nsddr2内存价格
ddr2内存价格 时间:2021-01-20 阅读:()
ProductsandspecificationsdiscussedhereinaresubjecttochangebyMicronwithoutnotice.
512Mb:x4,x8,x16DDR2SDRAMFeaturesMicronConfidentialandProprietaryPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN12005MicronTechnology,Inc.
Allrightsreserved.
DDR2SDRAMMT47H128M4–32Megx4x4banksMT47H64M8–16Megx8x4banksMT47H32M16–8Megx16x4banksForfunctionalandparametricspecifications,refertotheproductdatasheetonMicron'sWebsite:www.
micron.
comFeaturesFBGAballsuseleadedsolderOptionsMarkingConfiguration–128Megx4(32Megx4x4banks)128M4–64Megx8(16Megx8x4banks)64M8–32Megx16(8Megx16x4banks)32M16FBGApackage(leadedsolder)–84-ballFBGA(12mmx12.
5mm,:B)(10mmx12.
5mm,:D)GCFN–60-ballFBGA(12mmx10mm,:B)(10mmx10mm,:D)GBF6Timing–cycletime–5.
0ns@CL=3(DDR2-400)-5E–3.
75ns@CL=4(DDR2-533)-37E–3.
0ns@CL=5(DDR2-667)-3–3.
0ns@CL=4(DDR2-667)-3E–2.
5ns@CL=6(DDR2-800)-25–2.
5ns@CL=5(DDR2-800)-25EOptions(Continued)MarkingSelfrefresh–StandardNone–Low-PowerLOperatingtemperature–Commercial(0°C≤TC≤85°C)None–Industrial(–40°C≤TC≤95°C;–40°C≤TA≤85°C)ITRevision:A/:B/:DPartNumbersFigure1:512MbDDR2(LeadedSolder)PartNumbersNotes:1.
Notallspeedsandconfigurationsareavailable.
ContactMicronforcurrentrevision.
Package84-Ball12x12.
5FBGA84-Ball10x12.
5FBGA60-Ball12x10FBGA60-Ball10x10FBGAGCFNGBF6ExamplePartNumber:MT47H64M8BT-37EConfiguration128Megx464Megx832Megx16128M464M832M16SpeedGradetCK=5ns,CL=3tCK=3.
75ns,CL=4tCK=3ns,CL=5tCK=3ns,CL=4tCK=2.
5ns,CL=5-5E-37E-3-3E-25E-ConfigurationMT47HPackageSpeedRevisionRevision:A/:B/:D:Low-PowerIndustrialTemperatureLIT{PDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN22005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMFBGAPartMarkingDecoderMicronConfidentialandProprietaryFBGAPartMarkingDecoderDuetospacelimitations,FBGA-packagedcomponentshaveanabbreviatedpartmarkingthatisdifferentfromthepartnumber.
Micron'sFBGAPartMarkingDecoderisavailableatwww.
micron.
com/decoder.
PackageDimensionsFigure2:84-BallFBGAPackage–12mmx12.
5mm(x16,:B)Note:Alldimensionsareinmillimeters.
0.
80±0.
050.
10CCMOLDCOMPOUND:EPOXYNOVALACSOLDERBALLMATERIAL:96.
5%Sn,3%Ag,0.
5%CuSOLDERBALLPAD:0.
33NONSOLDERMASKDEFINEDSUBSTRATEMATERIAL:PLASTICLAMINATE5.
6011.
20BALLA1IDBALLA1BALLA1ID0.
80TYP6.
00±0.
053.
2012.
00±0.
106.
40BALLA9SEATINGPLANE12.
50±0.
106.
25±0.
050.
80TYP84X0.
45CLCLSOLDERBALLDIAMETERREFERSTOPOST-REFLOWCONDITION.
1.
20MAX0.
155±0.
0131.
80±0.
05CTRPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN32005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsMicronConfidentialandProprietaryFigure3:84-BallFBGAPackage–10mmx12.
5mm(x16,:D)Note:Alldimensionsareinmillimeters.
BALLA1ID1.
20MAXBALLA9BALLA1ID0.
80TYP0.
80TYP3.
206.
40BALLA110.
00±0.
105.
00±0.
05SOLDERBALLDIAMETERREFERSTOPOSTREFLOWCONDITION.
THEPRE-REFLOWDIAMETERIS0.
4284X0.
45SOLDERBALLMATERIAL:62%Sn,36%Pb,2%AgOR96.
