METALLIZATIONwww.ijinshan.com
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UCC27201A-DIEwww.
ti.
comSLUSB70–AUGUST2012HIGHFREQUENCY,HIGH-SIDE/LOW-SIDEDRIVER1FEATURESDrivesTwoN-ChannelMOSFETsinAPPLICATIONSHigh-Side/Low-SideConfigurationPowerSuppliesforTelecom,Datacom,andMaximumBootVoltageMerchantMarketsMaximumVDDVoltageHalf-BridgeApplicationsandFull-BridgeConvertersOn-ChipRDBootstrapDiodeIsolatedBusArchitectureUnderVoltageLockoutforHigh-SideandLow-SideDriverTwo-SwitchForwardConvertersActive-ClampForwardConvertersHighVoltageSynchronous-BuckConvertersClass-DAudioAmplifiersDESCRIPTIONTheUCC27201AisahighfrequencyN-ChannelMOSFETdriverthatincludesabootstrapdiodeandhigh-side/low-sidedriverwithindependentinputsformaximumcontrolflexibility.
ThisallowsforN-ChannelMOSFETcontrolinhalf-bridge,full-bridge,two-switchforwardandactiveclampforwardconverters.
Thelow-sideandthehigh-sidegatedriversareindependentlycontrolledandmatchedto1-nsbetweentheturn-onandturn-offofeachother.
TheUCC27201AisbasedonthepopularUCC27201drivers,butofferssomeenhancements.
InordertoimproveperformanceinnoisypowersupplyenvironmentstheUCC27201AhasanenhancedESDinputstructureandalsohastheabilitytowithstandamaximumof-18VonitsHSpin.
ORDERINGINFORMATION(1)PACKAGEPRODUCTPACKAGEORDERABLEPARTNUMBERPACKAGEQUANTITYDESIGNATORUCC27201ATDA210UCC27201ATDBaredieingelpack(2)UCC27201ATDA3120(1)Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTIwebsiteatwww.
ti.
com.
(2)ProcessingispertheTexasInstrumentscommercialproductionbaselineandisincompliancewiththeTexasInstrumentsQualityControlSystemineffectatthetimeofmanufacture.
ElectricalscreeningconsistsofDCparametricandfunctionaltestingatroomtemperatureonly.
UnlessotherwisespecifiedbyTexasInstrumentsACperformanceandperformanceovertemperatureisnotwarranted.
VisualInspectionisperformedinaccordancewithMIL-STD-883TestMethod2010ConditionBat75Xminimum.
1Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
PRODUCTIONDATAinformationiscurrentasofpublicationdate.
Copyright2012,TexasInstrumentsIncorporatedProductsconformtospecificationsperthetermsoftheTexasInstrumentsstandardwarranty.
Productionprocessingdoesnotnecessarilyincludetestingofallparameters.
UCC27201A-DIESLUSB70–AUGUST2012www.
ti.
comThisintegratedcircuitcanbedamagedbyESD.
TexasInstrumentsrecommendsthatallintegratedcircuitsbehandledwithappropriateprecautions.
Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.
Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
BAREDIEINFORMATIONBACKSIDEBONDPADBONDPADDIETHICKNESSBACKSIDEFINISHPOTENTIALMETALLIZATIONCOMPOSITIONTHICKNESS10.
5mils.
SiliconwithbackgrindGNDAl-Cu(0.
5%)598nm2SubmitDocumentationFeedbackCopyright2012,TexasInstrumentsIncorporatedUCC27201A-DIEwww.
ti.
comSLUSB70–AUGUST2012Table1.
BondPadCoordinatesinMicrons(1)DESCRIPTIONPADNUMBERXMINYMINXMAXYMAXVDD1167.
581863401.
582007HB2102.
241175.
94246.
241447.
74HO3135629.
82235.
8886.
32HS459.
5862.
82302.
58170.
82HI51180.
8212.
131281.
6312.
93LI61180.
