioxidebasedflameretardantsmustalsomeetthe<=1000ppmthresholdrequirement.
(3)MSL,PeakTemp.
-TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
(4)Theremaybeadditionalmarking,whichrelatestothelogo,thelottracecodeinformation,ortheenvironmentalcategoryonthedevice.
(5)MultipleDeviceMarkingswillbeinsideparentheses.
OnlyoneDeviceMarkingcontainedinparenthesesandseparatedbya"~"willappearonadevice.
IfalineisindentedthenitisacontinuationofthepreviouslineandthetwocombinedrepresenttheentireDeviceMarkingforthatdevice.
(6)Leadfinish/Ballmaterial-OrderableDevicesmayhavemultiplematerialfinishoptions.
Finishoptionsareseparatedbyaverticalruledline.
Leadfinish/Ballmaterialvaluesmaywraptotwolinesifthefinishvalueexceedsthemaximumcolumnwidth.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.
TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.
Effortsareunderwaytobetterintegrateinformationfromthirdparties.
TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.
TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
PACKAGEOPTIONADDENDUMwww.
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com17-Sep-2020Addendum-Page2TAPEANDREELINFORMATION*AlldimensionsarenominalDevicePackageTypePackageDrawingPinsSPQReelDiameter(mm)ReelWidthW1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantAMC3301DWERSOICDWE162000330.
016.
410.
7510.
72.
712.
016.
0Q1PACKAGEMATERIALSINFORMATIONwww.
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com2-Aug-2020PackMaterials-Page1*AlldimensionsarenominalDevicePackageTypePackageDrawingPinsSPQLength(mm)Width(mm)Height(mm)AMC3301DWERSOICDWE162000350.
0350.
043.
0PACKAGEMATERIALSINFORMATIONwww.
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com2-Aug-2020PackMaterials-Page2www.
ti.
comPACKAGEOUTLINECTYP10.
639.
972.
65MAX14X1.
2716X0.
510.
312X8.
89TYP0.
330.
100-80.
30.
1(1.
4)0.
25GAGEPLANE1.
270.
40ANOTE310.
510.
1BNOTE47.
67.
44223098/A07/2016SOIC-2.
65mmmaxheightDWE0016ASOICNOTES:1.
Alllineardimensionsareinmillimeters.
Anydimensionsinparenthesisareforreferenceonly.
DimensioningandtolerancingperASMEY14.
5M.
2.
Thisdrawingissubjecttochangewithoutnotice.
3.
Thisdimensiondoesnotincludemoldflash,protrusions,orgateburrs.
Moldflash,protrusions,orgateburrsshallnotexceed0.
15mm,perside.
4.
Thisdimensiondoesnotincludeinterleadflash.
Interleadflashshallnotexceed0.
25mm,perside.
5.
ReferenceJEDECregistrationMS-013.
1160.
25CAB98PIN1IDAREASEATINGPLANE0.
1CSEEDETAILADETAILATYPICALSCALE1.
500www.
ti.
comEXAMPLEBOARDLAYOUT(9.
75)0.
07MAXALLAROUND0.
07MINALLAROUND(9.
3)14X(1.
27)16X(1.
65)16X(0.
6)14X(1.
27)16X(2)16X(0.
6)4223098/A07/2016SOIC-2.
65mmmaxheightDWE0016ASOICSYMMSYMMSEEDETAILS18916SYMMHV/ISOLATIONOPTION8.
1mmCLEARANCE/CREEPAGENOTES:(continued)6.
PublicationIPC-7351mayhavealternatedesigns.
7.
Soldermasktolerancesbetweenandaroundsignalpadscanvarybasedonboardfabricationsite.
METALSOLDERMASKOPENINGNONSOLDERMASKDEFINEDSOLDERMASKDETAILSOPENINGSOLDERMASKMETALSOLDERMASKDEFINEDLANDPATTERNEXAMPLESCALE:4XSYMM18916IPC-7351NOMINAL7.
3mmCLEARANCE/CREEPAGESEEDETAILSwww.
ti.
comEXAMPLESTENCILDESIGN16X(1.
65)16X(0.
6)14X(1.
27)(9.
75)16X(2)16X(0.
6)14X(1.
27)(9.
3)4223098/A07/2016SOIC-2.
65mmmaxheightDWE0016ASOICNOTES:(continued)8.
Lasercuttingapertureswithtrapezoidalwallsandroundedcornersmayofferbetterpasterelease.
IPC-7525mayhavealternatedesignrecommendations.
9.
Boardassemblysitemayhavedifferentrecommendationsforstencildesign.
SYMMSYMM18916HV/ISOLATIONOPTION8.
1mmCLEARANCE/CREEPAGESOLDERPASTEEXAMPLEBASEDON0.
125mmTHICKSTENCILSCALE:4XSYMMSYMM18916IPC-7351NOMINAL7.
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