5%Sn,3%Ag,0.
5%CuNONSOLDERMASKDEFINEDBALLPAD:0.
33MOLDCOMPOUND:EPOXYNOVOLACSUBSTRATEMATERIAL:PLASTICLAMINATE11.
205.
606.
25±0.
0512.
50±0.
10CLCL0.
80±0.
050.
155±0.
013SEATINGPLANEC1.
80±0.
05CTR0.
10CPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN42005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsMicronConfidentialandProprietaryFigure4:60-BallFBGAPackage–12mmx10mm(x4,x8;:B)Note:Alldimensionsareinmillimeters.
0.
80±0.
050.
10CC0.
155±0.
013MOLDCOMPOUND:EPOXYNOVALACSOLDERBALLMATERIAL:96.
5%Sn,3%Ag,0.
5%CuSOLDERBALLPAD:0.
33NONSOLDERMASKDEFINEDSUBSTRATEMATERIAL:PLASTICLAMINATE4.
008.
00BALLA1IDBALLA1BALLA1ID0.
80TYP6.
00±0.
053.
2012.
00±0.
106.
40BALLA9SEATINGPLANE10.
00±0.
105.
00±0.
050.
80TYP60X0.
45CLCL1.
20MAX1.
80±0.
05CTRSOLDERBALLDIAMETERREFERSTOPOST-REFLOWCONDITION.
8000S.
FederalWay,P.
O.
Box6,Boise,ID83707-0006,Tel:208-368-3900prodmktg@micron.
comwww.
micron.
comCustomerCommentLine:800-932-4992Micron,theMlogo,andtheMicronlogoaretrademarksofMicronTechnology,Inc.
Allothertrademarksarethepropertyoftheirrespectiveowners.
Thisdatasheetcontainsminimumandmaximumlimitsspecifiedoverthecompletepowersupplyandtemperaturerangeforproductiondevices.
Althoughconsideredfinal,thesespecificationsaresubjecttochange,asfurtherproductdevelopmentanddatacharacterizationsometimesoccur.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN52005MicronTechnology,Inc.
Allrightsreserved.
MicronConfidentialandProprietaryFigure5:60-BallFBGAPackage–10mmx10mm(x4,x8;:D)Note:Alldimensionsareinmillimeters.
BALLA1ID1.
20MAXMOLDCOMPOUND:EPOXYNOVOLACSUBSTRATEMATERIAL:PLASTICLAMINATESOLDERBALLMATERIAL:62%Sn,36%Pb,2%AgOR96.
5%Sn,3%Ag,0.
5%CuNONSOLDERMASKDEFINEDBALLPAD:0.
33BALLA90.
80TYP10.
00±0.
105.
00±0.
053.
204.
000.
80±0.
050.
155±0.
013SEATINGPLANEC8.
006.
401.
80±0.
05CTR0.
10C60X0.
45SOLDERBALLDIAMETERREFERSTOPOSTREFLOWCONDITION.
THEPRE-REFLOWDIAMETERIS0.
42CL10.
00±0.
10BALLA1BALLA1ID0.
80TYP5.
00±0.
05CL
512Mb:x4,x8,x16DDR2SDRAMFeaturesMicronConfidentialandProprietaryPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN12005MicronTechnology,Inc.
Allrightsreserved.
DDR2SDRAMMT47H128M4–32Megx4x4banksMT47H64M8–16Megx8x4banksMT47H32M16–8Megx16x4banksForfunctionalandparametricspecifications,refertotheproductdatasheetonMicron'sWebsite:www.
micron.
comFeaturesFBGAballsuseleadedsolderOptionsMarkingConfiguration–128Megx4(32Megx4x4banks)128M4–64Megx8(16Megx8x4banks)64M8–32Megx16(8Megx16x4banks)32M16FBGApackage(leadedsolder)–84-ballFBGA(12mmx12.
5mm,:B)(10mmx12.
5mm,:D)GCFN–60-ballFBGA(12mmx10mm,:B)(10mmx10mm,:D)GBF6Timing–cycletime–5.
0ns@CL=3(DDR2-400)-5E–3.
75ns@CL=4(DDR2-533)-37E–3.
0ns@CL=5(DDR2-667)-3–3.
0ns@CL=4(DDR2-667)-3E–2.
5ns@CL=6(DDR2-800)-25–2.