8426.
421281.
6527.
22GND71199.
71245.
871300.
51346.
67GND81199.
71381.
861300.
51482.
66GND91199.
71518.
661300.
51619.
46LO101077.
31908.
91281.
62009.
7(1)SubstrateGND.
Copyright2012,TexasInstrumentsIncorporatedSubmitDocumentationFeedback3PACKAGEOPTIONADDENDUMwww.
ti.
com10-Oct-2013Addendum-Page1PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)OpTemp(°C)DeviceMarking(4/5)SamplesUCC27201ATDA2ACTIVE010TBDCallTIN/AforPkgType0to0UCC27201ATDA3ACTIVE0144TBDCallTIN/AforPkgType0to0(1)Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.
Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.
Samplesmayormaynotbeavailable.
OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.
ti.
com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.
TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.
1%byweightinhomogeneousmaterials.
Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.
ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.
1%byweightinhomogeneousmaterial)(3)MSL,PeakTemp.
--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
(4)Theremaybeadditionalmarking,whichrelatestothelogo,thelottracecodeinformation,ortheenvironmentalcategoryonthedevice.
(5)MultipleDeviceMarkingswillbeinsideparentheses.
OnlyoneDeviceMarkingcontainedinparenthesesandseparatedbya"~"willappearonadevice.
IfalineisindentedthenitisacontinuationofthepreviouslineandthetwocombinedrepresenttheentireDeviceMarkingforthatdevice.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.
TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.
Effortsareunderwaytobetterintegrateinformationfromthirdparties.
TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.
TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
IMPORTANTNOTICETexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46,latestissue,andtodiscontinueanyproductorserviceperJESD48,latestissue.
Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.
Allsemiconductorproducts(alsoreferredtohereinas"components")aresoldsubjecttoTI'stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.
TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI'stermsandconditionsofsaleofsemiconductorproducts.
TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.
Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarilyperformed.
TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers'products.
BuyersareresponsiblefortheirproductsandapplicationsusingTIcomponents.
TominimizetherisksassociatedwithBuyers'productsandapplications,Buyersshouldprovideadequatedesignandoperatingsafeguards.
TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orotherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.
InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyorendorsementthereof.
Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.
ReproductionofsignificantportionsofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalterationandisaccompaniedbyallassociatedwarranties,conditions,limitations,andnotices.
TIisnotresponsibleorliableforsuchaltereddocumentation.
Informationofthirdpartiesmaybesubjecttoadditionalrestrictions.
ResaleofTIcomponentsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatcomponentorservicevoidsallexpressandanyimpliedwarrantiesfortheassociatedTIcomponentorserviceandisanunfairanddeceptivebusinesspractice.
TIisnotresponsibleorliableforanysuchstatements.
Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirementsconcerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybeprovidedbyTI.
Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhichanticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcauseharmandtakeappropriateremedialactions.
BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofanyTIcomponentsinsafety-criticalapplications.
Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.
Withsuchcomponents,TI'sgoalistohelpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsandrequirements.
Nonetheless,suchcomponentsaresubjecttotheseterms.
NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersofthepartieshaveexecutedaspecialagreementspecificallygoverningsuchuse.
OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor"enhancedplastic"aredesignedandintendedforuseinmilitary/aerospaceapplicationsorenvironments.
BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponentswhichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.
TIhasspecificallydesignatedcertaincomponentsasmeetingISO/TS16949requirements,mainlyforautomotiveuse.
Inanycaseofuseofnon-designatedproducts,TIwillnotberesponsibleforanyfailuretomeetISO/TS16949.