5ns@CL=5(DDR2-800)-25EOptions(Continued)MarkingSelfrefresh–StandardNone–Low-PowerLOperatingtemperature–Commercial(0°C≤TC≤85°C)None–Industrial(–40°C≤TC≤95°C;–40°C≤TA≤85°C)ITRevision:A/:B/:DPartNumbersFigure1:512MbDDR2(LeadedSolder)PartNumbersNotes:1.
Notallspeedsandconfigurationsareavailable.
ContactMicronforcurrentrevision.
Package84-Ball12x12.
5FBGA84-Ball10x12.
5FBGA60-Ball12x10FBGA60-Ball10x10FBGAGCFNGBF6ExamplePartNumber:MT47H64M8BT-37EConfiguration128Megx464Megx832Megx16128M464M832M16SpeedGradetCK=5ns,CL=3tCK=3.
75ns,CL=4tCK=3ns,CL=5tCK=3ns,CL=4tCK=2.
5ns,CL=5-5E-37E-3-3E-25E-ConfigurationMT47HPackageSpeedRevisionRevision:A/:B/:D:Low-PowerIndustrialTemperatureLIT{PDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN22005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMFBGAPartMarkingDecoderMicronConfidentialandProprietaryFBGAPartMarkingDecoderDuetospacelimitations,FBGA-packagedcomponentshaveanabbreviatedpartmarkingthatisdifferentfromthepartnumber.
Micron'sFBGAPartMarkingDecoderisavailableatwww.
micron.
com/decoder.
PackageDimensionsFigure2:84-BallFBGAPackage–12mmx12.
5mm(x16,:B)Note:Alldimensionsareinmillimeters.
0.
80±0.
050.
10CCMOLDCOMPOUND:EPOXYNOVALACSOLDERBALLMATERIAL:96.
5%Sn,3%Ag,0.
5%CuSOLDERBALLPAD:0.
33NONSOLDERMASKDEFINEDSUBSTRATEMATERIAL:PLASTICLAMINATE5.
6011.
20BALLA1IDBALLA1BALLA1ID0.
80TYP6.
00±0.
053.
2012.
00±0.
106.
40BALLA9SEATINGPLANE12.
50±0.
106.
25±0.
050.
80TYP84X0.
45CLCLSOLDERBALLDIAMETERREFERSTOPOST-REFLOWCONDITION.
1.
20MAX0.
155±0.
0131.
80±0.
05CTRPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN32005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsMicronConfidentialandProprietaryFigure3:84-BallFBGAPackage–10mmx12.
5mm(x16,:D)Note:Alldimensionsareinmillimeters.
BALLA1ID1.
20MAXBALLA9BALLA1ID0.
80TYP0.
80TYP3.
206.
40BALLA110.
00±0.
105.
00±0.
05SOLDERBALLDIAMETERREFERSTOPOSTREFLOWCONDITION.
THEPRE-REFLOWDIAMETERIS0.
4284X0.
45SOLDERBALLMATERIAL:62%Sn,36%Pb,2%AgOR96.
5%Sn,3%Ag,0.
5%CuNONSOLDERMASKDEFINEDBALLPAD:0.
33MOLDCOMPOUND:EPOXYNOVOLACSUBSTRATEMATERIAL:PLASTICLAMINATE11.
205.
606.
25±0.
0512.
50±0.
10CLCL0.
80±0.
050.
155±0.
013SEATINGPLANEC1.
80±0.
05CTR0.
10CPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN42005MicronTechnology,Inc.
Allrightsreserved.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsMicronConfidentialandProprietaryFigure4:60-BallFBGAPackage–12mmx10mm(x4,x8;:B)Note:Alldimensionsareinmillimeters.
0.
80±0.
050.
10CC0.
155±0.
013MOLDCOMPOUND:EPOXYNOVALACSOLDERBALLMATERIAL:96.
5%Sn,3%Ag,0.
5%CuSOLDERBALLPAD:0.
33NONSOLDERMASKDEFINEDSUBSTRATEMATERIAL:PLASTICLAMINATE4.
008.
00BALLA1IDBALLA1BALLA1ID0.
80TYP6.
00±0.
053.
2012.
00±0.
106.
40BALLA9SEATINGPLANE10.
00±0.
105.
00±0.
050.
80TYP60X0.
45CLCL1.
20MAX1.
80±0.
05CTRSOLDERBALLDIAMETERREFERSTOPOST-REFLOWCONDITION.
8000S.
FederalWay,P.
O.