ProductsApplicationsAudiowww.
ti.
com/audioAutomotiveandTransportationwww.
ti.
com/automotiveAmplifiersamplifier.
ti.
comCommunicationsandTelecomwww.
ti.
com/communicationsDataConvertersdataconverter.
ti.
comComputersandPeripheralswww.
ti.
com/computersDLPProductswww.
dlp.
comConsumerElectronicswww.
ti.
com/consumer-appsDSPdsp.
ti.
comEnergyandLightingwww.
ti.
com/energyClocksandTimerswww.
ti.
com/clocksIndustrialwww.
ti.
com/industrialInterfaceinterface.
ti.
comMedicalwww.
ti.
com/medicalLogiclogic.
ti.
comSecuritywww.
ti.
com/securityPowerMgmtpower.
ti.
comSpace,AvionicsandDefensewww.
ti.
com/space-avionics-defenseMicrocontrollersmicrocontroller.
ti.
comVideoandImagingwww.
ti.
com/videoRFIDwww.
ti-rfid.
comOMAPApplicationsProcessorswww.
ti.
com/omapTIE2ECommunitye2e.
ti.
comWirelessConnectivitywww.
ti.
com/wirelessconnectivityMailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265Copyright2013,TexasInstrumentsIncorporated
ti.
comSLUSB70–AUGUST2012HIGHFREQUENCY,HIGH-SIDE/LOW-SIDEDRIVER1FEATURESDrivesTwoN-ChannelMOSFETsinAPPLICATIONSHigh-Side/Low-SideConfigurationPowerSuppliesforTelecom,Datacom,andMaximumBootVoltageMerchantMarketsMaximumVDDVoltageHalf-BridgeApplicationsandFull-BridgeConvertersOn-ChipRDBootstrapDiodeIsolatedBusArchitectureUnderVoltageLockoutforHigh-SideandLow-SideDriverTwo-SwitchForwardConvertersActive-ClampForwardConvertersHighVoltageSynchronous-BuckConvertersClass-DAudioAmplifiersDESCRIPTIONTheUCC27201AisahighfrequencyN-ChannelMOSFETdriverthatincludesabootstrapdiodeandhigh-side/low-sidedriverwithindependentinputsformaximumcontrolflexibility.
ThisallowsforN-ChannelMOSFETcontrolinhalf-bridge,full-bridge,two-switchforwardandactiveclampforwardconverters.
Thelow-sideandthehigh-sidegatedriversareindependentlycontrolledandmatchedto1-nsbetweentheturn-onandturn-offofeachother.
TheUCC27201AisbasedonthepopularUCC27201drivers,butofferssomeenhancements.
InordertoimproveperformanceinnoisypowersupplyenvironmentstheUCC27201AhasanenhancedESDinputstructureandalsohastheabilitytowithstandamaximumof-18VonitsHSpin.
ORDERINGINFORMATION(1)PACKAGEPRODUCTPACKAGEORDERABLEPARTNUMBERPACKAGEQUANTITYDESIGNATORUCC27201ATDA210UCC27201ATDBaredieingelpack(2)UCC27201ATDA3120(1)Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTIwebsiteatwww.
ti.
com.
(2)ProcessingispertheTexasInstrumentscommercialproductionbaselineandisincompliancewiththeTexasInstrumentsQualityControlSystemineffectatthetimeofmanufacture.
ElectricalscreeningconsistsofDCparametricandfunctionaltestingatroomtemperatureonly.
UnlessotherwisespecifiedbyTexasInstrumentsACperformanceandperformanceovertemperatureisnotwarranted.
VisualInspectionisperformedinaccordancewithMIL-STD-883TestMethod2010ConditionBat75Xminimum.
1Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
PRODUCTIONDATAinformationiscurrentasofpublicationdate.
Copyright2012,TexasInstrumentsIncorporatedProductsconformtospecificationsperthetermsoftheTexasInstrumentsstandardwarranty.
Productionprocessingdoesnotnecessarilyincludetestingofallparameters.
UCC27201A-DIESLUSB70–AUGUST2012www.
ti.
comThisintegratedcircuitcanbedamagedbyESD.
TexasInstrumentsrecommendsthatallintegratedcircuitsbehandledwithappropriateprecautions.
Failuretoobserveproperhandlingandinstallationprocedurescancausedamage.
ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.
Precisionintegratedcircuitsmaybemoresusceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications.
BAREDIEINFORMATIONBACKSIDEBONDPADBONDPADDIETHICKNESSBACKSIDEFINISHPOTENTIALMETALLIZATIONCOMPOSITIONTHICKNESS10.
5mils.
SiliconwithbackgrindGNDAl-Cu(0.
5%)598nm2SubmitDocumentationFeedbackCopyright2012,TexasInstrumentsIncorporatedUCC27201A-DIEwww.
ti.
comSLUSB70–AUGUST2012Table1.
BondPadCoordinatesinMicrons(1)DESCRIPTIONPADNUMBERXMINYMINXMAXYMAXVDD1167.
581863401.
582007HB2102.
241175.
94246.
241447.
74HO3135629.
82235.
8886.
32HS459.
5862.
82302.
58170.
82HI51180.
8212.
131281.
6312.
93LI61180.
8426.
421281.
6527.
22GND71199.
71245.
871300.
51346.
67GND81199.
71381.
861300.
51482.
66GND91199.
71518.
661300.
51619.
46LO101077.
31908.
91281.
62009.
7(1)SubstrateGND.
Copyright2012,TexasInstrumentsIncorporatedSubmitDocumentationFeedback3PACKAGEOPTIONADDENDUMwww.
ti.
com10-Oct-2013Addendum-Page1PACKAGINGINFORMATIONOrderableDeviceStatus(1)PackageTypePackageDrawingPinsPackageQtyEcoPlan(2)Lead/BallFinishMSLPeakTemp(3)OpTemp(°C)DeviceMarking(4/5)SamplesUCC27201ATDA2ACTIVE010TBDCallTIN/AforPkgType0to0UCC27201ATDA3ACTIVE0144TBDCallTIN/AforPkgType0to0(1)Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.
Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.
Samplesmayormaynotbeavailable.
OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.
ti.
com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.
TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.
1%byweightinhomogeneousmaterials.
Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.
ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.
1%byweightinhomogeneousmaterial)(3)MSL,PeakTemp.
--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
(4)Theremaybeadditionalmarking,whichrelatestothelogo,thelottracecodeinformation,ortheenvironmentalcategoryonthedevice.
(5)MultipleDeviceMarkingswillbeinsideparentheses.
OnlyoneDeviceMarkingcontainedinparenthesesandseparatedbya"~"willappearonadevice.
IfalineisindentedthenitisacontinuationofthepreviouslineandthetwocombinedrepresenttheentireDeviceMarkingforthatdevice.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.
TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.
Effortsareunderwaytobetterintegrateinformationfromthirdparties.
TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.
TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
IMPORTANTNOTICETexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46,latestissue,andtodiscontinueanyproductorserviceperJESD48,latestissue.
Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.
Allsemiconductorproducts(alsoreferredtohereinas"components")aresoldsubjecttoTI'stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.
TIwarrantsperformanceofitscomponentstothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI'stermsandconditionsofsaleofsemiconductorproducts.
TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.
Exceptwheremandatedbyapplicablelaw,testingofallparametersofeachcomponentisnotnecessarilyperformed.
TIassumesnoliabilityforapplicationsassistanceorthedesignofBuyers'products.
BuyersareresponsiblefortheirproductsandapplicationsusingTIcomponents.
TominimizetherisksassociatedwithBuyers'productsandapplications,Buyersshouldprovideadequatedesignandoperatingsafeguards.
TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orotherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIcomponentsorservicesareused.
InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservicesorawarrantyorendorsementthereof.
Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.
ReproductionofsignificantportionsofTIinformationinTIdatabooksordatasheetsispermissibleonlyifreproductioniswithoutalterationandisaccompaniedbyallassociatedwarranties,conditions,limitations,andnotices.
TIisnotresponsibleorliableforsuchaltereddocumentation.
Informationofthirdpartiesmaybesubjecttoadditionalrestrictions.