Box6,Boise,ID83707-0006,Tel:208-368-3900prodmktg@micron.
comwww.
micron.
comCustomerCommentLine:800-932-4992Micron,theMlogo,andtheMicronlogoaretrademarksofMicronTechnology,Inc.
Allothertrademarksarethepropertyoftheirrespectiveowners.
Thisdatasheetcontainsminimumandmaximumlimitsspecifiedoverthecompletepowersupplyandtemperaturerangeforproductiondevices.
Althoughconsideredfinal,thesespecificationsaresubjecttochange,asfurtherproductdevelopmentanddatacharacterizationsometimesoccur.
512Mb:x4,x8,x16DDR2SDRAMPackageDimensionsPDF:09005aef81ce6bd7,Source:09005aef8117c192MicronTechnology,Inc.
,reservestherighttochangeproductsorspecificationswithoutnotice.
512Mb_lead.
fm-Rev.
C6/06EN52005MicronTechnology,Inc.
Allrightsreserved.
MicronConfidentialandProprietaryFigure5:60-BallFBGAPackage–10mmx10mm(x4,x8;:D)Note:Alldimensionsareinmillimeters.
BALLA1ID1.
20MAXMOLDCOMPOUND:EPOXYNOVOLACSUBSTRATEMATERIAL:PLASTICLAMINATESOLDERBALLMATERIAL:62%Sn,36%Pb,2%AgOR96.
5%Sn,3%Ag,0.
5%CuNONSOLDERMASKDEFINEDBALLPAD:0.
33BALLA90.
80TYP10.
00±0.
105.
00±0.
053.
204.
000.
80±0.
050.
155±0.
013SEATINGPLANEC8.
006.
401.
80±0.
05CTR0.
10C60X0.
45SOLDERBALLDIAMETERREFERSTOPOSTREFLOWCONDITION.
THEPRE-REFLOWDIAMETERIS0.
42CL10.
00±0.
10BALLA1BALLA1ID0.
80TYP5.
00±0.
05CL
Hostodo(年付12美元)，美西斯波坎机房Linux VPS主机66折
Hostodo 商家是比较小众的国外VPS主机商，这不看到商家有推送促销优惠在美国西岸的斯波坎机房还有少部分库存准备通过低价格促销，年付低至12美元Linux VPS主机，且如果是1GB内存方案的可以享受六六折优惠，均是采用KVM架构，且可以支付宝付款。第一、商家优惠码优惠码：spokanessd 1GB+内存方案才可以用到优惠码，其他都是固定的优惠低至年12美元。第二、商家促销这里，我们可以看到...
腾讯云新用户省钱秘笈购买云服务器
目前国内云计算市场竞争异常激烈，尤其是国内的腾讯云、阿里云、景安等商家促销活动一波接一波的进行，对于有需要的用户确实得到不小的实惠。但是这样给予国内的主机商确实是比较大的打击，毕竟这些商家的背景和实例强劲，即便是贴本补贴优惠，也是不怕的。前两年阿里一家各种活动促销，确实在国内市场占据主要的市场地位，腾讯云开始两年没有较大的吸引用户，不过这两年的发展还是比较稳健的。我们很多网友在之前肯定也享受到一些...
wordpress外贸企业主题 wordpress高级全行业大气外贸主题
wordpress高级全行业大气外贸主题，wordpress通用全行业高级外贸企业在线询单自适应主题建站程序，完善的外贸企业建站功能模块 + 高效通用的后台自定义设置，更实用的移动设备特色功能模块 + 更适于欧美国外用户操作体验 大气简洁的网站风格设计 + 高效优化的网站程序结构，更利于Goolge等SEO搜索优化和站点收录排名。点击进入：wordpress高级全行业大气外贸主题主题价格：￥398...
ddr2内存价格为你推荐
-
绿色桌面背景图片什么类的桌面背景图好看？非主流桌面背景图片大家都哪里找的那么个性的电脑壁纸，天玑1000plus和骁龙865哪个好麒麟985处理器和天玑1000处理器哪个更好？滚筒洗衣机和波轮洗衣机哪个好滚筒洗衣机和波轮洗衣机有什么不同等额本息等额本金哪个好等额本金和等额本息的区别哪个好股票软件哪个好请问：免费的模拟炒股软件哪个好？手机炒股软件哪个好免费手机炒股软件哪个好？红茶和绿茶哪个好红茶好还是绿茶好？雅思和托福哪个好考托福、雅思哪个好考？网络机顶盒哪个好什么牌子的网络机顶盒最好