ResaleofTIcomponentsorserviceswithstatementsdifferentfromorbeyondtheparametersstatedbyTIforthatcomponentorservicevoidsallexpressandanyimpliedwarrantiesfortheassociatedTIcomponentorserviceandisanunfairanddeceptivebusinesspractice.
TIisnotresponsibleorliableforanysuchstatements.
Buyeracknowledgesandagreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryandsafety-relatedrequirementsconcerningitsproducts,andanyuseofTIcomponentsinitsapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybeprovidedbyTI.
Buyerrepresentsandagreesthatithasallthenecessaryexpertisetocreateandimplementsafeguardswhichanticipatedangerousconsequencesoffailures,monitorfailuresandtheirconsequences,lessenthelikelihoodoffailuresthatmightcauseharmandtakeappropriateremedialactions.
BuyerwillfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofanyTIcomponentsinsafety-criticalapplications.
Insomecases,TIcomponentsmaybepromotedspecificallytofacilitatesafety-relatedapplications.
Withsuchcomponents,TI'sgoalistohelpenablecustomerstodesignandcreatetheirownend-productsolutionsthatmeetapplicablefunctionalsafetystandardsandrequirements.
Nonetheless,suchcomponentsaresubjecttotheseterms.
NoTIcomponentsareauthorizedforuseinFDAClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersofthepartieshaveexecutedaspecialagreementspecificallygoverningsuchuse.
OnlythoseTIcomponentswhichTIhasspecificallydesignatedasmilitarygradeor"enhancedplastic"aredesignedandintendedforuseinmilitary/aerospaceapplicationsorenvironments.
BuyeracknowledgesandagreesthatanymilitaryoraerospaceuseofTIcomponentswhichhavenotbeensodesignatedissolelyattheBuyer'srisk,andthatBuyerissolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.
TIhasspecificallydesignatedcertaincomponentsasmeetingISO/TS16949requirements,mainlyforautomotiveuse.
Inanycaseofuseofnon-designatedproducts,TIwillnotberesponsibleforanyfailuretomeetISO/TS16949.
ProductsApplicationsAudiowww.
ti.
com/audioAutomotiveandTransportationwww.
ti.
com/automotiveAmplifiersamplifier.
ti.
comCommunicationsandTelecomwww.
ti.
com/communicationsDataConvertersdataconverter.
ti.
comComputersandPeripheralswww.
ti.
com/computersDLPProductswww.
dlp.
comConsumerElectronicswww.
ti.
com/consumer-appsDSPdsp.
ti.
comEnergyandLightingwww.
ti.
com/energyClocksandTimerswww.
ti.
com/clocksIndustrialwww.
ti.
com/industrialInterfaceinterface.
ti.
comMedicalwww.
ti.
com/medicalLogiclogic.
ti.
comSecuritywww.
ti.
com/securityPowerMgmtpower.
ti.
comSpace,AvionicsandDefensewww.
ti.
com/space-avionics-defenseMicrocontrollersmicrocontroller.
ti.
comVideoandImagingwww.
ti.
com/videoRFIDwww.
ti-rfid.
comOMAPApplicationsProcessorswww.
ti.
com/omapTIE2ECommunitye2e.
ti.
comWirelessConnectivitywww.
ti.
com/wirelessconnectivityMailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265Copyright2013,TexasInstrumentsIncorporated
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最近我们是不是在讨论较多的是关于K12教育的问题，培训机构由于资本的介入确实让家长更为焦虑，对于这样的整改我们还是很支持的。实际上，在云服务器市场中，我们也看到内卷和资本的力量，各大云服务商竞争也是相当激烈，更不用说个人和小公司服务商日子确实不好过。今天有看到UCloud发布的夏季促销活动，直接提前和双十一保价挂钩。这就是说，人家直接在暑假的时候就上线双十一的活动。早年的双十一活动会提前一周到十天...
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